UPC3211GR NEC | Alldatasheet

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BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC3211GR AGC AMPLIFIER FOR DIGITAL CATV RETURN PASS DATA SHEET The mark shows major revised points.Document No. P13564EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan © 1998, 1999

DESCRIPTION

The µPC3211GR is a silicon monolithic integrated circuit designed as AGC amplifier for digital CATV systems. This IC is the AGC amplifier with 55 dB gain control range which is packaged in 20-pin SSOP. The device is able to use for digital QPSK system, therefore it contributes to make design of transmission system simplicity.

FEATURES

  • Wide gain control range 55 dB TYP.
  • Low distortion IM 3 = 57 dBc TYP. @P out = −10 dBm IM2 = 44 dBc TYP. @P out = −10 dBm
  • Supply Voltage 9 V
  • Packaged in 20-pin SSOP suitable for high-density surface mount.

ORDERING INFORMATION

Part Number Package Supplying Form µPC3211GR-E1 20-pin plastic SSOP (225 mil) Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel To order evaluation samples, please contact your local NEC office. (Part number for sample order: µPC3211GR) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.

Data Sheet P13564EJ3V0DS002 µµµµPC3211GR INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (TOP VIEW) BY2 VAGC GND2A GND2B V CC 1 VCC 2 GND2C GND2D GND2E BY3 BY1 AGC IN1 GND1A AGC IN2 GND1B PSAVE PA_BIAS GND3 OUT1 OUT2 Cont. REG TYPICAL APPLICATION RF IN 50-750 MHz RF Return 5-42 MHz PC2799GR µ PC3211GR Bias LPF Digital QPSK Modulator DUAL PLL µ PC1686GV 2nd IF1st IF µ PC2798GR Video Amplifier QAM Demo. &FEC DC-10 MHz A/D µ HPF SAW SAW LPF

Data Sheet P13564EJ3V0DS00 3 µµµµPC3211GR PIN FUNCTIONS Pin No. Pin Name Pin Voltage TYP. (V) Function and Explanation Equivalent Circuit 1 BY2 – Non Connection pin. This pin should be opened. 2 VAGC 0 to 3 Automatic gain control pin. 3 GND2A 0.0 4 GND2B 0.0 Ground pins of differential amplifier. 5V cc1 9.0 Power supply pin of AGC amplifier block. 6V cc2 9.0 Power supply pin of differential amplifier and output block. 7 GND2C 0.0 8 GND2D 0.0 9 GND2E 0.0 Ground pins of differential amplifier. 10 BY3 1.64 Bypass pin of regulator block. 11 OUT2 6.9 12 OUT1 6.9 Signal output pins. This pins feature low-impedance because of its emitter-follower output port. The pin that is not used should be grounded through 50 ohm resistor. REG 11 12 13 GND3 0.0 Ground pin of output block. 14 PA_BIAS 2.45 This is the pin to feed base bias in case of connection to transistor as power amplifier. 15 Psave 9.0 (+5 kΩ ) Power-save pin. Vcc :O N GND : SLEEP The 5 kΩ resistor should be connected between 15 pin and Vcc. 15VCC (9 V) 5 kΩ 14 16 GND1B 0.0 18 GND1A 0.0 Ground pin of AGC amplifier block. 17 AGC IN2 2.43 19 AGC IN1 2.43 Signal input pin. In the case of single input, 17 or 19 pin should be grounded through capacitor. 1719 20 BY1 – Non Connection pin. This pin should be opened.

Data Sheet P13564EJ3V0DS004 µµµµPC3211GR ABSOLUTE MAXIMUM RATINGS (T A = +25°C unless otherwise specified) Parameter Symbol Test Condition Rating Unit Supply Voltage V CC 11.0 V Power-save Voltage V (Psave) Note 1 11.0 V AGC Voltage V AGC 3.6 V Power Dissipation P D TA = +75°C Note 2 500 mW Operating Ambient Temperature T A −40 to +75 °C Storage Temperature T stg −55 to +150 °C Maximum Input Level P in (MAX) +5 dBm Notes 1. Bias to 15 pin through 5 kΩ resistor. 2. Mounted on 50 mm × 50 mm × 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE Parameter Symbol Test Condition MIN. TYP. MAX. Unit Supply Voltage V CC 8.0 9.0 10.0 V Power-save Voltage V (Psave) Note 0 – 10.0 V AGC Control Voltage V AGC 0– 3 . 3 V Operating Ambient Temperature T A −40 +25 +75 °C Input Frequency f in 5 – 100 MHz Maximum Input Level P in (MAX) – – 0 dBm Note Bias to 15 pin through 5 kΩ resistor. ELECTRICAL CHARACTERISTICS (T A = +25°C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 kΩΩΩΩ ), unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current 1 I CC 1 No input signal Note 1 29 38 51 mA Maximum Gain G MAX fin = 65 MHz, Pin = −20 dBm Note 2 14 16 18 dB Gain Control Range GCR f in = 65 MHz, Pin = −20 dBm, VAGC = 0 to 3 V Note 2 47 55 – dB Isolation at sleep mode Isol f in = 65 MHz, Pin = −20 dBm, V (Psave) = 0 V (+5 kΩ ) Note 2 60 65 – dB 2nd order intermodulation distortion IM2 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = −10 dBm Note 2 – –44 –40 dBc 3rd order intermodulation distortion IM3 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = −10 dBm Note 2 – –57 –50 dBc Notes 1. By measurement circuit 1 2. By measurement circuit 2

Data Sheet P13564EJ3V0DS00 5 µµµµPC3211GR STANDARD CHARACTERISTICS (T A = +25°C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 kΩΩΩΩ ), unless otherwise specified) Parameter Symbol Test Conditions Reference Value Unit Maximum Output Power P O (sat) fin = 65 MHz, Pin = −5 dBm Note 1 +5 dBm Circuit Current at Power-save mode ICC (P/S) No input signal, V (Psave) = 0 V (+5 kΩ ) Note 2 3m A Noise Figure NF fin = 65 MHz Note 3 10 dB Output Intercept Point OIP 3 fin1 = 65 MHz, fin2 = 66.8 MHz Note 1 +16 dBm Gain Flatness G flat fin = 5 to 100 MHz, 6 MHz Band width Pin = −20 dBm Note 1 ±0.1 dB Circuit Current 2 I CC 2 No input signal, VAGC = 3 V Note 2 43 mA ON Time t ON fin = 65 MHz, V (Psave) = 0 → 9 V (+5 kΩ ) Note 4 200 µsec OFF Time t OFF fin = 65 MHz, V (Psave) = 9 → 0 V (+5 kΩ ) Note 4 1.7 msec Notes 1. By measurement circuit 2 2. By measurement circuit 1 3. By measurement circuit 3 4. By measurement circuit 4

Data Sheet P13564EJ3V0DS006 µµµµPC3211GR TYPICAL CHARACTERISTICS (T A = +25°C) 24 6 CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Power-save Voltage V(Psave) (V) Circuit Current ICC (mA) 81 0 1 2 no input signal measurement circuit1 246 Power-save Voltage V(Psave) (V) Circuit Current ICC (mA) 81 0 1 2 CIRCUIT CURRENT vs. POWER-SAVE VOLTAGE no input signal VCC = 9 V measurement circuit1 CIRCUIT CURRENT vs. AGC VOLTAGE

35 Circuit Current ICC (mA)

0 0.5 1 1.5 AGC Voltage VAGC (V) 2 2.5 3 3.5 no input signal VCC = 9 V V(Psave) = 9V measurement circuit1 2.5 1.5 0.5 246 14PIN VOLTAGE vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Power-save Voltage V(Psave) (V) 14 pin Voltage V(14) (V) 81 0 1 2 no input signal V AGC = 0 V measurement circuit1 Gain (dB) −20 −30 −40 −50 −60 Gain (dB) GAIN vs. INPUT FREQUENCYGAIN vs. INPUT FREQUENCY 02 04 0 Input Frequency fin (MHz) 60 80 100 02 04 0 Input Frequency fin (MHz) 60 80 100 VCC = V(Psave) = 8 to 10 V P in = −20 dBm VAGC = 0 V measurement circuit2 Pin = −20 dBm VAGC = 3 V measurement circuit2 Vcc = V(Psave) = 8 V Vcc = V(Psave) = 9 V Vcc = V(Psave) = 10 V

Data Sheet P13564EJ3V0DS00 7 µµµµPC3211GR −10 −20 −30 −40 −50 GAIN vs. AGC VOLTAGE Gain (dB) 0 0.5 1 1.5 AGC Voltage VAGC (V) 2 2.5 3.5 3 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V fin = 65 MHz Pin = −20 dBm measurement circuit2 −10 −15 −20 OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) −30 −25 −20 −15 Input Power Pin (dBm) −10 −50 fin = 65 MHz VAGC = 0 V measurement circuit2 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V −20 −40 −60 −80 Output Power Pout (dBm) −30 −25 −20 −15 Input Power Pin (dBm) −10 −50 VCC = 9 V V(Psave) = 9 V f in = 65 MHz measurement circuit2 OUTPUT POWER vs. INPUT POWER VAGC = 0 V VAGC = 1.1 V VAGC = 2.2 V VAGC = 3 V VAGC = 1.5 V Noise Figure NF (dB) 02 0 4 0 Input Frequency fin (MHz) 60 80 100 NOISE FIGURE vs. INPUT FREQUENCY VAGC = 0 V measurement circuit3 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V −10 −20 −30 −40 −50 −60 −70 −80 Gain (dB) GAIN vs. INPUT FREQUENCY 02 04 0 Input Frequency fin (MHz) 60 80 100 VCC = 9 V V(Psave) = 9 V P in = −20 dBm measurement circuit2 VAGC = 0 V VAGC = 1.1 V VAGC = 1.5 V VAGC = 2.2 V VAGC = 3 V VAGC = 3.3 V

Data Sheet P13564EJ3V0DS008 µµµµPC3211GR STANDARD CHARACTERISTICS (T A = +25°C) −10 −20 −30 −40 −50 −60 −70 −80 3rd ORDER INTERMODULATION DISTORTION Output Power Pout / tone (dBm) −40 −30 −20 −10 Input Power Pin (dBm) VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout measurement circuit2 = −13 dBm/tone = −10 dBm(total) −10 −20 −30 −40 −50 −60 −70 −80 2nd ORDER INTERMODULATION DISTORTION Output Power Pout / tone (dBm) −40 −30 −20 −10 Input Power Pin (dBm) VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) measurement circuit2 −20 −10 −20 −30 −40 −50 −60 −70 −15 0 −10 IM3 vs. OUTPUT POWER Output Power Pout/tone (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) measurement circuit2 −20 −10 −20 −30 −40 −50 −60 −15 0 −10 IM2 vs. OUTPUT POWER Output Power Pout/tone (dBm) 2nd Order Intermodulation Distortion IM2 (dBc) VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) measurement circuit2 ON/OFF TIME OF POWERSAVE CENTER 65.000000 MHz SPAN 0 Hz VCC = 9 V fin= 65 MHz Pin = −20 dBm Input Voltage = 9 V measurement circuit4 RBW

3 MHz

7.5 ms REF 0.0 dBm 10 dB/ ATT 10 dB

Data Sheet P13564EJ3V0DS00 9 µµµµPC3211GR THERMAL CHARACTERISTICS (FOR REFERENCE) CIRCUIT CURRENT vs. AMBIENT TEMPERATURE Circuit Current ICC (mA) −50 −25 0 25 50 75 100 Ambient Temperature TA (°C) VAGC = 3 V VAGC = 0 V no input signal VCC = 9 V V(Psave) = 9 V measurement circuit1 GAIN vs. INPUT FREQUENCY Gain (dB) 0 20 40 60 80 100 Input Frequency fin (MHz) TA = −40 °C TA = +25 °C TA = +75 °C VCC = 9 V V(Psave) = 9 V P in = −20 dBm VAGC = 0 V measurement circuit2 GAIN vs. AGC VOLTAGE20 −10 −20 −30 −40 −50 Gain (dB) 0 0.5 1.5 1 2 2.5 3 3.5 AGC Voltage VAGC (V) VCC = 9 V V(Psave) = 9 V f in = 65 MHz Pin = −20 dBm measurement circuit2 TA = −40 °C TA = +25 °C TA = +75 °C

Data Sheet P13564EJ3V0DS0010 µµµµPC3211GR Δ 1: 5 MHz 533.6 Ω −16.4 Ω Δ 2: 40 MHz 515.2 Ω −81.4 Ω Δ 3: 65 MHz 493.7 Ω −123.3 Ω Δ 4: 100 MHz 455.9 Ω −190.3 Ω TA = +25°C VCC = 9 V V (Psave) = 9 V P in = −20 dBm Δ 1: 5 MHz 9.779 Ω −2.306 Ω Δ 2: 40 MHz 10.066 Ω 3.033 Ω Δ 3: 65 MHz 10.574 Ω 5.237 Ω Δ 4: 100 MHz 11.88 Ω 7.805 Ω TA = +25°C VCC = 9 V V (Psave) = 9 V P in = −20 dBm STANDARD CHARACTERISTICS INPUT IMPEDANCE (19 PIN) S11 hp

1 U FS

START .100 000 MHz STOP 100.000 000 MHz OUTPUT IMPEDANCE (11 PIN) S22 1 U FS START 5.000 000 MHz STOP 100.000 000 MHz hp

Data Sheet P13564EJ3V0DS00 11 µµµµPC3211GR MEASUREMENT CIRCUIT 1 0.01 F 100 pF Cont. REG100 pF VAGC VCC µ µ 0.01 Fµ 0.1 Fµ 0.1 Fµ 0.1 Fµ

0.1 F Noteµ

0.1 F 10 kΩ 100 pF AGC IN AGC OUT AGC OUT V(Psave) 5 kΩ 0.01 F µ Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor. MEASUREMENT CIRCUIT 2 0.01 F 100 pF VAGC VCC Cont. SG1 (50 Ω ) MIXPAD SG2 (50 Ω ) REG 10 kΩ V(Psave) Spectrum Analyzer (50 Ω ) 100 pF 5 kΩ 0.01 F 100 pF µ 0.01 Fµ 0.1 Fµ 0.1 Fµ 0.1 Fµ 0.1 Fµ 0.1 Fµ µ Note 1 Note 2 Notes 1. Connect in the case of measurement of IM2/IM3 2. The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor.

Data Sheet P13564EJ3V0DS0012 µµµµPC3211GR MEASUREMENT CIRCUIT 3 Cont. REG 0.01 Fµ 0.01 Fµ 0.1 Fµ 0.1 Fµ 0.1 F 100 pF V(Psave) 10 kΩ 5 kΩ 0.01 F µ 0.1 Fµ 0.1 F Note µ µ 100 pF 100 pF VAGC VCC Noise Source NF METER Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor. MEASUREMENT CIRCUIT 4 Cont. REG 0.01 Fµ 0.01 Fµ 0.1 Fµ 0.1 Fµ 0.1 F 100 pF 10 kΩ 50 Ω 5 kΩ 0.01 F µ 0.1 Fµ 0.1 Fµ µ 100 pF 100 pF VAGC VCC SG1 (50 Ω ) Pulse Generator (9 V, 2.3 msec) Spectrum Analyzer (50 Ω )

Data Sheet P13564EJ3V0DS00 13 µµµµPC3211GR ILLUSTRATION OF THE EVALUATION BOARD FOR MEASUREMENT CIRCUIT V(Psave) VCCVAGC PC3211GRµ 0.1µ 0.1µ 0.1µ 0.01µ0.01µ 100 p 0.1µ0.1µ 0.01µ100 p 10 k 5 k 100 p AGC IN1 OUT 1 OUT 2 Notes 1. 50 × 50 × 1.6 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes

Data Sheet P13564EJ3V0DS0014 µµµµPC3211GR PACKAGE DIMENSIONS

20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)

1.8 MAX. +7˚ –3˚ 0.65 0.10 M 0.15 0.5 ± 0.2 11 0 6.7 ± 0.3 1.5 ± 0.1 0.1 ± 0.1 0.22 +0.10 –0.05 0.575 MAX. 0.15 +0.10 –0.05 6.4 ± 0.2 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.

Data Sheet P13564EJ3V0DS00 15 µµµµPC3211GR RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 3, Exposure limit Note : None IR35-00-3 Time: 40 seconds or less (at 200°C) Count: 3, Exposure limit Note : None VP15-00-3 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Exposure limit Note : None Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of the recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E) .

µµµµPC3211GR

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