UPC311 NEC | Alldatasheet
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PRECISION VOLTAGE COMPARATORS DESCRIPTION FEATURES The uPC311 is a voltage comparator that has + Operate from single 5 V supply input currents more than a hundred times lower * Maximum input current: 250 nA than devices like conventional standard type of 710. * Maximum offset current: 50 nA It is also designed to operate over a wide range of * Fast transient response: 200 ns TYP. supply voltages; from +15 V op amp supplies down to the single 5 V supply used for IC logic. Its output is compatible with HNIL, DTL and TTL as well as MOS circuits. EQUIVALENT CIRCUIT CONNECTION DIAGRAM (Top View) ee — $$$ B BALANCE o- Sagi 3] 1S 0 7 0. BALANCE o e 3 uPC311C/31162 STROBE 6 300\\ 0 + ies —, Re cs pO k GND [s]v+ ( Lb D De lad S| 7 In OUTPUT se oe oil > Or] oS iB BALANCE/ Bue Bs: ond 00 all 'B [6] stroBe 2+ R _ oe ~ for GND That af BG 7807 340° Oro $y- De
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PART NUMBER PACKAGE QUALITY GRADE §uPC311C 8 PIN PLASTIC DIP (300 mil) Standard uPC311G2 8 PIN PLASTIC SOP (225 mil) Standard Please refer to “Quality grade on NEC Semiconductor Devices” (Document number |EI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-19848 (O.D.No, IC-6296C) Date Published March 1993 M Printed in Japan © NEC Corporation 1987
ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) PARAMETER SYMBOL uPC311 UNIT Voltage between V*and'V™ wwe “810188 Differential Input Votage Input Voltage (Note 2) V°-0.3 to V"+0.3 Output to Negative Supply Voltage (Note 3) -0.3 to +40 sipaion [OPHEHIG® Mote a ee ee Power Dissipation Pr G2Package ___(Wetes) ee ee ee Output Short iru Duration ee a Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of i electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output and GND terminal | from external without damage or destructive. Even during the transition period of supply voltage, | power on/off etc., this specification should be kept. | Note 4. Thermal derating factor is -5.0 mV/°C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV/°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. i RECOMMENDED OPERATING CONDITIONS Supply Voltage (V"= GND) pow Ps se TYPICAL CONNECTIONS OFFSET VOLTAGE NULL CIRCUIT STROBING CIRCUIT FAST RESPONSE CIRCUIT ovt (INCREASING INPUT STAGE CURRENT) Vv vt 8 7 5 ane ) 7 ° 3 o—_3 6 o—3 TTL
ELECTRICAL CHARACTERISTICS (Ta = 25°C, Vt =+15 V) CHARACTERISTIC |symBoL] MIN. | TyR | MAX. | UNIT CONDITIONS Input Offset Voltage | vo | | | 0: |_mv_| V*-V"=5t030V, Rs S 50K, Te= 010 70°C Input Offset Current fio | | | a0 | na | V*-V"=8to 30V, Te=0to 70°C Input Bias Current cis | |. | 300 | na | V*-V"=5 to 30V, Ts=0to 70°C Common Mode vi +130 | +138 Input Voltage Range tow | 44s | 147 Vv Output Saturation Voltage | Vou 0.23 v__ | Vt24.5V,V7=0V,Vin S10 mV, lo=8 mA TYPICAL APPLICATION CIRCUIT OPEN COLLECTOR OUTPUT EMITTER FOLLOWER OUTPUT COMPARATOR with HYSTERESIS CIRCUIT yt yt yt Vm Ac ~ A 2Ne ° Wwe 2 NX INPUT © v Z ° © OUTPUT 3 1 a 1 AL b Re Ri Vv Rag Input polarity is reversed when ‘pin (GND) is used as an output Threshold Voltage Vn >Vi> Vo: Low v: . Ri TH (High) = Vaer + Rus R2p Ar (Vau—Vrer) Vinaom & Veet BM (veer —Vou) (Vu > Veet > Vou)
TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) INPUT BIAS CURRENT POWER DISSIPATION 500
600 V+ = +15 V|
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TRANSFER FUNCTION BES ONSE IME FOR VARIOUS INPUT TOTTI ;}- AB
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OUTPUT LIMITING CHARACTERISTICS SUPPLY CURRENT 140 07 6 «120 | | ft oe] 06 5 nan gure || = \\ > Ost Sow — | sures
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“ET ETE TY, Bee 0 5 10 15 0 5 10 15 20 2 30 Vo - Output Voltage ~ V V*— Supply Voltage - V SUPPLY CURRENT LEAKAGE CURRENTS 10 | Vi =415V —E Ee | Se ee Se cal | 8 < a a a aa ; ‘OUTPUT C= ¢ oe 1 = [ee o POSITIVE SUPPLY 2 es es ee
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8PIN PLASTIC DIP (300 mil) 8 5 : 1 4 A K e =| > VOI / a a | 7 rH mi c 8B M o~15° D ac-100-2008,¢ 1) Each lead centerline is located within 0.25 — maximum material condition. [8 | 1.27 max - 2) Item “K" to center of leads when formed —— P 0.9 MIN. 0.035 MIN.
8 PIN PLASTIC SOP (225 mil)
Pi fi Py) i detail of lead end Toe Ee af Ii CO OF 1 4 a H [o) , J . fo. a ia es L o[é[u @ - SBC IMB 0-225B-2 NOTE ‘item! MILLIMETERS INCHES Each lead centerline is located within 0.12 I - maximum material condition. [8 | 0.78 MAX. 0.031 MAX D 0.40°9:32 0.01679.985 : E 0120.1 0.004#0.004 6.5203 0.256#0,012 ra a4 0.173 iJ V4 0.043 Le L 0.60.2 | 0.024°9308 M 0.12 0.005
RECOMMENDED SOLDERING CONDITIONS The following conditions (see tables below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case other soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (IEI-1207). [uPC311G2] Soldering method Soldering conditions Ree on swtbol Infrared ray reflow Peak package's surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process: 1, Exposure limit*: None VPS Peak package's surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), VP15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, WS15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None %: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method". TYPES OF THROUGH HOLE DEVICE [uPC311C] Soldering method Soldering conditions Recommended Wave soldering Solder temperature: 260 °C or below, Flow time : 10 seconds or below
[MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6