UPC1663

UPC1663 RENESAS | Alldatasheet

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT µµ µµPC1663 DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC DATA SHEET Document No. G11024EJ6V0DS00 (6th edition) Date Published September 1999 N CP(K) Printed in Japan The mark shows major revised points. 1987, 1999©

DESCRIPTION

The µPC1663 is a differential input, differential output wideband amplifier IC that uses an high frequency silicon bipolar process. This process improves bandwidth phase characteristics, input noise voltage characteristics, and low power consumption when compared to conventional HF-band differential amplifier ICs. These features make this device suitable as a wideband amplifier in high-definition TVs, high-resolution monitors, broadcasting satellite receivers, and video cameras, as a sense amplifier in high-density CCD and optical pick-up products, or as a pulse amplifier for optical data links. These ICs are manufactured using NEC’s 6 GHz f T NESAT TM I silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.

FEATURES

• Bandwidth and typical gain : 120 MHz @ AVOL = 300

700 MHz @ AVOL = 10

• Phase delay : –85 deg. @ A VOL = 100, 100 MHz
• Input Noise Voltage : 3 µVr.m.s. (RS = 50 Ω , 10 k to 10 MHz)
• Supply Current : 13mA TYP. @ V CC ± = ±6 V
• Gain adjustable from 10 to 300 with external resistor
• No frequency compensation required (Small phase delay at 10 MHz or less)

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPC1663G-E1 8-pin plastic SOP (225 mil) Embossed tape 12 mm wide. Pin 1 is in tape pull-out direction. Qty 2.5 kp/reel. µPC1663GV-E1 8-pin plastic SSOP (175 mil) 1663 Embossed tape 8 mm wide. Pin 1 is in tape pull-out direction. Qty 1 kp/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC1663G, µPC1663GV) Caution µµ µµPC1663C (8-pin plastic DIP) is discontinued.

Data Sheet G11024EJ6V0DS002 µµ µµPC1663 CONNECTION DIAGRAM PIN EXPLANATIONS Pin No. Pin Name In Dual Bias (V) In Single Bias (V) Functions and Applications Internal Equivalent Circuit IN1 IN2 Pin voltage Apply voltage V CC /2 Input pin OUT 1 OUT 2 Pin voltage Apply voltage V CC /2 Output pin 6V CC ±2 to ±6.5 –0.3 to +14 Plus voltage supply pin. This pin should be connected with bypass capacitor to minimize AC impedance. 3V CC GND Minus voltage supply pin. This pin should be connected with bypass capacitor to minimize AC impedance. G 1A G 1B — — Gain adjustment pin. External resistor from 0 to 10 kΩ can be inserted between pin 2 and 7 to determine gain value. (G2A)( G 2B) Note Note 8 1 7 2 Internal circuit constants should be referred to application note. Note µPC1664 which had G2A, G2B of the other gain adjustment pins is discontinued. Pin No. Pin Name 1I N 2 2G 1B 3V CC − 4O U T2 5O U T1 6V CC 7G 1A 8I N 1 (Top View)

Data Sheet G11024EJ6V0DS00 3 µµ µµPC1663 ABSOLUTE MAXIMUM RATINGS (T A = +25 °C) Parameter Symbol µPC1663G µPC1663GV Unit Supply Voltage VCC ± ±7 ±7V Power Dissipation PD 280 (TA = +75°C) Note 280 (TA = +75 °C) Note mW Differential Input Voltage VID ±5 ±5V Input Voltage VICM ±6 (within VCC − to VCC range) (within VCC − to VCC range) V Output Current IO 35 35 mA Operating Ambient Temperature T A −45 to +75 −45 to +75 °C Storage Temperature Tstg −55 to +150 −55 to +150 °C Note Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC ± ±2 ±6 ±6.5 V Output Source Current IO source ——2 0 m A Output Sink Current IO sink —— 2 .5 m A Operating Frequency Range fopt DC — 200 MHz

Data Sheet G11024EJ6V0DS004 µµ µµPC1663 ELECTRICAL CHARACTERISTICS (T A = ++ ++25 °C, VCC ±± ±± = ±± ±±6 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Differential Voltage Gain Gain 1 A vd f = 10 MHz Note 1 200 320 500 — Gain 2 f = 10 MHz Note 2 81 0 1 2 Bandwidth Gain 1 BW R S = 50 Ω (3 dB down point) — 120 — MHz Gain 2 — 700 — Rise Time Gain 1 t r R S = 50 Ω , Vout = 1 VP-P —2 . 9— n s Gain 2 — 2.7 — Propagation Delay Gain 1 t pd R S = 50 Ω , Vout = 1 VP-P —2— n s Gain 2 — 1.2 — Input Resistance Gain 1 R in —4 . 0—k Ω Gain 2 50 180 — Input Capacitance C in —2— p F Input Offset Current IIO —0 . 4 5 . 0 µA Input Bias Current IB —2 04 0 µA Input Noise Voltage Vn R S = 50 Ω , 10 k to 10 MHz — 3 — µVr.m.s. Input Voltage Range VI ±1.0 — — V Common Mode Rejection Ratio Gain 2 CMR V cm = ±1 V, f ≤ 100 kHz 53 94 — dB Supply Voltage Rejection Ratio SVR ΔV = ±0.5 V 50 70 — dB Output Offset Voltage Gain 1 V O(off) VO(off) = |OUT1 – OUT2|— 0 .3 1 .5 V Gain 2 — 0.1 1.0 Output Common Mode Voltage VO(CM) 2.4 2.9 3.4 V Output Voltage Swing VOP-P Single-ended 3.0 4.0 — V P-P Output Sink Current Isink 2.5 3.6 — mA Power Supply Current ICC —1 32 0 m A Notes 1. Gain select pins G1A and G1B are connected. 2. All gain select pins are opened.

Data Sheet G11024EJ6V0DS00 5 µµ µµPC1663 TEST CIRCUIT 50 Ω 1 000 pF µ µ µ 1 kΩ VCC – 0.1 F 50 Ω IN ZS = 50 Ω ZL = 50 Ω OUT 1 000 pF 950 Ω0.1 F 0.1 F VCC + Remark Measurement value at OUT connector should be converced into DUT’s output value at pin 5. Remark Definition and test circuit of each characteristic should be referred to application note ‘Usage of µPC1663 (Document No. G12290E)’. NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) The bypass capacitor should be attached to V CC line. (4) When gain between Gain 1 and Gain 2 is necessary, insert adjustment resistor (0 to 10 kΩΩ ΩΩ ) between G 1A and G1B to determine gain value. (5) Due to high-frequency characteristics, the physical circuit layout is very critical. Supply voltage line bypass, double-sided printed-circuit board, and wide-area ground line layout are necessary for stable operation. Two signal resistors connected to both inputs and two load resistors connected to both outputs should be balanced for stable operation. 50 Ω 50 Ω (150 Ω to ∞) (150 Ω to ∞) VCC + VCC –

Data Sheet G11024EJ6V0DS006 µµ µµPC1663 TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C)

100 K 1 M 10 M 100 M

SINGLE-ENDED VOLTAGE GAIN vs. FREQUENCY Frequency f (Hz) Remark Differential voltage gain is double of single-ended voltage gain. Single-ended Voltage Gain AVS (dB) Gain 1 Gain 2 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.1 RELATIVE VOLTAGE GAIN vs. OPERATING AMBIENT TEMPERATURE Relative Voltage Gain Avr Supply Voltage VCC – (V) Gain 2 Gain 1 1.05 1.00 0.95 0.90 RELATIVE GAIN vs. OPERATING AMBIENT TEMPERATURE Relative Gain Avr –20 0 +50 +80+20 Operating Ambient Temperature TA (°C) Remark Relative voltage gains are described based on gains 1.00 at TA = +25°C, VCC – = –6 V Gain 2 Gain 1 4.0 3.5 3.0 2.5 OUTPUT SINK CURRENT vs. OPERATING AMBIENT TEMPERATURE Output Sink Current IOsink (mA) –20 0 +50 +80+20 Operating Ambient Temperature TA (°C) VCC – = – 6 V VCC –= –6 V VCC – = –6 V

Data Sheet G11024EJ6V0DS00 7 µµ µµPC1663 5.0 4.5 4.0 3.5 3.0 2.5 SINGLE-ENDED OUTPUT VOLTAGE SWING vs. OPERATING AMBIENT TEMPERATURE Single-ended Output Voltage Swing VO (VP-P) –20 0 +50 +80+20 Operating Ambient Temperature TA (°C) 1000 100 10 100 1 k 10 k DIFFERENTIAL VOLTAGE GAIN vs. GAIN ADJUST RESISTANCE Gain Adjust Resistance RADJ (Ω) Differential Voltage Gain AVD Input Bias Current IB ( A)µ –20 0 +50 +80+20 Operating Ambient Temperature TA (°C) INPUT BIAS CURRENT vs. OPERATING AMBIENT TEMPERATURE Supply Current ICC (mA) –20 0 +50 +80+20 Operating Ambient Temperature TA (°C) SUPPLY CURRENT vs. OPERATING AMBIENT TEMPERATURE Supply Current ICC (mA) Supply Voltage VCC – (V) SUPPLY CURRENT vs. SUPPLY VOLTAGE –4 –6 –8 –10 VCC – = –6 V VCC – = –6 V VCC – = –6 V VCC – = –6 V

Data Sheet G11024EJ6V0DS008 µµ µµPC1663 APPLICATION CIRCUIT EXAMPLES EXAMPLE 1 Video Line Driver Circuit Example Input 75 Ω 75 Ω 200 Ω Output 75 Ω 75 Ω COAXIAL 200 Ω –6 V +6 V 0.1 Fµ µ PC1663 2.0 1.0 100 k 1 M 10 M Frequency f (Hz) MAXIMUM OUTPUT VOLTAGE vs. FREQUENCY (VIDEO LINE, SINGLE-ENDED) PHASE CHARACTERISTICS vs. FREQUENCY Maximum Output Voltage VOUT (VP-P)

100 M 1 G

–45 –90 –135 –180

1 M 10 M

Frequency f (Hz) Phase Characteristics (degree) 100 M Gain 1 Gain 2 VCC – = –6 V VCC – = –6 V Remark Differential output voltage is double of single-ended output voltage.

Data Sheet G11024EJ6V0DS00 9 µµ µµPC1663 EXAMPLE 2 VCC single supply application example (Outline) R L R LR 2 PC1663µ R 2 R 1 = R2 R 1 R 1 C VCC EXAMPLE 3 Photo signal detector circuit example (Outline) VCC + L C R S µ (Refer to data sheet of each part number) R S VCC – R L R L PC1663 OUT 1 OUT 2 PIN Photo Diode NDL2102 NDL2104 NDL2208 NDL5200 Caution When signal source impedance for µµ µµPC1663 is critical, FET source follower buffer should be inserted between PIN Photo diode and µµ µµPC1663 input. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Precautions for design in and detail application circuit examples should be referred to application note ‘Usage of µPC1663 (Document No. G12290E)’.

Data Sheet G11024EJ6V0DS0010 µµ µµPC1663 PACKAGE DIMENSIONS

8 PIN PLASTIC SOP (225 mil) (Unit: mm)

M C D F 1 4 M G E B P J K L NS detail of lead end ITEM MILLIMETERS A B C E F G H I J 5.2±0.2 1.27 (T.P.) 1.57±0.2 1.49 6.5±0.3 0.85 MAX. 0.12 1.1±0.2 4.4±0.15 M 0.1±0.1 N P3 °+7° D 0.42 +0.08 −0.07 K 0.17 +0.08 −0.07 L 0.6±0.2 0.10 −3° S H I A NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.

Data Sheet G11024EJ6V0DS00 11 µµ µµPC1663

8 PIN PLASTIC SSOP (175 mil) (Unit: mm)

3.0 MAX. 0.30 +0.10 –0.05 0.10 M 0.65 1.8 MAX. 0.1– 0.10.575 MAX. 0.15 +0.10 –0.05 4.94 – 0.2 0.87 – 0.2 0.5 – 0.2 3.2 – 0.1 0.15 detail of lead end +7° –3° 1.5– 0.1

Data Sheet G11024EJ6V0DS0012 µµ µµPC1663 RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Count: 3, Exposure limit: None Note IR35-00-3 Time: 40 seconds or less (at 200 °C) Count: 3, Exposure limit: None Note VP15-00-3 Wave Soldering Soldering bath temperature: 260 °C or below Time: 10 seconds or less Count: 1, Exposure limit: None Note WS60-00-1 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)

Data Sheet G11024EJ6V0DS00 13 µµ µµPC1663 [MEMO]

Data Sheet G11024EJ6V0DS0014 µµ µµPC1663 [MEMO]

Data Sheet G11024EJ6V0DS00 15 µµ µµPC1663 [MEMO]

µµ µµPC1663 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8