UPC1652G RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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Document No. P12443EJ5V0DS00 (5th edition) Date Published November 1999 N CP(K) Printed in Japan DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC1652G SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER DATA SHEET © 1983, 1999 The mark shows major revised points. DESCRIPTION PIN CONNECTIONS The µPC1652G is a silicon monolithic integrated circuit especially designed as a wide band amplifier convering HF band through UHF band.
FEATURES
- Excellent frequency response : 1 200 MHz TYP. @ 3 dB down
- High power gain : 18 dB TYP. @ f = 500 MHz
- Low voltage operation : V CC = 5 V
- SOP package ABSOLUTE MAXIMUM RATINGS (T A = +25 °°°°C) Supply Voltage V CC 7V Total Power dissipation P D 440 mW Operating Ambient Temperature TA −20 to +75 °C Storage Temperature T stg −40 to +125 °C EQUIVALENT CIRCUIT ELECTRICAL CHARACTERISTICS (T A = +25 °°°°C, VCC = 5 V) CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS Circuit Current I CC 15 20 25 mA No signals Power Gain G P 16 18 20 dB f = 500 MHz Noise Figure NF 5.5 6.5 dB f = 500 MHz Band Width BW 1000 1200 MHz 3 dB down below flat gain Isolation I SO 23 26 dB f = 500 MHz Input Return Loss S11 17 20 dB f = 500 MHz Output Return Loss S22 12 15 dB f = 500 MHz Maximum Output Level P O 3 5 dBm f = 500 MHz NEC cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. 1INPUT 2GND 3GND 4GND
8 GND
5 OUTPUT
Data Sheet P12443EJ5V0DS002 µµµµPC1652G TYPICAL CHARACTERISTICS (T A = +25 °°°°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE VCC -Supply Voltage-V ICC -Circuit Current-mA 1234560 INPUT POWER vs. OUTPUT POWER Pin-Input Power-dBm PO -Output Power-dBm −20 −15 −10 VCC = 5 V f = 500 MHz INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY NOISE FIGURE AND POWER GAIN vs. FREQUENCY f-Frequency-MHz |S11|-Input Return Loss-dB |S22|-Output Return Loss-dB 50 100 200 500 1000 2000 −40 −30 −20 −10 VCC = 5 V |S11| |S12| f-Frequency-MHz G P-Power Gain-dB NF-Noise Figure-dB 50 100 200 500 1000 2000 VCC = 5 V G P NF ISOLATION vs. FREQUENCY f-Frequency-MHz |S12|-Isolation-dB 50 100 200 500 1000 2000 −40 −30 −20 −10 VCC = 5 V Discontinued Product
Data Sheet P12443EJ5V0DS00 3 µµµµPC1652G PACKAGE DIMENSIONS
8 PIN PLASTIC SOP (225 mil) (UNIT: mm)
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 1 4 M detail of lead end 5.2 ± 0.2 1.49 0.85 MAX. 1.27 0.12 1.57 ± 0.2 0.1 ± 0.1 6.5 ± 0.3 0.6 ± 0.2 1.1 ± 0.2 0.10 4.4 ± 0.15 +7˚ –3˚ 0.17 +0.08 –0.070.42 +0.08 –0.07 Discontinued Product
Data Sheet P12443EJ5V0DS004 µµµµPC1652G NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) The bypass capacitor should be attached to the V CC pin. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µµµµPC1652G Soldering Method Soldering Conditions Recommended Condition Symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 3 times, Limited days: no. Note IR35-00-3 (more than 200 °C), Time: 3 times, Limited days: no. Note VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s. Time: 1 time, Limited days: no. Note WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s/pin. Limited days: no. Note Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICON- DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Discontinued Product
Data Sheet P12443EJ5V0DS00 5 µµµµPC1652G [MEMO] Discontinued Product
Data Sheet P12443EJ5V0DS006 µµµµPC1652G [MEMO] Discontinued Product
Data Sheet P12443EJ5V0DS00 7 µµµµPC1652G [MEMO] Discontinued Product
µµµµPC1652G
- The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
- No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
- NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
- Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
- While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
- NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8 Discontinued Product