UPC1251GR-9LG

UPC1251GR-9LG NEC | Alldatasheet

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. SINGLE POWER SUPPLY DUAL OPERATIONAL AMPLIFIERS DATA SHEET Document No. G17929EJ3V0DS00 (3rd edition) Date Published December 2007 NS Printed in Japan 2006, 2007 The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. BIPOLAR ANALOG INTEGRATED CIRCUIT μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG

DESCRIPTION

The μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG are dual operational amplifiers which are designed to operate for a single power supply. It includes features of low-voltage operation, a common-mode input voltage that range from V − (GND) level, an output from a V − (GND) level that is determined by the output stage of class C push- pull circuit and a 50 μA(TYP.) constant current, and a low current consumption. In addition, this can operate at both pos itive and negative power supply and it can be extensively used in various amplifier circuits. The μ PC1251GR-9LG, μ PC1251MP-KAA which expands temperature type is suited for wide operating ambient temperature use, and μ PC358GR-9LG is used for general purposes. A DC parameter selection that is compatible to operational amplifiers is also available. μ PC451GR-9LG, μ PC324GR-9LG which are quad types with the same circuit configuration are also available as series of operational amplifiers.

FEATURES

• Input Offset Voltage ±2 mV (TYP.) • Internal frequency compensation
• Input Offset Current ±5 nA (TYP .) • Output short-circuit protection
• Large Signal Voltage Gain 100000 (TYP.)
• Small Package The mounting area is reduced to 40% or 66% compared to the conventional 8-pin plastic SOP as shown in the following diagram. Package Standard SOP TSSOP TSSOP (2.8 x 2.9) Subject part number μ PC1251G2, μ PC358G2 μ PC1251GR-9LG, μ PC358GR-9LG μ PC1251MP-KAA Outline comparison 5.2 6.5 4.4 6.4 3.15 4.02.8 2.9 (Mounting area ratio) (100%) (60%) (34%) <R> <R>

Data Sheet G17929EJ3V0DS 2 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG

ORDERING INFORMATION

Part Number Selected Grade Package Package Type μ PC1251GR-9LG-E1-A Note Standard 8-pin plastic TSSOP (5.72 mm(225)) • 12 mm wide embossed taping

• Pin 1 on draw-out side μ PC1251GR-9LG-E2-A Note Standard 8-pin plastic TSSOP (5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 at take-up side μ PC1251GR(5)-9LG-E1-A Note DC parameter selection 8-pin plastic TSSOP (5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 on draw-out side μ PC1251GR(5)-9LG-E2-A Note DC parameter selection 8-pin plastic TSSOP (5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 at take-up side μ PC1251MP-KAA-E1-A Note Standard 8-pin plastic TSSOP (2.8 x 2.9) • 12 mm wide embossed taping
• Pin 1 on draw-out side μ PC1251MP-KAA-E2-A Note Standard 8-pin plastic TSSOP (2.8 x 2.9) • 12 mm wide embossed taping
• Pin 1 at take-up side μ PC1251MP(5)-KAA-E1-A Note DC parameter selection 8-pin plastic TSSOP (2.8 x 2.9) • 12 mm wide embossed taping
• Pin 1 on draw-out side μ PC1251MP(5)-KAA-E2-A Note DC parameter selection 8-pin plastic TSSOP (2.8 x 2.9) • 12 mm wide embossed taping
• Pin 1 at take-up side μ PC358GR-9LG-E1-A Note Standard 8-pin plastic TSSOP(5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 on draw-out side μ PC358GR-9LG-E2-A Note Standard 8-pin plastic TSSOP(5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 at take-up side μ PC358GR(5)-9LG-E1-A Note DC parameter selection 8-pin plastic TSSOP(5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 on draw-out side μ PC358GR(5)-9LG-E2-A Note DC parameter selection 8-pin plastic TSSOP(5.72 mm(225)) • 12 mm wide embossed taping
• Pin 1 at take-up side Note Pb-free (This product does not contain Pb in the external electrode and other parts.) <R>

Data Sheet G17929EJ3V0DS 3 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Marking side) Q13 OUT 6 A CC Q3Q2 Q8 Q9 Q12 Q11 Q10 IN I I RSC 6 A 100 A 50 A μμ μ μ OUT1 IN1 OUT2 II2 IN2 II1 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Symbol μ PC1251GR-9LG, μ PC1251GR(5)-9LG μ PC1251MP-KAA, μ PC1251MP(5)-KAA μ PC358GR-9LG, μ PC358GR(5)-9LG Unit Voltage between V+ and V− Note1 V + − V− −0.3 to +32 V Differential Input Voltage V ID ±32 V Input Voltage Note2 VI V− − 0.3 to V− + 32 V Output applied Voltage Note3 VO V− − 0.3 to V+ + 0.3 V Total Power Dissipation Note4 PT 440 mW Output Short Circuit Duration Note5 tS Indefinite s Operating Ambient Temperature T A −40 to +125 −40 to +85 °C Storage Temperature T stg −55 to +150 −55 to +125 °C Note1. Note that reverse connections of the power supply may damage ICs. 2. The input voltage is allowed to input without damage or destruction independent of the magnitude of V+. Either input signal is not allowed to go negative by more than 0.3 V. In addition, the input voltage that operates normally as an operational amplifier is within t he Common Mode Input Voltage range of an electrical characteristic. 3. A range where input voltage can be applied to an output pin externally with no deterioration or damage to the feature (characteristic). The input vo ltage can be applied regardless of the electric supply voltage. This specification which includes the transition state such as electric power ON/OFF must be kept. 4. This is the value of when the gla ss epoxy substrate (size: 100 mm x 100 mm, thickness: 1 mm, 15% of the substrate area where only one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the follo wing conditions for each product, and the derating ratio depending on the operating ambient temperature. μ PC1251GR-9LG: Derate at −5.5 mW/°C when TA > 69°C. (Junction − ambient thermal resistance Rth(J-A) = 183°C/W) μ PC1251MP-KAA: Derate at −4.8 mW/°C when TA > 58°C. (Junction − ambient thermal resistance Rth(J-A) = 208°C/W) μ PC358GR-9LG: Derate at −5.5 mW/°C when TA > 44°C. (Junction − ambient thermal resistance Rth(J-A) = 183°C/W) 5. Short circuits from the output to V + can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4. <R> <R>

Data Sheet G17929EJ3V0DS 4 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Power Supply Voltage (Split) V± ±1.5 ±15 V Power Supply Voltage (V− = GND) V+ +3 +30 V

ELECTRICAL CHARACTERISTICS

μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG (TA = 25°C, V+ = +5 V, V− = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO RS = 0 Ω ±2 ±7 mV Input Offset Current IIO ±5 ±50 nA Input Bias Current Note1 IB 14 250 nA Large Signal Voltage Gain AV R L ≥ 2 kΩ 25000 100000 Circuit Current Note2 ICC R L = ∞, IO = 0 A 0.7 1.2 mA Common Mode Rejection Ratio CMR 65 70 dB Supply Voltage Rejection Ratio SVR 65 100 dB Output Voltage Swing VO R L = 2 kΩ (Connect to GND) 0 V+ − 1.5 V Common Mode lnput Voltage Range VICM 0 V+ − 1.5 V Output Source Current I O SOURCE V IN (+) = +1 V, VIN (−) = 0 V 20 40 mA Output Sink Current IO SINK1 V IN (−) = +1 V, VIN (+) = 0 V 10 20 mA IO SINK2 VIN (−) = +1 V, VIN (+) = 0 V, VO = 200 mV 12 50 μA Channel Separation f = 1 to 20 kHz 120 dB μ PC1251GR(5)-9LG, μ PC1251MP(5)-KAA, μ PC358GR(5)-9LG (TA = 25°C, V+ = +5 V, V− = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO RS = 0 Ω ±2 ±3 mV Input Offset Current IIO ±5 ±50 nA Input Bias Current Note1 IB 14 60 nA Large Signal Voltage Gain AV R L ≥ 2 kΩ 50000 100000 Circuit Current Note2 ICC R L = ∞, IO = 0 A 0.7 0.9 mA Common Mode Rejection Ratio CMR 65 70 dB Supply Voltage Rejection Ratio SVR 65 100 dB Output Voltage Swing VO R L = 2 kΩ (Connect to GND) 0 V+ − 1.5 V Common Mode lnput Voltage Range VICM 0 V+ − 1.4 V Output Source Current I O SOURCE V IN (+) = +1 V, VIN (−) = 0 V 30 40 mA Output Sink Current IO SINK1 V IN (−) = +1 V, VIN (+) = 0 V 15 20 mA IO SINK2 VIN (−) = +1 V, VIN (+) = 0 V, VO = 200 mV 30 50 70 μA Channel Separation f = 1 to 20 kHz 120 dB Notes1. The input bias current flows in the direction where the IC flows out because the first stage is configured with a PNP transistor. 2. This is a current that flows in the internal circuit. This current will flow irrespective of the channel used. <R>

Data Sheet G17929EJ3V0DS 5 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) (Reference value) PT vs. TA ICC vs. V+ PT - Total Power Dissipation - mW 600 500 400 300 200 100 0 20 40 60 80 100 120 140 μ PC358GR-9LG μ PC1251GR-9LG μ PC1251MP-KAA With 100 mm x 100 mm, thickness 1 mm glass epoxy substrate (refer to "ABSOLUTE MAXIMUM RATINGS Note 4" ) TA - Operating Ambient Temperature - °C ICC - Supply Current - mA 0.5 1.5 01 0 2 0 3 0 4 0 RL = ∞ IO = 0 A TA = 25°C 125°C −40°C V+ - Power Supply Voltage - V (V− = GND) VIO vs. V+ V IO vs. TA VIO - Input Offset Voltage - mV 01 0 2 0 3 0 4 0 V+ - Power Supply Voltage - V (V− = GND) VIO - Input Offset Voltage - mV -50 0 50 100 150 V+ = +5 V, V− = GND each 5 samples data TA - Operating Ambient Temperature - °C IB vs. V+ IB vs. TA IB - Input Bias Current - nA 0 1 02 03 04 0 V+ - Power Supply Voltage - V (V− = GND) IB - Input Bias Current - nA -50 0 50 100 150 V+ = +15 V V− = GND TA - Operating Ambient Temperature - °C <R>

Data Sheet G17929EJ3V0DS 6 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG IO SHORT vs. TA AV vs. V+ IO SHORT - Output Short Current - mA -20 0 20 40 60 80 IO SHORT TA - Operating Ambient Temperature - °C AV - Voltage Gain - dB 160 04 0 120 302010 RL = 20 kΩ 2 kΩ V+ - Power Supply Voltage - V (V− = GND) AV, φ vs. f AV - Voltage Gain - dB, φ - Phase Margin - deg. 140 120 100 V = ±15 V± ±7.5 V ±2.5 V ±15 V ±7.5 V ±2.5 V AV φ f - Frequency - Hz VO vs. f CMR vs. f VO - Output Voltage Signal - Vp-p 1 k 3 5 10 k 30 50 100 k 3005001 M +15 V VO VIN 100 kΩ 1 kΩ +7 V 2 kΩ f - Frequency - Hz CMR - Common Mode Rejection Ratio - dB 120 100 1 k 1 M 100 10 k 100 k f - Frequency - Hz 0.1 1 10 100 1 k 10 k 100 k 1 M

Data Sheet G17929EJ3V0DS 7 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG PULSE RESPONSE SR - T A VIN - Input Voltage - V VO - Output Voltage - V 20 40 60 80 RL ≥ 2 kΩ V = +15 V+ t - time - μs SR - Slew Rate - V/ μs -50 0 50 100 V = ±15 V± VO = ±10 V 0.4 0.3 0.2 0.1 SR− SR+ TA - Operating Ambient Temperature - °C VO vs. IO SINK ΔVO vs. IO SOURCE VO - Output Voltage - V 0.01 0.1 0.01 0.1 1 10 100 V+ = +15 V V /2 + V + VO IO SINK TA = −40°C 25°C 125°C IO SINK - Output Sink Current - mA ΔVO - Output Voltage to V+ - V 0.01 0.1 1 10 100 TA = −40°C 25°C 125°C V /2 + V + ΔVO IO SOURCE IO SOURCE - Output Source Current - mA

Data Sheet G17929EJ3V0DS 8 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG PRECAUTIONS FOR USE O The process of unused circuits If there is an unused circuit, the following connection is recommended. Process example of unused circuits R R To potentials within the range of common-mode input voltage (VICM) Remark A midpoint potential of V+ and V− is applied to this example. O Ratings of input/output pin voltage When the voltage of inpu t/output pin exceeds the absolute maximu m rating, it may cause degradation of characteristics or damages, by a conduction of a parasitic diode within an IC. In addition, when the input pin may be lower than V−, or the output pin may exceed the power supply voltage, it is recommended to make a clump circuit by a diode whose forward voltage is low (e.g.: Schottky diode) for protection. O Range of common-mode input voltage When the supply voltage does not m eet the condition of electrical char acteristics, the range of common-mode input voltage is as follows. V ICM (TYP.): V− to V+ − 1.5 (V) (TA = 25°C) During designing, temperature characteristics for use with allowance. O The maximum output voltage The range of the TYP. value of t he maximum output voltage when the supply voltage does not meet the condition of electrical characteristics is as follows: VOm+ (TYP.): V+ − 1.5 (V) (TA = 25°C), VOm− (TYP.) (IO SINK ≤ 50 μA): Approx. V− (V) (TA = 25°C) During designing, consider variations in characteristics and temperature characteristics for use with allowance. In addition, also note t hat the output voltage range (V Om+ − V Om−) becomes narrow when an output current increases. O Operation of output This IC consist an output level of a class C push-pull. Therefore, when a load resi stance is connected to the midpoint potential of V +, V −, a crossover distortion occurs at the transit ion state of output cu rrent flow direction (source, sink). O Handling of ICs When stress is added to ICs due to warpage or bending of a board, the characteristic fluctuates due to piezoelectric effect. Therefore, pay attention to warpage or bending of a board. <R>

Data Sheet G17929EJ3V0DS 9 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG PACKAGE DRAWINGS (Unit: mm) Sy e Sxb M θ L c Lp D HE ZD A E S 0.145 ±0.055 (UNIT:mm) ITEM DIMENSIONS D E HE A 3.15 ±0.15 3.00 ±0.10 4.40 ±0.10 6.40 ±0.20 1.20 MAX. 0.10 ±0.05 1.00 ±0.05 0.25 c θ e x y ZD 0.65 0.10 0.10 0.60 L Lp 0.50 0.60 ±0.15 1.00 ±0.20P8GR-65-9LG 3°+5° −3° NOTE Each lead centerline is located within 0.10mm of its true position at maximum material condition. detail of lead end 8-PIN PLASTIC TSSOP (5.72mm (225)) 0.24b +0.06 −0.05

Data Sheet G17929EJ3V0DS 10 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG M S S S 8-PIN PLASTIC TSSOP(2.8x2.9) detail of lead end ITEM DIMENSIONS D E e A ZD c x y b 2.80 0.08 1.03 MAX. 0.85 4.00 ±0.60 0.525 0.20 0.05 0.03 0.05 ±0.10 0.05 0.145 0.10 0.10 0.22 0.05 Lp 0.37 3° 5° (UNIT:mm) P8MP-65-KAA D A ZD e b y Lp θ HE c x 2.90 3.00 0.20 0.20 NEC Electronics Corporation 2006 S 0.65 0.25 HE E NOTE Each lead centerline is located within 0.10 mm of its true position at maximum material condition. <R>

Data Sheet G17929EJ3V0DS 11 μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG RECOMMENDED SOLDERING CONDITIONS The μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device μ PC1251GR-9LG-A Note, μ PC1251GR(5)-9LG-A Note, μ PC358GR-9LG-A Note, μ PC358GR(5)-9LG-A Note: 8-pin plastic TSSOP (5.72 mm (225)) μ PC1251MP-KAA-A Note, μ PC1251MP(5)-KAA-A Note: 8-pin plastic TSSOP (2.8 x 2.9) Process Conditions Symbol Infrared ray reflow Peak temperature: 260 °C, Reflow time: 60 seconds or less (at 220°C or higher), Maximum number of reflow processes: 3 times. IR60-00-3 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial heating method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (Per each side of the device). P350 Note Pb-free (This product does not contain Pb in external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. REFERENCE DOCUMENTS Document Name Document No. QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM-STANDARD LINEAR IC IEI-1212 REVIEW OF QUALITY AND RELIABILITY HANDBOOK C12769E NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL SYSTEM C10983E <R> <R>

μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG The information in this document is current as of December, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC E lectronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":