UPC1099CX

UPC1099 NEC | Alldatasheet

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HPC1099 is a control IC for the high performance switching power supply equipped with high speed/high sensitivity protec- tion circuit. Control ICs for the high performance switching power supply have 3 series of uPC1099, 1905, 1906. The features of uPC1099 are as follows: Low voltage start up (11 V TYP.) > Suiting for flyback mode converter, DC-DC converter, etc. CONTROL IC FAMILY FOR THE HIGH PERFORMANCE SWITCHING POWER SUPPLY PARTNUMBER | SUPPLY VOLTAGE [START-UP THRESHOLD THRESHOLD OVER CURRENT LATCH VOLTAGE HYSTERESIS PROTECTION MODE #PC1099 26.V 11Vv 3V Pulse by pulse current limiting uPC1905 31V 16.5 V 65V Pulse by pulse current limiting #PC1906 31V 16.5V 65V Shut down and Vcc reset

FEATURES

© Directly drive power MOS FET @ Under voltage lockout circuit incorporated (totem pole circuit adopted) @ Remote control circuit incorporated © Pulse by pulse over current latch circuit incorporated © Error amplifier incorporated © Over voltage latch circuit incorporated PART NUMBER PACKAGE QUALITY GRADE HPC1099CX 16 pin plastic DIP (300 mil) - —— ~ — Standard #PC1099GS 16 pin plastic SOP (300 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number |E1-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. SSeS Document No.I0-3123 (0.D.No.|0-7763 A) Date Published July 1992 M 5 Printed in Japan © NEC Corporation 1992

NEC “PC1099 PIN CONNECTION DIAGRAM (Top View) Over ON/OFF Voltage cr RT VreF Control Latch Voc Collector Output [i] fs] fo] [>] = ey ae ON/OFF Reference Control || Voltage |) Regulator PWM COMPARATOR toe Over Current al Latch LJ LT Ls] Le] Dead Feed Feed 1 In GND Over Emitter Time Back1 Back2 Current Control Latch

NEC “uPC1099 ABSOLUTE MAXIMUM RATING (T, = 25 °C) PARAMETER symMBoL | RATING UNIT Supply Voltage Veco 1 26 Vv — - | an Output Voltage Ve 26 v [ovwucwen SP tewey p10 Total uPcio99cx | Pr (T, = 25°C) 1.000 Pe Dissi | ©, ‘ower Dissipation | uPciog9cs | Pr(T,= 25°C) 694 Operation Temperature Topt —20 to +85 °C Storage Temperature Tstg —55 to +150 °c RECOMMENDED OPERATION REQUIREMENTS Supply Voltage Vec m5 | 18 Oscillation Frequency fosc 50 200 500 OPERATION WAVES VOC(L to H) | vt Ty \\LVH Power supply 1 \\jevec > Voltage / | VR-¥j (L to HI ' \\ ! i! ' ON/OFF | i! 1 Control pin ; VIN(ON) i! 1 7 1 ' VINCOFF) vrH(oCL)* it 1 ' ij it Oct pin | tt ry i 1 roaot My H 1 ' ' tt ' Yor | VTH@CLY vino) | ! H \\ i ' hott \\ 1 OVL pin | robot i | r T | (PHS | ' ' H My 7 «\\FBI,FB20 01 | i il t i hott H uy ! ' 1 LAVA A |: AA AAAAA: AA AMM! iM MMIV V iM Oscillation! f! yor ptt wort teu rit wave fy ry tt Ht cat tpt Pyrg te ou rade ryt fabud wont ort ry ty Prpy le oad peu Paty Peraqrd ott pit ray thang tot btu ryt phepus uo iu ate tt q Output wave

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, Vcc = 15 V, Cr = 470 pF, Rr = 10 kQ, fosc = 200 kHz) BLOCK’ PARAMETER SYMBOL TYP. UNIT CONDITIONS Standby Current loc (sp) 01 mA | Vcco=8V,-10°C <T,< 85°C Gireuit Current at OVL Operation = | Med tec (ovL) 10 mA 3 e F | Circuit Current at Off Mode IcciOFF) 10 mA eo C + a Voc = Ve =24 V, Vp =2.7V, Circuit Current if 10 ‘reas ce no load 88 §| Start-Up Threshold Voltage Vee (LtoH) | os | om | ns | ov | gsge

5383 Threshold Hysteresis Vu 28 32 v :

Output Voltage VREF 48 5 52 vs | Irer=0 $E Output Voltage Temperature vi 4oo | 700 | wvPc | Iper=0,-10°C <T, < 485°C $3 | Coefficient REF/AT " REF TO. 2 eg |—_— a on Fimctcome fe] pe PO Low Level Threshold Voltage VTH (L) High Level Threshold Voltage VTH (H) Dead Time Temperature | | Vp = 0.54 Vrer, DT/sT % Coefficient apti4 | | 3 -10°C< Ty <+85°C 5 _ | Oscillation Frequency | tose 180 200 | 220 kHz _ _ ; 25 | Frequency Line Regulation AMIAV, 1 % | 115V<Vec<24V se ec ci 0a Frequency Temperature Coefficient 4f/4T [2 | 5 | » | 10°C <T, <+85°C & | High Level Output Voltage You Vec-16| | V_| lsource =30mA, Veo = Ve {| ower Volape Reine | w Po [| we Tap 18,0, -22009F Input Voltage at Output ON VIN (ON) 24 26 | 28 v 2 £2 | Input Voltage at Output OFF VIN (OFF) 22 | 24 2.6 v 9 & | Over Voltage Threshold Voltage VtHiovt) | 2.0 24 v_ | -10°c <T,<+85°C 35 . eee | TH (OVE) | . _— 3 & | Input Bias Current IB (Ov) I uA OVL pin voltage = VTH(OVL) O- | Delay to Output ta(OVL) 750 ns Over Current Threshold Voltage VTH(OCL)* | 200 220 mV | -10°C<T,<+85°C € s Over Current Threshold Voltage VTH(OCL)~ | -290 | -210 | -190 | mv | 10°C <Tg< +85°C

pia] —__panmneren——[srnmat [wm [ve [we Tow | oovomions ——] Input Bias Current | Ip (ame) uA | ViIN=2.5V = | High Level Output Voltage Vom* 3.0 v

TYPICAL CHARACTERISTICS (Ta = 25 °C, Vcc = 15 V) Pr—Te UNDER VOLTAGE LOCKOUT SECTION 12 15 Vcc—Pin11 Connection GND~Piné Connection ttf fT re TY io De | Po EP 208 ee ie g 10 A é oof Pa | 8 Pi) A Fs 289, 3 | TS 7a bo Je COO) 9 COS 0 25 50 75 100 125 ) 5 S 10 15 Ta—Ambient Temperature—"C Voc~ Supply Voltage—V lee — Veo lee — Vee (OVL Mode) [Ty be EH Pe | | | of} ET TE “CE rr] t ptt ARE TT Tt eoptt Patt et ty = i EL A oe ann 2 oe eee 5 ty PERE EEEEEE PEE EE ope eo aD 4c 02 ~ 02 | feet | | | HAE EEE EEA Let TT thea CATT TTT Pose oom] 5 10 15 20 25 5 10 15 20 25 Voc—Supply Voltage- V Vec~Supply Voltage—V 160 'oc(sB)— Ta 30 Voutput— VIN As (oo cat | ERE ET peLCLEEETREO ot ET é 100 & 20 SCOOT PC Pett EET TT TT 3 + ie ot

2 He -R Fo

S FE; B“CCCEPE eee j yo ALT TT TT TTT wn ~25 0) 25 50 75 100 IY] Ta—Ambient Temperature —“C ty) 1 2 3 4 5 6

6 Vin—Remote Control Voltage—V

NEC #PC1099 AVREF~Ta fosc — Rr, Cr * PPT] LL LT Pisce ] FE z 500k} i P| i] tire py OORT 2 10 2 TNE P’COOETCLeea 5 wok SSCL ET Pee NANI ra ~ 5 SEEN

3 AO OROPNEN | EES

8 pZeEnnEee | RSE ARTIS rHttE 2 ol & COM STEELE LL or a 2 ks +t LETTE ETT TI ot LE TUUIE LTT ~25 Oo 25 50 75 100 10 20 50 100 200 Ta— Ambient Temperature~°C RT—Timing Resistance—kQ fosc — Ta VTH (tL) YTH(H) — fose 4.0) “HEF TTT.

3 Ke} tt 88 as LEE nen

ffttttTrttr} oz, BEEEEE EEE LIT TT So LCE] Bn i eee esCEEE EEE EEE FT TTT Tl LT TT tT Pet —25 oO 25 50 75 100 10 20 50 100 =200 500 Ta~ Ambient Temperature—°C fosc—Oscillation Frequency — kHz Duty~Vp Duty — Ty “CRETE “COC ") ot Nt TET TT SERRE . FEN » AEE Gees { COCPeREeEE se LITT TNE TTT sft TTT TTT a PELE TTT TTT é E |p NT a po ft CHESS” EEE Pf eT || ae Vp—Dead Time Voltage—V Ta—Ambient Temperature—"C

NEC “PC1099 Vou VoH~ Ta th te— Ta Voc>1 100, T> ISQURCE=30mA. fosc=200 kHz ® IPrltilo te got | | TL TT Jreton eet CT > SE = rest TT | | ee CODD RLEEY sa LLL Bee 88 ons eee a5 g2 of | LL et iho ee CEE fe he = pe BEE EEE EH £s ii 20 02 ee “TT TTT TTT TT ott ttt ttt | LETT TTT ~25 0 25 50 75 100 —25 0 25 50 75 100 Ta—Ambient Temperature—°C Ta—Ambient Temperature —"C Ay-f 3 60 \\

8 P| LING |

3 40) \\ 2 20) IN 0 N 1 10 100 ik 10k 100k 1M 10M f—Frequency—Hz NOTE: When under-shoot voltage at pin 9 occurs, it must be cramped to prevent from wrong operation. See Fig. 1. Fig.1 g t® g = g Oo & 4 ©)+—

16PIN PLASTIC DIP (300 mil) HPC1099CX 16 9 1 8 A K Pp > VU Ee ay ol|=x F ny fh D cB mM o~15" P16C-100-008 : NOTES (Tem | MILLIMETERS INCHES | 1) Each lead centerline is located within 0.25 ——}— —__| maximum material condition. B | 1.27 MAX 0.050 MAX. | i 2) Item “K" to center of leads when forme cow os i parallel. | 0 | 0.50 0.020°3 8 F 1.1 MIN. 0.043 MIN i G 3.5709 0.138709 | | H | 0.51 MIN 0.020 MIN | J 5.08 MAX. 0.200 MAX. i L 6.5 0.256 mM 0.25 8:88 0.010 48:88 N 0.25 0.01 P 1.1 MIN | 0.043 MIN

NEC “uPC1099 16PIN PLASTIC SOP (300 mil) HPC1099GS 16 9 FPARRAREARB HAA OAR OAR OA OA . Coppa HHAHBRBEREESE 1 8 A H [o] i —— J a af Ey wf w +L L Cc B DLV @) P16GM-50-3008-1 NOTE ITEM MILLIMETERS INCHES Each lead centerline is located within 0.12 | | ee F 1.8 MAX. 0.071 MAX 0.303720 hoa | 5.6 0.220 J 1.1 0.043 0.6°°? 0.024°8:388 [| 0.12 0.005

NEC “uPC1099 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be set when soldering this product, Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207), uPC1099GS Soldering process Soldering conditions Symbol Infrared ray reflow Peak package's surface temperature: 230°C or below, 1R30-00-1 Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 1, Exposure limit”: None VPS Peak package's surface temperature : 215 °C or below, VP15-00-1 Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 1, Exposure limit": None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less, Note: Do not apply more than a single process at once, except for “Partial heating method”, TYPES OF THROUGH HOLE MOUNT DEVICE éPC1099CX Soldering process Soldering conditions Symbol Wave soldering Solder temperature : 260 °C or below, Flow time: 10 seconds or below i

NEC #PC1099 ee ES (MEMO) No part of this document may be copied or reproduced in any form or by any means without the prior written i consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. ' NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual pro- | perty rights of third parties by or arising from use of a device described herein or any other liability arising from | use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or i other intellectual property rights of NEC Corporation or others. i The devices listed in this document are not suitable for use in the field where very high reliability is required including, but not limited to, aerospace equipment, submarine cables, nuclear reactor contro! systems and life support systems. If customers intend to use NEC devices for above applications or those intend to use “Standard” quality grade NEC devices for the application not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anti- crime systems, etc.