UPB588G

UPB1505GR NEC | Alldatasheet

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Technical content

© 1996,1999 DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1505GR

DESCRIPTION

µPB1505GR is a silicon prescaler IC operating up to 3.0 GHz and divided by 256, 128, 64. Due to 3.0 GHz operation and high division, this IC can contribute to produce BS/CS tuners with kit-use of 17K series DTS controller or standard CMOS PLL IC. The package is 8 pin plastic SOP suitable for surface mounting. This IC is manufactured using NEC’s 20 GHz f T NESAT  III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect the chips from external pollution and prevent corrosion/ migration. Thus, this IC has with excellent performance, uniformity and reliability.

FEATURES

• High toggle-frequency : 0.5 GHz to 3.0 GHz
• Low power-consumption : 14 mA TYP. at 5 V
• High divide-ratio : ÷256, ÷128, ÷64
• High input-sensitivity : –14 to +10 dBm @ 1.0 GHz to 2.7 GHz
• Wide output-swing : 1.6 Vp-p (CL = 8 pF load)

ORDERING INFORMATION

3.0 GHz PRESCALER DIVIDED BY 256, 128, 64

PART NUMBER PACKAGE SUPPLYING FORM µPB1505GR-E1 8 pin plastic SOP Embossed tape 12 mm wide. QTY 2.5 k/reel (225 mil) Pin 1 is in tape pull-out direction. Document No. P10872EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan Remarks To order evaluation samples, please contact your local NEC sales office. (Order number : µPB1505GR) PIN ASSIGNMENT (Top View) Caution electro-static sensitive devices IN V CC SW1 OUT IN GND SW2 GND The mark shows major revised points. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.

µPB1505GR Data Sheet P10872EJ3V0DS00 PIN NO. SYMBOL ASSIGNMENT FUNCTIONS AND EXPLANATION Input frequency from an external VCO output. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Supply voltage 5.0±0.5 V for operation. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. Divided ratio control can be governed by following input data to these pins. This frequency output can be interfaced to CMOS PLL. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. This pin must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) This pin must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance.

1 IN Frequency input

3 SW1 Divided ratio

6 SW2 Divided ratio

4 OUT Divided frequency

5 GND Ground pin

8 IN Frequency-input

FEATURES PRODUCT I CC fin VCC PACKAGE PIN ASSIGNMENTNUMBER (mA) (GHz) (V) 2.5 GHz / ÷512, ÷256 µPB586G 28 0.5 to 2.5 5 8 pin SOP 2.5 GHz / ÷128, ÷64 µPB588G 26 0.5 to 2.5 5 8 pin SOP 3.0 GHz / ÷256, ÷128, ÷64 µPB1505GR 14 0.5 to 3.0 5 8 pin SOP Typical of prescaler NEC original INTERNAL BLOCK DIAGRAM 1 / 64 1 / 2 1 / 2 Buff. 365, 7 GND SW1 SW2 INPUT BYPASS VCC

4 OUTPUT

Notice Typical performance. Please refer to Electrical Characteristics in detail. To know the associated products, please refer to their latest data sheets. PIN DESCRIPTIONS H L SW2 SW1 1/64 1/128 HL

µPB1505GR Data Sheet P10872EJ3V0DS00 ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING UNIT CONDITIONS Supply voltage V CC –0.5 to +6 V T A = +25 °C Input voltage V IN –0.5 to VCC +0.5 V T A = +25 °C Power dissipation P D 250 mW Mounted on 50 × 50 × 1.6 mm double copper clad epoxy glass PWB (TA = +85 °C) Operating temperature T opt –40 to +85 °C Storage temperature T stg –55 to +150 °C PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage V CC 4.5 5.0 5.5 V Operating temperature T opt –40 +25 +85 °C RECOMMENDED OPERATING RANGE ELECTRICAL CHARACTERISTICS (T A = –40 to +85 °C, VCC = 4.5 to 5.5 V) PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS Circuit current I CC 9.0 14.0 19.5 mA No input signal Upper response frequency 1 f in(U)1 3.0 GHz P in = –10 to +10 dBm Upper response frequency 2 f in(U)2 2.7 GHz P in = –14 to –10 dBm Lower response frequency 1 f in(L)1 0.5 GHz P in = –10 to +8 dBm Lower response frequency 2 f in(L)2 1.0 GHz P in = –14 to –10 dBm, +8 to +10 dBm Input sensitivity 1 P in1 –10 +8 dBm f in = 0.5 to 1.0 GHz Input sensitivity 2 P in2 –14 +10 dBm f in = 1.0 to 2.7 GHz Input sensitivity 3 P in3 –10 +10 dBm f in = 2.7 to 3.0 GHz Output Swing V OUT 1.3 1.6 V P-P C L = 8 pF SW1 input voltage (H) V IH1 VCC VCC VCC V SW1 input voltage (L) V IL1 OPEN OPEN OPEN V SW2 input voltage (H) V IH2 VCC VCC VCC V SW2 input voltage (L) V IL2 OPEN OPEN OPEN V

µPB1505GR Data Sheet P10872EJ3V0DS00 TEST CIRCUIT ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD KB-1505 A B IN OUT VCC SW1 SW2 No. Value C1 to C4 1 000 pF C5 5 pF A, B shorting chip Note : (*1)50 × 50 × 0.4 mm double copper clad polyimide board (*2)Back side : GND pattern (*3)Solder plated on pattern (*4) : Through holes (*5) pattern should be removed on this testing. IN VCC SW1 OUT IN GND SW2 GND 1 000 pF 50 Ω S.G. 1 000 pF VCC = +5.0 V ±10 % 1 000 pF 5 pF 1 MΩ MONITOR 3 pF 1 000 pF C 3 C 2 C 5 C 4C 1 OSCILLOSCOPE H L SW2 SW1 1/64 1/128 HL Divided Ratio Control COMPONENT LIST

µPB1505GR Data Sheet P10872EJ3V0DS00 TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE VCC – Supply Voltage – V ICC – Circuit Current – mA OUTPUT SWING vs. FREQUENCY f – Input Frequency – GHz VOUT – Output Swing – VP-P 1.0 0.2 OUTPUT POWER vs. FREQUENCY f – Input Frequency – GHz PO – Output Power Level – dBm –14 OUTPUT POWER vs. FREQUENCY OUTPUT POWER vs. FREQUENCY 2.0 4.0 6.0 1.2 1.4 1.8 1.6 2.0 1.00.5 2.0 5.0 –12 –10 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X XX X f – Input Frequency – GHz PO – Output Power Level – dBm –14 –12 –10 f – Input Frequency – GHz PO – Output Power Level – dBm –14 –12 –10 X X X X X XXX X X X X X : VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V TA = –40 °C Pin = –10 dBm X : VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V TA = +25 °C Pin = –10 dBm X : VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V TA = +85 °C Pin = –10 dBm INPUT POWER vs. FREQUENCY f – Input Frequency – GHz Pin – Input Power Level – dBm –60 –20 –40 X : VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 VGuaranteed operating range

µPB1505GR Data Sheet P10872EJ3V0DS00 PACKAGE DIMENSIONS

8 PIN PLASTIC SOP (225 mil) (UNIT: mm)

5.2 – 0.2 0.12 1.27 NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 1 4 M 0.85 MAX. 6.5 – 0.3 0.6 – 0.2 0.10 detail of lead end 3°+7° –3° 0.17+0.08 –0.07 0.42+0.08 –0.07 1.57 – 0.2 1.49 0.1 – 0.1

µPB1505GR Data Sheet P10872EJ3V0DS00 NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPB1505GR * : It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Soldering method Soldering conditions Recommended conditoin symbol Infrared ray reflow Package peak temperature : 235 °C, Hour : within 30 s. (more than 210 °C), IR35-00-3 Time : 3 time, Limited days : no. * Time : 3 time, Limited days : no. * Wave soldering Soldering tub temperature : less than 260 °C, Hour : within 10 s. WS60-00-1 Time : 1 time, Limited days : no. * Pin part heating Pin area temperature : less than 300 °C, Hour : within 3 s./pin Limited days : no. *

µPB1505GR NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES