UPB1513TU RENESAS | Alldatasheet
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Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1513TU
13 GHz INPUT DIVIDE BY 4 PRESCALER IC
FOR SATELLITE COMMUNICATIONS Document No. PU10540EJ02V0DS (2nd edition) Date Published March 2005 CP(K) Printed in Japan NEC Compound Semiconductor Devices, Ltd. 2004, 2005 The mark shows major revised points.
DESCRIPTION
The µPB1513TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 4 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
- Operating frequency : f in = 5 to 13 GHz Low current consumption : I CC = 48 mA @ VCC = 5.0 V High-density surface mounting : 8-pin lead-less minimold Supply voltage : V CC = 4.5 to 5.5 V Division ratio : 4
APPLICATIONS
Point-to-point/Multi-point radios VSAT radios
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form µPB1513TU-E2 µPB1513TU-E2-A 8-pin lead-less minimold (Pb-Free) Note 1513 • 8 mm wide embossed taping
- Pin 5, 6, 7, 8 indicates pull-out direction of tape
- Qty 5 kpcs/reel Note With regards to terminal solder (the solder contai ns lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1513TU
Data Sheet PU10540EJ02V0DS 2 µPB1513TU INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS Pin No. Pin Name
1 V CC1
3 GND
5 OUT
6 GND
7 OUT
(Top View) Regulator 1/2 1/2
8 V CC2
SYSTEM APPLICATION EXAMPLE PLL
13 GHz Prescaler
PB1513TUµ LNA Down-Converter Up-ConverterPA Diplexer
Data Sheet PU10540EJ02V0DS 3 µPB1513TU PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Function and Applications 1 V CC1 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN − Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN − Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT − Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT − Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 V CC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance.
Data Sheet PU10540EJ02V0DS 4 µPB1513TU ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage V CC TA = +25°C 6 V Total Power Dissipation P D TA = +85°C Note 867 mW Thermal Resistance (junction to ground paddle) Rth(j-c) TA = +85°C Note 75 °C/W Operating Ambient Temperature T A −40 to +85 °C Storage Temperature T stg −55 to +150 °C Note Mounted on 33 × 21 × 0.4 mm polyimide PCB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC 4.5 5.0 5.5 V Operating Ambient Temperature T A −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = −40 to +85°C, ZS = ZL = 50 Ω) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current I CC No Signals − 48 75 mA Input Sensitivity P in1 f in = 5 to 6 GHz −8 − −5 dBm P in2 f in = 6 to 12 GHz −8 − 0 dBm P in3 f in = 12 to 13 GHz −5 − 0 dBm Output Power P out f in = 5 to 13 GHz, single ended, Pin = −5 dBm −11 −4 2 dBm
Data Sheet PU10540EJ02V0DS 5 µPB1513TU TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) Output Power Pout (dBm) Frequency f (GHz) Input Sensitivity Pin (dBm) Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY –10 –15 –20 –25 –30 –35 0 5 10 15 20 Guaranteed operating range VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V –10 –11 –120 5 10 15 20 Pin = –5 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Guaranteed operating range Input Sensitivity Pin (dBm) Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY –10 –15 –20 –25 –30 –35 0 5 10 15 20 Guaranteed operating range VCC = 5.0 V TA = –40˚C TA = +25˚C TA = +85˚C Output Power Pout (dBm) Frequency f (GHz) OUTPUT POWER vs. FREQUENCY –10 –11 –12 0 5 10 15 20 Guaranteed operating range TA = –40˚C TA = +25˚C TA = +85˚C VCC = 5.0 V Pin = –5 dBm 1234560 CURCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage Vcc (V) Circuit Current Icc (mA) TA = –40˚C TA = +25˚C TA = +85˚C Remark The graphs indicate nominal characteristics.
Data Sheet PU10540EJ02V0DS 6 µPB1513TU S-PARAMETERS (TA = +25°C, VCC = 5.0 V) S11−FREQUENCY S22−FREQUENCY START : 1.25 GHz STOP : 3.25 GHz FREQUENCY S 22 GHz MAG ANG 1.25 0.002 90.3 1.4 0.011 133.3 1.6 0.024 132.3 1.8 0.038 130.2 2.0 0.054 127.3 2.2 0.073 126.8 2.4 0.092 124.5 2.6 0.117 122.6 2.8 0.137 121.9 3.0 0.164 120.3 3.2 0.186 120.3 3.25 0.196 121.0 1 : 1.5 GHz 2 : 2.0 GHz 3 : 2.5 GHz 4 : 3.0 GHz 2 3 START : 5.0 GHz STOP : 13.0 GHz FREQUENCY S 11 GHz MAG ANG 5.0 0.603 170.5 6.0 0.705 139.7 7.0 0.782 112.0 8.0 0.766 90.6 9.0 0.820 71.2 10.0 0.832 57.9 11.0 0.768 46.3 12.0 0.698 32.2 13.0 0.798 26.6 1 : 6.5 GHz 2 : 8.0 GHz 3 : 9.5 GHz 4 : 11.0 GHz
Data Sheet PU10540EJ02V0DS 7 µPB1513TU MEASUREMENT CIRCUIT IN GND IN V CC1 100 pF 50 Ω Spectrum Analyzer100 pF 51 Ω 100 pF 51 Ω 100 pF Signal Generator 50 Ω OUT GND OUT VCC2 5 V Power Supply 100 pF 10 nF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10540EJ02V0DS 8 µPB1513TU ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD 51 Ω 51 Ω 100 pF 10 nF 100 pF 100 pF 100 pF 100 pF Remarks 1. 33 × 21 × 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. represents cutout 5. : Through holes
Data Sheet PU10540EJ02V0DS 9 µPB1513TU PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT: mm) 123 4 8 76 5 2.2±0.05 2.0±0.1 (Top View) 0.5±0.03 4 3 2 1 56 78 (0.75)(0.75) (0.25) (0.25) 0.16±0.05 (Bottom View) 2.0±0.1 (0.35)(0.35) (0.35)(0.35) (0.5)(0.5) (0.6)(0.6) (0.65)(0.65) (0.6) (0.3) 0.125+0.1 –0.05
Data Sheet PU10540EJ02V0DS 10 µPB1513TU NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to mi nimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the gr ound terminals as short as possible. (4) Bypass capacitance must be attached to V CC line. (5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating).
Data Sheet PU10540EJ02V0DS 11 µPB1513TU When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product b efore using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact µPB1513TU