UPB1511TB

UPB1511TB NEC | Alldatasheet

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Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. BIPOLAR DIGITAL INTEGRATED CIRCUIT µµµµPB1511TB

800 MHz INPUT DIVIDE BY 2, 4 PRESCALER IC

Document No. P14731EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan PRELIMINARY DATA SHEET © 2000 The µPB1511TB is a silicon monolithic integrated circuit designed as a divide by 2, 4 prescaler IC for portable radio systems. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. Consequently, this IC is lower circuit current and smaller package than conventional µPB1509GV.

FEATURES

• Operating frequency : f in = 50 to 700 MHz @ ÷ 2, 50 to 800 MHz @ ÷ 4
• Low current consumption : 3.5 mA @ V CC = 3.0 V
• High-density surface mounting : 6-pin super minimold
• Supply voltage : V CC = 2.4 to 3.3 V
• Selectable division : ÷ 2, ÷ 4

APPLICATIONS

• Portable radio systems
• Cellular/cordless telephone 2nd local prescaler

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPB1511TB-E3 6-pin super minimold C2Z Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1511TB)

Preliminary Data Sheet P14731EJ1V0DS002 µµµµPB1511TB PIN CONNECTIONS Pin No. Pin Name 1O U T 2G N D 3S W 4I N 5I N 6V CC PRODUCT LINE-UP Part Number ICC (mA) VCC (V) ÷ 2 fin (MHz) ÷ 4 fin (MHz) ÷ 8 fin (MHz) Package µPB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1 000 8-pin SSOP µPB1511TB 3.5 2.4 to 3.3 50 to 700 50 to 800 − 6-pin super minimold Remark This table shows the TYP. values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. INTERNAL BLOCK DIAGRAM D CLK Q Q D CLK Q Q SW OUT IN IN (Top View) (Bottom View) C2Z

Preliminary Data Sheet P14731EJ1V0DS00 3 µµµµPB1511TB SYSTEM APPLICATION EXAMPLE One of the example for usage VCO I Q ÷N PLL PA DEMOD. PLL ÷N PB1511TB SW RX TX 0° I 90° Q VCO µ Low Noise Tr. Quadulator Modulator Phase Shifter This block diagram schematically shows the µPB1511TB’s location in one of the example application system. The other applications are also acceptable for divider use.

Preliminary Data Sheet P14731EJ1V0DS004 µµµµPB1511TB PIN EXPLANATIONS Pin No. Symbol Applied Voltage (V) Functions and Explanation 1O U T  Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.2 VP-P MIN. with 200 Ω load. This pin should be coupled to load device with capacitor (example: 1 000 pF) for DC cut. 2 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 3 SW H/L Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. These pins must be each equipped with bypass capacitor to minimize their impedance. 4I N  Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. 5I N  Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 6V CC 2.4 to 3.3 Power supply pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. SW HL Divide ratio 1/2 1/4

Preliminary Data Sheet P14731EJ1V0DS00 5 µµµµPB1511TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage V CC TA = +25°C3 . 6 V Input Voltage V in TA = +25°C, SW pin 3.6 V Total Power Dissipation P D Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (T A = +85°C) 200 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature T stg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC 2.4 3.0 3.3 V Operating Ambient Temperature T A −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (T A = +25°°°°C, VCC = 3.0 V) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current I CC No signals 3.1 3.5 4.1 mA Upper Limit Operating Frequency 1 fin(U)1 Pin = −20 to 0 dBm 500  MHz Upper Limit Operating Frequency 2 fin(U)2 Pin = −20 to −5 dBm @ ÷ 2 @ ÷ 4 700 800 MHz Lower Limit Operating Frequency 1 fin(L)1 Pin = −20 to 0 dBm  50 MHz Lower Limit Operating Frequency 2 fin(L)2 Pin = −20 to −5 dBm  500 MHz Input Power 1 P in1 fin = 50 to 800 MHz −20 − 5d B m Input Power 2 P in2 fin = 50 to 500 MHz −20  0d B m Output Voltage V out R L = 200 Ω 0.2 0.3  VP-P Divide Ratio Control Input High V IH 0.7 × VCC  VCC + 0.5 V Divide Ratio Control Input Low V IL −0.5  VCC × 0.3 V

Preliminary Data Sheet P14731EJ1V0DS006 µµµµPB1511TB TEST CIRCUIT High Impedance Oscilloscope 50 Ω Counter (or Spectrum Analyzer) 150 Ω 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 50 Ω Signal Generator Power Supply SW GND OUT IN IN V CC Divide Ratio Setting H1 / 2SW L1 / 4 PACKAGE DIMENSIONS 6-pin super minimold (Unit: mm) 0.9–0.1 0.7 0 to 0.1 0.15+0.1 2.0–0.2 1.3 0.650.65 0.2+0.1 –0.05 2.1–0.1 1.25–0.1 0.1 MIN.

Preliminary Data Sheet P14731EJ1V0DS00 7 µµµµPB1511TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). Keep the track length of the ground pins as short as possible. (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 3, Exposure limit: None Note IR35-00-3 Time: 40 seconds or less (at 200°C) Count: 3, Exposure limit: None Note VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Count: 1, Exposure limit: None Note WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPB1511TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. M8E 00. 4 The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).