UPB1510GV RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. NEC Compound Semiconductor Devices 1997, 2003 BIPOLAR DIGITAL INTEGRATED CIRCUIT µµ µµPB1510GV
3.0 GHz INPUT DIVIDE BY 4 PRESCALER IC
The mark shows major revised points.Document No. PU10311EJ01V0DS (1st edition) (Previous No. P12752EJ2V0DS00) Date Published January 2003 CP(K) Printed in Japan
DESCRIPTION
The µPB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. This IC is suitable for use of frequency divider for PLL synthesizer block. This IC is a shrink package version of the µPB585G so that this small package contributes to reduce the mounting space. This IC is manufactured using our 20 GHz fT NESAT IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
- High operating frequency : fin = 0.5 to 3.0 GHz
- High-density surface mounting : 8-pin plastic SSOP (4.45 mm (175) )
- Low current consumption : I CC = 14 mA TYP. @ VCC = 5 V
- Fixed division : ÷ 4
APPLICATIONS
- Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
- DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
Part Number Package Marking Supplying Form µPB1510GV-E1 8-pin plastic SSOP (4.45 mm (175) ) 1510 • Embossed tape 8 mm wide
- Pin 1 indicates pull-out direction of tape
- Qty 1 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1510GV
Data Sheet PU10311EJ01V0DS2 µµ µµPB1510GV PIN CONNECTIONS Pin No. Pin Name 1V CC 2I N 3I N 4G N D 5G N D 6N C 7O U T (Top View) 8N C INTERNAL BLOCK DIAGRAM D Q CLK CLK Q D Q CLK Q IN IN OUT Amp. SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1st IF Input (from DBS Converter) MIX. Baseband Output OSC PB1510GVµ LPF PLL Synthesizer for VHF/UHF Band ÷4 Prescaler SAWBPF AGC Amp. FM Demod.
Data Sheet PU10311EJ01V0DS 3 µµ µµPB1510GV PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) Function and Application 1V CC 4.5 to 5.5 − Supply voltage pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 2I N − 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. 3I N − 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 4, 5 GND 0 − Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC −− Non connection pins. These pins should be opened. 7O U T − 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to input of prescaler within PLL synthesizer through DC cut capacitor.
Data Sheet PU10311EJ01V0DS4 µµ µµPB1510GV ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25°C6 . 0 V Power Dissipation PD TA = +85°C Note 250 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature T A −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (T A = −− −−40 to +85°° °°C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 ΩΩ ΩΩ ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signals 10.5 14 17 mA Upper Limit Operating Frequency 1 fin (U)1 Pin = −10 to +6 dBm 3.0 −− GHz Upper Limit Operating Frequency 2 fin (U)2 Pin = −15 to +6 dBm 2.7 −− GHz Lower Limit Operating Frequency fin (L) Pin = −15 to +6 dBm −− 0.5 GHz Input Power 1 Pin1 fin = 2.7 to 3.0 GHz −10 − +6 dBm Input Power 2 Pin2 fin = 0.5 to 2.7 GHz −15 − +6 dBm Output Power Pout Pin = 0 dBm, fin = 2.0 GHz −12 −7 − dBm
Data Sheet PU10311EJ01V0DS 5 µµ µµPB1510GV TYPICAL CHARACTERISTICS (T A = +25°° °°C, VCC = 5 V, unless otherwise specified) No signal 1234567 Supply Voltage VCC (V) Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE TA = +85˚C +25˚C –40˚C TA = +25˚C Input Frequency fin (GHz) Input Power Pin (dBm) INPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –20 –30 –40 –50 Guaranteed operating range VCC = 4.5 to 5.5 V VCC = 5.0 V Pin = 0 dBm ZL = 50 Ω Input Frequency fin (GHz) Output Power Pout (dBm) OUTPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –15 TA = +85˚C +25˚C –40˚C VCC = 5.0 V Input Frequency fin (GHz) Input Power Pin (dBm) INPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –20 –30 –40 –50 Guaranteed operating range TA = –40˚C +25˚C +85˚C +25˚C –40˚C +85˚C TA = +25˚C Pin = 0 dBm ZL = 50 Ω Input Frequency fin (GHz) Output Power Pout (dBm) OUTPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –15 VCC = 5.5 V 5.0 V 4.5 V
Data Sheet PU10311EJ01V0DS6 µµ µµPB1510GV TA = +85˚C Pin = 0 dBm ZL = 50 Ω Input Frequency fin (GHz) Output Power Pout (dBm) OUTPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –15 VCC = 5.5 V 5.0 V 4.5 V TA = –40˚C Pin = 0 dBm ZL = 50 Ω Input Frequency fin (GHz) Output Power Pout (dBm) OUTPUT POWER vs. INPUT FREQUENCY 0.1 0.5 0.3 1 3 5 10 –10 –15 VCC = 5.5 V 5.0 V 4.5 V Remark The graphs indicate nominal characteristics. S11 vs. INPUT FREQUENCY VCC = 5.0 V, TA = +25°C, ZO = 50 Ω START 0.500000000 GHz STOP 3.000000000 GHz S 11 Z REF 1.0 Units 4 200.0 mUnits/ 27.159 Ω –27.582 Ω hp 1 : 500 MHz 2 : 1 000 MHz 3 : 2 000 MHz 4 : 3 000 MHz MARKER 4
3 GHz Frequency (MHz) S 11 (Ω )
500 37.1−j207.8 1 000 14.2−j105.1 2 000 7.9−j35.8 3 000 27.1−j27.5
Data Sheet PU10311EJ01V0DS 7 µµ µµPB1510GV S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 500 MHz, TA = +25°C, ZO = 50 Ω START 0.125000000 GHz STOP 0.750000000 GHz S22 Z REF 1.0 Units 4 200.0 mUnits/ 60.925 Ω 104.77 Ω hp 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz 4MARKER 4
750 MHz
VCC = 5.0 V, fin = 3.0 GHz, TA = +25°C, ZO = 50 Ω START 0.125000000 GHz STOP 0.750000000 GHz S22 Z REF 1.0 Units 4 200.0 mUnits/ 15.613 Ω 98.168 Ω hp 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz MARKER 4 Frequency (MHz) S 22 (Ω ) 125 55.5+j6.7 250 53.7+j30.4 500 55.0+j60.3 750 60.9+j104.8 Frequency (MHz) S 22 (Ω ) 125 28.5+j11.5 250 27.6+j23.6 500 20.5+j50.7 750 15.6+j98.2
Data Sheet PU10311EJ01V0DS8 µµ µµPB1510GV TEST CIRCUIT 50 Ω 1 000 pF 1 000 pF 1 000 pF OPEN OPEN 1 000 pF 50 Ω Counter HP5350B (Spectrum Analyzer) 1 000 pF HP8665A Signal Generator Supply Voltage 5±0.5 V The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10311EJ01V0DS 9 µµ µµPB1510GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD /,/,/, /,/,/,/,/, /,/,/,/,/, /,/,/,/, /,/, /,/, IN OUT C2 C4 IN OUT PB1506/08/09GVµ VCC Notes (1)35 m thick double-sided copper-clad 50 × 50 × 0.4 mm polyimide board. (2)Back side : GND pattern (3)Solder plated on pattern (4) : Through holes (5) of pin 3 : Pattern should be removed. (6) of pin 5 : Short chip must be attached to be grounded. µ /,/, /,/, /,/,/, COMPONENT LIST Value C1 to C4 1 000 pF
Data Sheet PU10311EJ01V0DS10 µµ µµPB1510GV PACKAGE DIMENSIONS 8-PIN PLASTIC SSOP (4.45 mm (175) ) (UNIT: mm) 1.5±0.1 0.575 MAX. 0.10 M 1.8 MAX. 0.1±0.1 0.3+0.10 –0.05 detail of lead end 3˚+7˚ –3˚ 0.65 8 5 1 4 2.9±0.1 4.94±0.2 0.5±0.2 0.87±0.23.2±0.1 0.15+0.10 –0.05 0.15
Data Sheet PU10311EJ01V0DS 11 µµ µµPB1510GV NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (example: 1 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215°C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10311EJ01V0DS12 µµ µµPB1510GV M8E 00. 4 - 0110 The information in this document is current as of January, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-01 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0209 NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com Business issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918 Technical issue µµ µµPB1510GV