UPB1510GV NEC | Alldatasheet

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The information in this document is subject to change without notice. BIPOLAR DIGITAL INTEGRATED CIRCUIT µµµµPB1510GV

3 GHz INPUT DIVIDE BY 4 PRESCALER IC

1997© Document No. P12752EJ2V0DS00 (2nd edition) Date Published October 1998 N CP(K) Printed in Japan DATA SHEET The mark shows major revised points. The µPB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. The µPB1510GV is suitable for use of frequency divider for PLL synthesizer block. The µPB1510GV is a shrink package version of the µPB585G so that this small package contributes to reduce the mounting space. The µPB1510GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

  • High toggle frequency : f in = 0.5 GHz to 3.0 GHz
  • High-density surface mounting : 8-pin plastic SSOP (175 mil)
  • Low current consumption : 5 V, 14 mA TYP.
  • Fixed division : ÷4 APPLICATION
  • Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
  • DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPB1510GV-E1 8-pin plastic SSOP (175 mil) 1510 Embossed tape 8 mm wide. Pin 1 is in tape pull-out direction. 1000 p/reel Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1510GV) Caution Electro-static sensitive devices

PB1510GVµµµµ PIN CONNECTION (Top View) Pin No. Pin name 1V CC 2I N 3I N 4G N D 5G N D 6N C 7O U T 8N C PRODUCT LINE-UP (Division, Frequency) Part number I CC (mA) f in (GHz) V CC (V) Package Pin Connection Remark This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTER- ISTICS. µPB585G is discontinued. INTERNAL BLOCK DIAGRAM IN IN CLK CLK D Q Q CLK D Q Q OUT AMP SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1st IF input from DBS converter MIX BPF OSC LPF PB1510GVµ ÷ 4 Prescaler PLL synth. for VHF/UHF band SAW AGC amp. FM demo. Baseband output

PB1510GVµµµµ PIN EXPLANATION Pin No. Symbol Applied Voltage (Unit: V) Pin Voltage (Unit: V) Functions and Explanation 1V CC 4.5 to 5.5  Supply voltage pin. This pin must be equipped with bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. 2I N  1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (e.g. 1 000 pF) for DC cut. 3I N  1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. 4, 5 GND 0  Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC  Non connection pins. These pins should be opened. 7O U T  1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to input of prescaler within PLL synthesizer through DC cut capacitor.

PB1510GVµµµµ ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply voltage V CC TA = +25 °C6 . 0 V Total power dissipation P D Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) 250 mW Operating ambient temperature T A −40 to +85 °C Storage temperature T stg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Notice Supply voltage V CC 4.5 5.0 5.5 V Operating ambient temperature T A −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (T A = −−−−40 to +85 °°°°C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 ΩΩΩΩ ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit current I CC No signals 10.5 14 17 mA Upper limit operating frequency 1 fin(U)1 Pin = −10 to +6 dBm 3.0  GHz Upper limit operating frequency 2 fin(U)2 Pin = −15 to +6 dBm 2.7  GHz Lower limit operating frequency f in(L) Pin = −15 to +6 dBm  0.5 GHz Input power 1 P in1 fin = 2.7 to 3.0 GHz −10  +6 dBm Input power 2 P in2 fin = 0.5 to 2.7 GHz −15  +6 dBm Output power P out Pin = 0 dBm, fin = 2.0 GHz −12 −7  dBm

PB1510GVµµµµ TYPICAL CHARACTERISTICS (T A = 25°C, VCC = 5 V, unless otherwise specified) No input signal VCC - Supply Voltage - V 01234567 ICC - Circuit Current - mA CIRCUIT CURRENT vs. SUPPLY VOLTAGE TA = 25 °C fin - Input Frequency - GHz Pin - Input Power - dBm 0.1 0.5 1 3 10 INPUT POWER vs. INPUT FREQUENCY Pout - Output Power - dBm fin - Input Frequency - GHz Pin - Input Power - dBm 0.1 0.5 1 3 10 –50 –40 –30 –20 –10 INPUT POWER vs. INPUT FREQUENCY VCC = 5 V 0.1 0.5 1 3 10 TA = 85 °C TA = –40 °C TA = 25 °C VCC = 4.5 to 5.5 V TA = –40 °C TA = 85 °C TA = 85 °C TA = 25 °C TA = –40 °C TA = 25 °C VCC = 5 V VCC = 4.5V VCC = 5.5 V Guaranteed operating range Guaranteed operating range –50 –40 –30 –20 –10 OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY Pout - Output Power - dBm –15 –10 TA = 25 °C Pin = 0 dBm ZL = 50 Ω fin - Input Frequency - GHz 0.1 0.5 1 3 10 TA = 25 °C TA = –40 °C TA = 85 °C –15 –10 VCC = 5 V Pin = 0 dBm ZL = 50 Ω fin - Input Frequency - GHz

PB1510GVµµµµ TYPICAL CHARACTERISTICS (T A = 25°C, VCC = 5V, unless otherwise specified) TA = –40 ˚C Pin = 0 dBm ZL = 50 Ω fin - Input Frequency - GHz Pout - Output Power - dBm 0.1 0.5 1 3 10 –15 –10 OUTPUT POWER vs. INPUT FREQUENCY TA = 85 ˚C Pin = 0 dBm ZL = 50 Ω fin - Input Frequency - GHz Pout - Output Power - dBm 0.1 0.5 1 3 10 –15 –10 OUTPUT POWER vs. INPUT FREQUENCY VCC = 5 V VCC = 5.5 V VCC = 4.5 V VCC = 5 V VCC = 5.5 V VCC = 4.5 V S11 vs. INPUT FREQUENCY VCC = 5.0 V, TA = 25°C, ZO = 50 Ω Frequency (MHz) S 11 (Ω ) 500 37.1 – j207.8 1000 14.2 – j105.1 2000 7.9 – j35.8 3000 27.1 – j27.5 S11 Z REF 1.0 Units 4 200.0 mUnits/ 27.159 Ω –27.582 Ω hp MARKER 4

3 GHZ

START 0.500000000 GHZ STOP 3.000000000 GHZ 1 : 500 MHZ 2 : 1000 MHZ 3 : 2000 MHZ 4 : 3000 MHZ

PB1510GVµµµµ hp MARKER 4

750 MH Z

START 0.125000000 GHZ STOP 0.750000000 GHZ 1 : 125 MHZ 2 : 250 MHZ 3 : 500 MHZ 4 : 750 MHZ S22 Z REF 1.0 Units 4 200.0 mUnits/ 60.925 Ω 104.77 Ω hp MARKER 4 START 0.125000000 GHZ STOP 0.750000000 GHZ S22 Z REF 1.0 Units 4 200.0 mUnits/ 15.613 Ω 98.168 Ω 1 : 125 MHZ 2 : 250 MHZ 3 : 500 MHZ 4 : 750 MHZ S22 vs. OUTPUT FREQUENCY VCC = 5.0V, fin = 500 MHz, TA = 25°C, ZO = 50 Ω Frequency (MHz) S 22 (Ω ) 125 55.5 + j6.7 250 53.7 + j30.4 500 55.0 + j60.3 750 60.9 + j104.8 S22 vs. OUTPUT FREQUENCY VCC = 5.0V, fin = 3 GHz, TA = 25°C, ZO = 50 Ω Frequency (MHz) S 22 (Ω ) 125 28.5 + j11.5 250 27.6 + j23.6 500 20.5 + j50.7 750 15.6 + j98.2

PB1510GVµµµµ TEST CIRCUIT 50 Ω Signal Generator 1000 pF 1000 pF 1000 pF OPEN OPEN 1000 pF 50 Ω (Spectrum Analyzer) Counter HP5350B8 1000 pF HP8665A Supply Voltage 5 V–0.5 V

PB1510GVµµµµ ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN PB1506/08/09GV OUT IN OUT C2 C4 VCC /,/,/, /,/,/,/,/, /,/,/,/,/, /,/,/,/, /,/, /,/, µ COMPONENT LIST Symbol Value C1 to C4 1000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. EVALUATION BOARD CHARACTERS (1) 35 µm thick double-sided copper clad 50 × 50 × 0.4 mm polyimide board (2) Back side: GND pattern (3) Solder plated patterns (4) ° : Through holes (5)/,/, /,/, of pin 3 : partern should be removed. (6)/,/, /,/, of pin 5 : short chip must be attached to be grounded.

PB1510GVµµµµ PACKAGE DIMENSIONS

8 PIN PLASTIC SSOP (175 mil) (UNIT: mm)

3.0 MAX. 1.5±0.1 1.8 MAX. 0.1±0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.15 0.15 +0.10 –0.05 0.5±0.2 3.2±0.1 4.94±0.2 0.87±0.2 +7° –3°

PB1510GVµµµµ NOTE CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Count: 3, Exposure limit Note : None IR35-00-3 Time: 40 seconds or less (at 200 °C) Count: 3, Exposure limit Note : None VP15-00-3 Wave Soldering Soldering bath temperature: 260 °C or below Time: 10 seconds or less Count: 1, Exposure limit Note : None WS60-00-1 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Exposure limit Note : None Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

PB1510GVµµµµ ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5