UPB1509GV-E1

UPB1509GV NEC | Alldatasheet

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BIPOLAR DIGITAL INTEGRATED CIRCUIT PP PPPB1509GV 1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC FOR PORTABLE SYSTEMS DATA SHEET Document No. P10769EJ2V0DS00 (2nd edition) Date Published September 1997 N Printed in Japan © 1996 PPB1509G V is a divide by 2, 4, 8 prescaler IC for portable radio or cellular telephone applications. PPB1509GV is a shrink package version of PPB587G so that this small package contributes to reduce the mounting space. PPB1509GV is manufactured using NEC’s high fT NESAT TM IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

x High toggle frequency : fin = 50 MHz to 700 MHz @ y 2,

50 MHz to 800 MHz @ y 4,

50 MHz to 1000 MHz @ y 8

x Low current consumption : 5.0 mA @ V CC = 3.0 V x High-density surface mounting : 8 pin plastic SSOP (175mil) x Supply voltage : VCC = 2.2 to 5.5 V x Selectable division : y 2, y 4, y 8 APPLICATION x Portable radio systems x Cellular/cordless telephone 2nd Local prescaler and so on.

ORDERING INFORMATION

PART NUMBER PACKAGE MARKING SUPPLYING FORM PPB1509GV-E1 8 pin plastic SSOP (175 mil) 1509 Embosse d tape 8 mm wide. Pin 1 is in tape pull-out direction. 1000p/reel. Remark s : To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PPB1509GV) Caution:Electro-static sensitive devices

PIN CONNECTION (Top View) Pin NO. Pin Name 1V CC1 2I N 3I N

4 GND

5 SW1

6 SW2

7 OUT

Product No. I CC (mA) VCC (V) y 2 fin (MHz) y 4 fin (MHz) y 8 fin (MHz) Package Pin Connection PPB587 G 5.5 2.2 to 3.5 50 to 300 50 to 600 50 to 1000 8 pin SOP (225 mil) PPB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1000 8 pin SSOP (175 mil) Remarks This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. PPB587G is discontinued. INTERNAL BLOCK DIAGRAM D CLK Q Q D CLK Q Q D CLK Q Q SW1 SW2 OUT IN IN NEC Original

SYSTEM APPLICATION EXAMPLE One of the example for usage VCO I Q ÷N PLL PA DEMO PLL ÷N PB1509GV SW RX TX 0° I 90° Q VCO µ φ This block diagram schematically shows the PPB1509GV’s location in one of the example application system. The other applications are also acceptable for divider use.

Pin No. Symbol Applied Voltage Pin Voltage Functions and Explanation 1V CC1 2.2 to 5.5  Power supply pin of a input amplifier and dividers. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 2I N  1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (eg 1000 pF) for DC cut. 3I N  1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 4 GND 0  Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 5 SW1 H/L  Divide ratio control pin. Divide ratio can be determined by following applied level to these pins.

6 SW2 H/L 

These pins must be each equipped with bypass capacitor to minimize their impedance. 7 OUT  1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.1 VP-P min with 200 : load. This pin should be coupled to load device with capacitor (eg 1000 pF) for DC cut. 8V CC2 2.2 to 5.5  Power supply pin of output buffer amplifier. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. SW2 HL H 1/2 1/4 L 1/4 1/8 SW1

PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage V CC TA = +25 qC 6.0 V Input voltage V in TA = +25 qC, SW1, SW2 pins 6.0 V Total power dissipation P D Mounted on double sided copper clad 50 u 50 u 1.6 mm epoxy glass PWB (TA = +85 qC) 250 mW Operating ambient temperature TA ð40 to +85 qC Storage temperature T stg ð55 to +150 qC RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTICE Supply voltage V CC 2.2 3.0 5.5 V Operating ambient temperature T A ð40 +25 +85 qC ELECTRICAL CHARACTERISTICS (T A = ðððð40 to +85 qqqqC, VCC = 2.2 to 5.5 V) PARAMETERS SYMBOLS TEST CONDITIONS MIN. TYP. MAX. UNIT Circuit current I CC No signals, VCC = 3.0 V 3.5 5.0 5.9 mA Upper Limit Operating Frequency 1 fin(U)1 Pin = ð20 to 0 dBm 500  MHz Upper Limit Operating Frequency 2 fin(U)2 Pin = ð20 to ð5 dBm @ y 2 @ y 4 @ y 8 700 800 1000 MHz Lower Limit Operating Frequency 1 fin(L)1 Pin = ð20 to 0 dBm  50 MHz Lower Limit Operating Frequency 2 fin(L)2 Pin = ð20 to ð5 dBm  500 MHz Input Power 1 P in1 fin = 50 MHz to 1000 MHz ð20 ð 5 dBm Input Power 2 P in2 fin = 50 MHz to 500 MHz ð20  0 dBm Output Voltage V out R L = 200 : 0.1 0.2  VP-P Divide ratio control input high V IH1 Connection in the test circuit VCC VCC VCC  Divide ratio control input low V IL1 Connection in the test circuit OPEN or GND OPEN or GND OPEN or GND Divide ratio control input high V IH2 Connection in the test circuit VCC VCC VCC  Divide ratio control input low V IL2 Connection in the test circuit OPEN or GND OPEN or GND OPEN or GND

50 Ω Signal Generator Power Supply Oscilloscope 50 Ω 150 Ω Counter (or Spectrum Analizer) High impedance 1000 pF EQUIPMENTS Signal Generator (HP-8665A) Counter (HP-5350B) for measuring input sensitivity (Spectrum Analyzer for measuring output frequency) Oscilloscope for measuring output swing (In measuring output power on Spectrum Analyzer, oscilloscope should be turned off.) Divide Ratio Setting SW2 HL H 1/2 1/4 L 1/4 1/8 H: SW pin should be connected to VCC1 pin. L: SW pin should be opened or connected to GND. SW1

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD C6C2 IN OUT PB1506/08/09GV OUTIN VCC1 VCC2 SW2 SW1µ Component List No. Value Notes for evaluation board C1 to C7 1000 pF (1) 35 Pm thick double sided copper clad 50 u 50 u 0.4 mm polyimide board R1 150 : Note (2) Back side : GND pattern (3) Solder plated on pattern (4) O O : Through holes (5) : Remove pattern Note For Output load of IC, R1 is determined as follows; R1 + Impedance of measurement equipment = 200 :. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. The usage and applications of PPB1509GV should be referred to the application note (Document No. P12611E).

Supply Voltage VCC (V) Circuit Current ICC (mA) 456 Circuit Current vs. Supply Voltage TA = +85°C TA = +25°C TA = –40°C Recommended operating range Divide by 2 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Guaranteed operating window TA = +25°C VCC = 3.0 V TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C V CC = 2.2 V V CC = 2.2 V V CC = 3.0 V V CC = 3.0 V V CC = 5.5 V V CC = 5.5 V Guaranteed operating window

Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Guaranteed operating window VCC = 2.2 V VCC = 5.5 V TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C Guaranteed operating window 0.3 0.2 0.1 010 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency Output voltage swing VP-P (V) 1000 2000 0.3 0.2 0.1 010 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency Output voltage swing VP-P (V) 1000 2000 0.3 0.2 0.1 010 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency Output voltage swing VP-P (V) 1000 2000 0.3 0.2 0.1 010 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency Output voltage swing VP-P (V) 1000 2000 VCC = 3.0 V Pin = 0 dBm TA = +25°C Pin = 0 dBm TA = –40°C Pin = 0 dBm TA = +85°C Pin = 0 dBm TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C V CC = 2.2 V V CC = 3.0 V V CC = 5.5 V V CC = 2.2 V V CC = 3.0 V V CC = 5.5 V V CC = 2.2 V V CC = 3.0 V V CC = 5.5 V

Divide by 4 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Guaranteed operating window Guaranteed operating window TA = +25°C VCC = 3.0 V TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C V CC = 2.2 V V CC = 2.2 V V CC = 3.0 V V CC = 3.0 V V CC = 5.5 V V CC = 5.5 V V CC = 5.5 V Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Guaranteed operating window Guaranteed operating window VCC = 2.2 V VCC = 5.5 V TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C TA = –40°C

Divide by 8 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Input power vs. Input frequency –10 –20 –30 –40 –50 –6010 100 Input frequency f in (MHz) Input power Pin (dBm) 1000 2000 Guaranteed operating window Guaranteed operating window Guaranteed operating window Guaranteed operating window TA = +25°C VCC = 3.0 V VCC = 2.2 V VCC = 5.5 V TA = +85°C TA = +85°C TA = –40°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –40°C TA = –40°C V CC = 2.2 V V CC = 2.2 V V CC = 3.0 V V CC = 3.0 V V CC = 5.5 V V CC = 5.5 V

S11 vs. Input Frequency S11 REF

1.0 Units/

200.0 mUnits/ 55.375 Ω – 142.79 Ω VCC1 = VCC2 = 3.0 V, SW1 = SW2 = 3.0 V FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 MAG .929 .898 .866 .840 .834 .819 .803 .792 .787 .771 ANG –6.7 –10.5 –13.6 –15.9 –19.1 –21.9 –24.7 –27.0 –30.0 –32.7 S11 START STOP

0.050000000 GHz

1.000000000 GHz

700.0 MHz

S22 vs. Output Frequency S22 REF 1.0 Units/ 200.0 mUnits/ START STOP

0.350000000 GHz

Z

50 MHz

149.09 Ω + j 14.86 Ω

350 MHz

194.21 Ω – j 36.64 Ω

PACKAGE DIMENSIONS (UNIT: mm)

8 PIN PLASTIC SSOP (175 mil)

3.0 MAX. 1.5±0.1 1.8 MAX. 0.1±0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.15 0.15 +0.10 –0.05 0.5±0.2 3.2±0.1 4.94±0.2 0.87±0.2 Detail of lead end +7° –3°

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. PPPPPB1509GV Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235qC, Hour: within 30 s. (more than 210qC), Time: 3 times, Limited days: no.* IR35-00-3 Hour: within 40 s. (more than 200qC), Time: 3 times, Limited days: no.* VP15-00-3 Wave soldering Soldering tub temperature: less than 260qC, Hour: within 10 s. Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temparature: less than 300qC, Hour: within 3 s./pin Limited days: no.* * It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

[MEMO]

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5