UPB1508GV RENESAS | Alldatasheet
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BIPOLAR DIGITAL INTEGRATED CIRCUIT µµµµPB1508GV
3 GHz INPUT DIVIDE BY 2 PRESCALER IC
1996© Document No. P10768EJ2V0DS00 (2nd edition) Date Published September 1997 N Printed in Japan DATA SHEET µPB1508GV is a 3.0 GHz input divide by 2 prescaler IC for DBS tuner applications. µPB1508GV can make VHF/UHF band PLL frequency synthesizer apply to DBS/ECS tuners. µPB1508GV is a shrink package version of µPB584G so that this small package contributes to reduce the mounting space. µPB1508GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
- High toggle frequency : f in = 0.5 GHz to 3.0 GHz
- High-density surface mounting : 8 pin plastic SSOP (175 mil)
- Low current consumption : 5 V, 12 mA
- Fixed division : ÷2 APPLICATION
- Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
- DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
PART NUMBER PACKAGE MARKING SUPPLYING FORM µPB1508GV-E1 8 pin plastic SSOP (175 mil) 1508 Embossed tape 8 mm wide. Pin 1 is in tape pull-out direction. 1 000 p/reel. Remarks To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1508GV) Caution: Electro-static sensitive devices
µµµµPB1508GV PIN CONNECTION (Top View) Pin No. Pin name 1V CC 2I N 3I N
4 GND
5 GND
7 OUT
Product No. I CC (mA) f in (GHz) V CC (V) Package Pin Connection µPB581A 30 0.5 to 2.8 4.5 to 5.5 8 pins CAN – µPB581C 30 0.5 to 2.2 4.5 to 5.5 8 pins DIP (300 mil) NEC Original µPB584G 18 0.5 to 2.5 4.5 to 5.5 8 pins SOP (225 mil) NEC Original µPB1508GV 12 0.5 to 3.0 4.5 to 5.5 8 pins SSOP (175 mil) Remarks This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. µPB581A, µPB581C and µPB584G are discontinued. INTERNAL BLOCK DIAGRAM IN IN CLK CLK D Q Q OUT AMP SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1stIF input from DBS converter MIX BPF OSC LPF PB1508GVµ ÷ 2 Prescaler PLLsynth. for VHF/UHF band SAW AGC amp. FM demo. Baseband output
µµµµPB1508GV PIN EXPLANATION Pin No. Symbol Applied voltage PIN voltage Functions and explanation 1V CC 4.5 to 5.5 Power supply pin. This pin must be equipped with bypass capacitor (eg 1 000 pF) to minimize ground impedance. 2I N 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (eg 1 000 pF) for DC cut. 3I N 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1 000 pF) to minimize ground impedance. 4, 5 GND 0 Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC Non connection pins. These pins should be opened. 7 OUT 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to input of prescaler within PLL synthesizer through DC cut capacitor.
µµµµPB1508GV ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage V CC TA = +25 °C 6.0 V Input voltage V in TA = +25 °C 6.0 V Total power dissipation P D Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) 250 mW Operating ambient temperature T A −40 to +85 °C Storage temperature T stg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT REMARKS Supply voltage V CC 4.5 5.0 5.5 V Operating ambient temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (T A = −−−−40 to +85 °°°°C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 ΩΩΩΩ ) PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Circuit current I CC No signals 7.6 12 14.5 mA Upper limit operating frequency 1 fin(U)1 Pin = −10 to +6 dBm 3.0 GHz Upper limit operating frequency 2 fin(U)2 Pin = −15 to +6 dBm 2.7 GHz Lower limit operating frequency fin(L) Pin = −15 to +6 dBm 0.5 GHz Input power 1 P in1 fin = 2.7 to 3.0 GHz −10 +6 dBm Input power 2 P in2 fin = 0.5 to 2.7 GHz −15 +6 dBm Output power P out Pin = 0 dBm, fin = 2 GHz −12 −7 dBm
µµµµPB1508GV TYPICAL CHARACTERISTICS (unless otherwise specified TA = +25°C) 00123 VCC - Supply Voltage - V ICC - Circuit Current - mA 456 CIRCUIT CURRENT vs. SUPPLY VOLTAGE No signals TA = +85 ˚C TA = +25 ˚C TA = –40 ˚C +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm Pin - Input Power - dBm Pout - Output Power - dBm Pout - Output Power - dBm INPUT POWER vs. INPUT FREQUENCY +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in -Input Frequency - MHz fin - Input Frequency - MHz f in -Input Frequency - MHz INPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY –10 –12 –14 –16 –10 –12 –14 –16100 1000 4000 100 1000 4000 TA = +25 ˚C VCC = 5.0 V Pin = 0 dBm ZL = 50 Ω TA = +25 ˚C Pin = 0 dBm ZL = 50 Ω VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V TA = –40 ˚C TA = –40 ˚C TA = +25 ˚C TA = +25 ˚C TA = +85 ˚C TA = +85 ˚C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V TA = –40 ˚C TA = –40 ˚C TA = +25 ˚C TA = +25 ˚C TA = +85 ˚C TA = +85 ˚C Guaranteed Operating Window Guaranteed Operating Window
µµµµPB1508GV –10 –12 –14 –16 –10 –12 –14 –16100 1000 4000 f in - Input Frequency - MHz Pout - Output Power - dBm OUTPUT POWER vs. INPUT FREQUENCY fin - Input Frequency - MHz Pout - Output Power - dBm OUTPUT POWER vs. INPUT FREQUENCY 100 1000 4000 TA = –40 ˚C Pin = 0 dBm ZL = 50 Ω TA = +85 ˚C Pin = 0 dBm ZL = 50 Ω VCC = 4.5 VVCC = 4.5 V VCC = 5.0 V VCC = 5.0 V VCC = 5.5 VVCC = 5.5 V S11 vs. INPUT FREQUENCY VCC = 5.0 V S11 Z REF 1.0 Units 200.0 mUnits/ 34.604 Ω –26.496 Ω START 0.500000000 GHz STOP 3.000000000 GHz MARKER 4
3.0 GHz
C D : 500 MHz : 1000 MHz : 2000 MHz : 3000 MHz FREQUENCY S 11 MHz MAG ANG 500.0000 .850 –30.2 600.0000 .796 –37.8 700.0000 .790 –39.2 800.0000 .754 –45.2 900.0000 .766 –53.7 1000.0000 .701 –57.6 1100.0000 .660 –62.3 1200.0000 .606 –67.2 1300.0000 .571 –70.3 1400.0000 .521 –70.6 1500.0000 .495 –68.3 1600.0000 .441 –60.6 1700.0000 .479 –45.1 1800.0000 .602 –62.3 1900.0000 .595 –74.2 2000.0000 .608 –82.9 2100.0000 .603 –89.8 2200.0000 .599 –97.3 2300.0000 .588 –107.7 2400.0000 .532 –122.0 2500.0000 .396 –132.0 2600.0000 .325 –127.1 2700.0000 .270 –123.6 2800.0000 .232 –122.7 2900.0000 .258 –105.8 3000.0000 .351 –103.7
µµµµPB1508GV S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 498 MHz S22 Z REF 1.0 Units 200.0 mUnits/ 87.789 Ω –13.633 Ω START 0.250000000 GHz STOP 1.500000000 GHz MARKER 4
1.5 GHz
C D : 250 MHz : 500 MHz : 1000 MHz : 1500 MHz S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 3002 MHz S22 Z REF 1.0 Units 200.0 mUnits/ 91.109 Ω 2.6523 Ω START 0.250000000 GHz STOP 1.500000000 GHz MARKER 4 C D : 250 MHz : 500 MHz : 1000 MHz : 1500 MHz FREQUENCY S 22 MHz MAG ANG 250.0000 .526 118.9 300.0000 .463 131.2 350.0000 .466 124.7 400.0000 .460 117.1 450.0000 .441 110.2 500.0000 .456 103.0 550.0000 .353 94.8 600.0000 .438 91.1 650.0000 .444 83.9 700.0000 .436 78.3 750.0000 .435 71.8 800.0000 .431 65.9 850.0000 .431 60.3 900.0000 .431 53.7 950.0000 .408 49.2 1000.0000 .445 44.9 1050.0000 .428 41.0 1100.0000 .429 33.7 1150.0000 .355 42.7 1200.0000 .418 20.0 1250.0000 .403 17.1 1300.0000 .392 9.6 1350.0000 .368 3.3 1400.0000 .343 –3.4 1450.0000 .319 –9.2 1500.0000 .289 –14.1 FREQUENCY S MHz MAG ANG 250.0000 .555 146.6 300.0000 .545 139.9 350.0000 .571 136.1 400.0000 .529 127.9 450.0000 .521 122.4 500.0000 .515 116.9 550.0000 .510 104.5 600.0000 .492 106.6 650.0000 .487 100.9 700.0000 .482 95.3 750.0000 .473 89.9 800.0000 .461 83.8 850.0000 .454 78.4 900.0000 .449 72.3 950.0000 .430 69.6 1000.0000 .443 64.3 1050.0000 .444 58.8 1100.0000 .440 52.3 1150.0000 .438 46.0 1200.0000 .501 37.5 1250.0000 .408 32.9 1300.0000 .388 25.1 1350.0000 .359 16.3 1400.0000 .335 9.7 1450.0000 .304 3.1 1500.0000 .285 4.6
µµµµPB1508GV TEST CIRCUIT 50 Ω Signal Generator 1000 pF 1000 pF 1000 pF OPEN OPEN 1000 pF 50 Ω (Spectrum Analyzer) Counter HP5350B8 1000 pF HP8665A Power Supply 5 V±0.5 V
µµµµPB1508GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN PB1506/08/09GV OUT IN OUT C2 C4 VCC /,/,/, /,/,/,/,/, /,/,/,/,/, /,/,/,/, /,/, /,/, µ COMPONENT LIST SYMBOL VALUE C1 to C4 1000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. EVALUATION BOARD CHARACTERS (1) 35 µm thick double-sided copper clad 50 × 50 × 0.4 mm polyimide board (2) Back side: GND pattern (3) Solder plated patterns (4) ° : Through holes (5)/,/, /,/, of pin 3 : partern should be removed. (6)/,/, /,/, of pin 5 : short chip must be attached to be grounded.
µµµµPB1508GV PACKAGE DIMENSIONS 8 pin PLASTIC SSOP (175 mil) (unit : mm) 3.0 MAX. 1.5±0.1 1.8 MAX. 0.1±0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.15 0.15 +0.10 –0.05 0.5±0.2 3.2±0.1 4.94±0.2 0.87±0.2 +7° –3°
µµµµPB1508GV NOTE CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µµµµPB1508GV Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 3 times, Limited days: no.* IR35-00-3 Hour: within 40 s. (more than 200 °C), Time: 3 times, Limited days: no.* VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s., Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s./pin, Limited days: no.* * It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µµµµPB1508GV ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5