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Caution: Electro-static sensitive devices BIPOLAR DIGITAL INTEGRATED CIRCUITS /uni03BC PB1507GV 3GHz INPUT DIVIDE BY 256, 128, 64 PRESCALER IC FOR ANALOG DBS TUNERS Document No. P10767EJ3V0DS00 (3rd edition) Date Published January 1998 N CP(K) The /uni03BC PB1507GV has 3.0 GHz input, high division silicon prescaler ICs for analog DBS tuner applications. This IC divide-by-256, 128 and 64 contribute to produce analog DBS tuners with kit-use of 17 K series DTS controller or standard CMOS PLL synthesizer IC. T he /uni03BC PB1507GV is a shrink package version of the /uni03BC PB586G/588G or /uni03BC PB1505GR so that these smaller packages contribute to reduce the mounting space replacing from conventional ICs. The /uni03BC PB1507GV are manufactured using the high f T NESAT™IV silicon bipolar process. T his process uses silicon nitride passivation film and gold electrodes. T hese materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.

FEATURES

  • High toggle frequency : fin = 0.5 GHz to 3.0 GHz
  • High-density surface mounting : 8-pin plastic SSOP (175 mil)
  • Low current consumption : 5 V, 19 mA
  • Selectable high division : ÷256, ÷128, ÷64
  • Pin connection variation : /uni03BC PB1507GV APPLICATION These ICs can use as a prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler. For example, following application can be chosen;
  • Analog DBS tuner’s synthesizer
  • Analog CATV converter synthesizer

ORDERING INFORMATION

PART NUMBER PACKAGE MARKING SUPPLYING FORM /uni03BC PB1507GV-E1-A SSOP (175 mil) (Pb-Free) 1507 direction. 1 000 p/reel. Remarks To order evaluation samples, please contact your local nearby sales office. (Part number for sample order: /uni03BC PB1507GV-A)

/uni03BC PB1507GV PIN CONNECTION (Top View) Pin NO. /uni03BC PB1506GV /uni03BC PB1507GV

1 SW1 IN

2 IN VCC

3 IN SW1

4 GND OUT

5 NC GND

6 SW2 SW2

7 OUT NC

8 VCC IN

(division, Freq.) Part No. ICC (mA) fin (GHz) VCC (V) Package Pin connection ÷256, ÷128, ÷64 /uni03BC PB1505GR 14 0.5 to 3.0 4.5 to 5.5 Standard /uni03BC PB1507GV 19 0.5 to 3.0 4.5 to 5.5 8 pin SSOP 175 mil Standard Remarks • This table shows the TYP values of main parameters. Pleas e refer to ELECTRICAL CHARACTERISTICS.

  • /uni03BC PB586G and /uni03BC PB588G are discontinued. INTERNAL BLOCK DIAGRAM D CLK CLK Q Q D CLK Q Q D CLK Q Q D CLK Q Q D CLK Q Q D CLK Q Q D CLK Q Q D CLK Q Q SW1 SW2 AMP OUT IN IN

μPB1507GV SYSTEM APPLICATION EXAMPLE RF unit block of Analog DBS tuners CMOS PLL synthesizer BPF SAW AGC amp. FM demo. LPF OSC MIX Baseband output High division prescaler PB1506GV or PB1507GV μ μ To 2150 MHz To 2650 MHz loop filter 1stIF input from DBS converter RF unit block of Analog CATV converter CMOS PLL synthesizer BPF BPF LPF OSC upconverterTo 800 MHz To 2000 MHz loop filter To 1300 MHz downconverter High division prescaler PB1506GV or PB1507GV μ μ

μPB1507GV PIN EXPLANATION Pin no. μPB1507GV IN ⎯ 2.9 Signal input pin. This pin should be coupled to signal source with capacitor (e.g. 1 000 pF) for DC cut. Applied voltage V Pin voltage V Pin name Functions and explanation IN ⎯ 2.9 Signal input bypass pin. This pin must be equipped with bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. GND 0 ⎯ Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. SW1 H/L ⎯ Divide ratio input pin. The ratio can be determined by following applied level to these pins. SW2 H L SW2 These pins should be equipped with bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. VCC 4.5 to 5.5 ⎯ Power supply pin. This pin must be equipped with bypass capacitor (e.g. 10 000 pF) to minimize ground impedance. OUT ⎯ 2.6 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to CMOS input due to 1.2 V P-P MIN output. NC ⎯ ⎯ Non connection pin. This pin must be openned. 7 SW1 H ÷64 ÷128 L ÷128 ÷256

μPB1507GV ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage VCC T A = +25 °C −0.5 to +6.0 V Input voltage Vin T A = +25 °C −0.5 to VCC + 0.5 V Total power dissipation PD Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) 250 mW Operating ambient temperature TA −40 to +85 °C Storage temperature Tstg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTICE Supply voltage VCC 4.5 5.0 5.5 V Operating ambient temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = −40 to +85 °C, VCC = 4.5 to 5.5 V, ZS = 50 Ω) PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Circuit current ICC No signals 12.5 19 26.5 mA Upper limit operating frequency fin(u) P in = −15 to +6 dBm 3.0 ⎯ ⎯ GHz Lower limit operating frequency 1 fin(L)1 P in = −10 to +6 dBm ⎯ ⎯ 0.5 GHz Lower limit operating frequency 2 fin(L)2 P in = −15 to +6 dBm ⎯ ⎯ 1.0 GHz Input power 1 Pin1 f in = 1.0 to 3.0 GHz −15 ⎯ +6 dBm Input power 2 Pin2 f in = 0.5 to 1.0 GHz −10 ⎯ +6 dBm Output Voltage Vout C L = 8 pF 1.2 1.6 ⎯ VP-P Divide ratio control input high VIH1 Connection in the test circuit VCC V CC V CC Divide ratio control input low VIL1 Connection in the test circuit OPEN or GND OPEN or GND OPEN or GND Divide ratio control input high VIH2 Connection in the test circuit VCC V CC V CC Divide ratio control input low VIL2 Connection in the test circuit OPEN or GND OPEN or GND OPEN or GND

μPB1507GV TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C) 00123 V CC - Supply Voltage - V ICC - Circuit Current - mA 456 CIRCUIT CURRENT vs. SUPPLY VOLTAGE No signals TA = +85°C TA = +25°C TA = –40°C Divide by 64 mode +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2100 1000 4000 f in - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs.INPUT FREQUENCY 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4100 1000 4000 f in - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs.INPUT FREQUENCY TA = +25°C TA = +25°C Pin = –10 dBm TA = –40°C Pin = –10 dBm VCC = 4.5 to 5.5 V Guaranteed Operating Window Guaranteed Operating Window VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V TA = –40°C TA = –40°C TA = +25°C TA = +25 °C TA = +85°C TA = +85°C

μPB1507GV 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4100 1000 4000 f in - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT RFEQUENCY TA = +85°C Pin = –10 dBm VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V Divide by 128 mode +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2100 1000 4000 f in - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY 100 1000 4000 fin - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY TA = +25°C TA = +25°C Pin = –10 dBm TA = –40°C Pin = –10 dBm VCC = 4.5 to 5.5 V Guaranteed Operating Window Guaranteed Operating Window VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V TA = –40°C TA = –40°C TA = +25°C TA = +25°C TA = +85°C TA = +85°C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V

μPB1507GV 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2100 1000 4000 f in - Input Frequency - MHz Vout - Output-Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY TA = +85°C Pin = –10 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Divide by 256 mode +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY +20 +10 –10 –20 –30 –40 –50 –60100 1000 4000 f in - Input Frequency - MHz Pin - Input Power - dBm INPUT POWER vs. INPUT FREQUENCY 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2100 1000 4000 f in - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY 100 1000 4000 fin - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY TA = +25°C TA = +25°C Pin = –10 dBm TA = –40°C Pin = –10 dBm VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V VCC = 4.5 to 5.5 V TA = –40°C TA = –40 °C TA = +25°C TA = +25°C TA = +85°C TA = +85°C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Guaranteed Operating Window Guaranteed Operating Window

μPB1507GV 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2100 1000 4000 fin - Input Frequency - MHz Vout - Output Voltage - VP-P OUTPUT VOLTAGE vs. INPUT FREQUENCY TA = +85°C Pin = –10 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V

μPB1507GV μPB1507GV S11 vs. INPUT FREQUENCY VCC = 5.0 V FREQUENCY S 11 MHz MAG ANG 500.0000 .857 –27.5 600.0000 .849 –32.0 700.0000 .800 –38.9 800.0000 .764 –43.8 900.0000 .725 –49.0 1000.0000 .665 –50.9 1100.0000 .619 –55.3 1200.0000 .573 –59.3 1300.0000 .531 –61.3 1400.0000 .484 –62.8 1500.0000 .439 –63.0 1600.0000 .377 –59.1 1700.0000 .340 –54.1 1800.0000 .377 –54.7 1900.0000 .441 –59.5 2000.0000 .464 –67.2 2100.0000 .443 –67.4 2200.0000 .466 –74.5 2300.0000 .465 –81.3 2400.0000 .454 –89.4 2500.0000 .433 –99.2 2600.0000 .383 –109.6 2700.0000 .350 –114.0 2800.0000 .332 –124.2 2900.0000 .271 –141.2 3000.0000 .185 –163.6 S11 REF 1.0 Units 200.0 mUnits/ 38.111 Ω 0.9707 Ω Z START STOP

0.500000000 GHz

3.000000000 GHz

3.0 GHz

C D : 500 MHz : 1000 MHz : 2000 MHz : 3000 MHz

μPB1507GV μPB1507GV S22 vs. OUTPUT FREQUENCY Divide by 64 mode, VCC = 5.0 V FREQUENCY S 22 MHz MAG ANG 45.000 .580 3.4 50.000 .572 2.5 55.000 .574 3.0 60.000 .574 2.7 65.000 .584 3.0 70.000 .587 2.6 75.000 .592 2.4 80.000 .587 2.6 85.000 .589 2.9 90.000 .591 2.9 95.000 .573 1.7 100.000 .604 2.9 S22 REF 1.0 Units 200.0 mUnits/ 185.13 Ω 17.789 Ω Z START STOP

0.045000000 GHz

0.100000000 GHz

45.0 MHz

C D : 45 MHz : 100 MHz μPB1507GV S22 vs. OUTPUT FREQUENCY Divide by 128 mode, VCC = 5.0 V FREQUENCY S 22 MHz MAG ANG 45.000 .578 3.2 50.000 .571 2.8 55.000 .572 3.3 60.000 .576 3.0 65.000 .584 3.1 70.000 .587 2.8 75.000 .589 2.4 80.000 .589 2.8 85.000 .588 3.0 90.000 .593 2.8 95.000 .598 3.0 100.000 .602 2.9 S22 REF 1.0 Units 200.0 mUnits/ 185.02 Ω 18.953 Ω Z START STOP C D : 45 MHz : 100 MHz

μPB1507GV μPB1507GV S22 vs. OUTPUT FREQUENCY Divide by 256 mode, VCC = 5.0 V FREQUENCY S 22 MHz MAG ANG 45.000 .580 3.0 50.000 .572 2.8 55.000 .571 2.9 60.000 .576 2.9 65.000 .585 3.2 70.000 .590 2.8 75.000 .589 2.5 80.000 .590 2.6 85.000 .588 2.9 90.000 .597 2.9 95.000 .600 3.1 100.000 .601 3.1 S22 REF 1.0 Units 200.0 mUnits/ 186.76 Ω 17.82 Ω Z START STOP C D : 45 MHz : 100 MHz

μPB1507GV TEST CIRCUIT μPB1507GV C1 C4 C7 Stray cap. 50 Ω IN VCC SW1 OUT IN NC SW2 GND 1 MΩ 0.6 pF Oscilloscope Monitor VCC = +5.0 V ±10% S.G OPEN 50 Ω or Counter

  • SG (HP-8665A) Divide ratio setting
  • Counter (HP5350B) : To measure input sensitivity SW2 or H L SW1 H 1/64 Oscilloscope : To measure output voltage swing L 1/128 1/256 H: Connect to VCC L: Connect to GND or OPEN

μPB1507GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD μPB1507GV VCC SW2 PB1507GVOUT IN C6C1 SW1 IN OUT μ EVALUATION BOARD CHARACTERS (1) 35 μm thick double-sided copper clad 50 × 50 × 0.4 mm polyimide board (2) Back side: GND pattern (3) Solder plated patterns (4) ° : Through holes

μPB1507GV PACKAGE DIMENSIONS

8 PIN PLASTIC SSOP (UNIT: mm) (175 mil)

3.0 MAX. 1.5 ±0.1 1.8 MAX. 0.1±0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.15 0.15 +0.10 –0.05 0.5 ±0.2 3.2 ±0.1 4.94 ±0.2 0.87 ±0.2 +7˚ –3˚ detail of lead end

μPB1507GV NOTE CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 10 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following re commended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. μPB1507GV Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 3 times, Limited days: no.* IR35-00-3 Hour: within 40 s. (more than 200 °C), Time: 3 times, Limited days: no.* VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s., Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s./pin, Limited days: no.* * It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions fo r surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).