UPA828TD RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: Computers; office equipment; co mmunications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti- crime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. 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Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesa s Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesa s Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority- owned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. NPN SILICON RF TWIN TRANSISTOR μPA828TD NPN SILICON RF TRANSISTOR (WITH 2 ELEMENTS) IN A 6-PIN LEAD-LESS MINIMOLD (M16, 1208 PKG) Document No. PU10402EJ03V0DS (3rd edition) Date Published February 2008 NS Printed in Japan 2003, 2008
FEATURES
- Built-in low phase distortion trans istor suited for OSC applications fT = 9.0 GHz TYP., ⏐S21e⏐ = 7.5 dB TYP. @ VCE = 1 V, IC = 10 mA, f = 2 GHz NF = 1.3 dB TYP. @ VCE = 1 V, IC = 3 mA, f = 2 GHz Built-in 2 transistors (2 × 2SC5436) 6-pin lead-less minimold (M16, 1208 PKG) BUILT-IN TRANSISTORS Q1, Q2 3-pin thin-type ultra super minimold part No. 2SC5436
ORDERING INFORMATION
Part Number Order Number Package Quantity Supplying Form μPA828TD μPA828TD-A 50 pcs (Non reel) 8 mm wide embossed taping μPA828TD-T3 μPA828TD-T3-A 6-pin lead-less minimold (M16, 1208 PKG) (Pb-Free) 10 kpcs/reel Pin 1 (Q1 Collector), Pin 6 (Q1 Base) face the perforation side of the tape Remark To order evaluation samples, contact your nearby sales office. The unit sample quantity is 50 pcs. <R>
Data Sheet PU10402EJ03V0DS 2 μPA828TD ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Symbol Ratings Unit Collector to Base Voltage VCBO 5.0 V Collector to Emitter Voltage VCEO 3.0 V Emitter to Base Voltage VEBO 2 V Collector Current IC 30 mA Total Power Dissipation Ptot Note 90 in 1 element mW 180 in 2 elements Junction Temperature Tj 150 °C Storage Temperature Tstg −65 to +150 °C Note Mounted on 1.08 cm × 1.0 mm (t) glass epoxy PCB ELECTRICAL CHARACTERISTICS (TA = +25°C) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit DC Characterstics Collector Cut-off Current ICBO V CB = 5 V, IE = 0 mA − − 100 nA Emitter Cut-off Current IEBO V EB = 1 V, IC = 0 mA − − 100 nA DC Current Gain hFE Note 1 V CE = 2 V, IC = 20 mA 70 − 140 − RF Characterstics Gain Bandwidth Product (1) fT V CE = 1 V, IC = 10 mA, f = 2 GHz 7.0 9.0 − GHz Gain Bandwidth Product (2) fT V CE = 2 V, IC = 20 mA, f = 2 GHz 9.0 11.0 − GHz Insertion Power Gain (1) ⏐S21e⏐ V CE = 1 V, IC = 10 mA, f = 2 GHz 6.0 7.5 − dB Insertion Power Gain (2) ⏐S21e⏐ V CE = 2 V, IC = 20 mA, f = 2 GHz 7.0 8.5 − dB Noise Figure (1) NF VCE = 1 V, IC = 3 mA, f = 2 GHz, ZS = Zopt − 1.3 2.0 dB Noise Figure (2) NF VCE = 2 V, IC = 3 mA, f = 2 GHz, ZS = Zopt − 1.3 2.0 dB Reverse Transfer Capacitance C re Note 2 V CB = 2 V, IE = 0 mA, f = 1 MHz − 0.4 0.8 pF hFE Ratio hFE1/hFE2 VCE = 2 V, IC = 20 mA, hFE1 : Smaller value of Q1 and Q2, hFE2 : Larger value of Q1 and Q2 0.85 − − − Notes 1. Pulse measurement: PW ≤ 350 μs, Duty Cycle ≤ 2% 2. Collector to base capacitance when the emitter grounded. hFE CLASSIFICATION Rank FB Marking kL hFE Value 70 to 140
Data Sheet PU10402EJ03V0DS 3 μPA828TD TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) f = 1 MHz 0.5 0.4 0.3 0.2 0.1 0 24 315 VCE = 2 V 100 0.01 0.001 0.1 0.0001 300 250 150 200 180 100 0 25 50 75 100 125 150 0 213 4 100 Aμ 200 Aμ 250 Aμ 150 Aμ IB = 50 Aμ
300 Aμ350 Aμ
500 Aμ 450 Aμ
400 Aμ VCE = 1 V 100 0.01 0.001 0.1 0.0001 Mounted on Glass Epoxy PCB
2 Elements in total
Total Power Dissipation Ptot (mW) Ambient Temperature TA (˚C) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE Reverse Transfer Capacitance Cre (pF) Collector to Base Voltage VCB (V) REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE Collector Current IC (mA) Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Collector Current IC (mA) Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Collector Current IC (mA) Collector to Emitter Voltage VCE (V) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE Remark The graphs indicate nominal characteristics. <R>
Data Sheet PU10402EJ03V0DS 4 μPA828TD 1 000 100 10.1 10 100 VCE = 1 V 1 000 100 10.1 10 100 VCE = 2 V 1 10 100 VCE = 1 V f = 2 GHz 1 10 100 VCE = 2 V f = 2 GHz VCE = 1 V IC = 10 mA MAG MSG |S21e|2 0.1 1 10 VCE = 2 V IC = 10 mA MAG MSG |S21e|2 0.1 1 10 DC Current Gain hFE Collector Current IC (mA) DC CURRENT GAIN vs. COLLECTOR CURRENT DC Current Gain hFE Collector Current IC (mA) DC CURRENT GAIN vs. COLLECTOR CURRENT Gain Bandwidth Product fT (GHz) Collector Current IC (mA) GAIN BANDWIDTH PRODUCT vs. COLLECTOR CURRENT Gain Bandwidth Product fT (GHz) Collector Current IC (mA) GAIN BANDWIDTH PRODUCT vs. COLLECTOR CURRENT Frequency f (GHz) INSERTION POWER GAIN, MAG, MSG vs. FREQUENCY Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Frequency f (GHz) INSERTION POWER GAIN, MAG, MSG vs. FREQUENCY Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Remark The graphs indicate nominal characteristics.
Data Sheet PU10402EJ03V0DS 5 μPA828TD VCE = 1 V f = 1 GHz 1 10 100 VCE = 2 V f = 1 GHz MAGMSG |S21e|2 1 10 100 MAGMSG |S21e|2 VCE = 1 V f = 2 GHz 1 10 100 MAGMSG |S21e|2 VCE = 2 V f = 2 GHz 1 10 100 MAGMSG |S21e|2 VCE = 1 V f = 4 GHz 1 10 100 MAG |S21e|2 VCE = 2 V f = 4 GHz 1 10 100 MAG |S21e|2 Collector Current IC (mA) INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Collector Current IC (mA) INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Collector Current IC (mA) INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Collector Current IC (mA) INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Collector Current IC (mA) INSERTION POWER GAIN, MAG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Collector Current IC (mA) INSERTION POWER GAIN, MAG vs. COLLECTOR CURRENT Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Remark The graphs indicate nominal characteristics.
Data Sheet PU10402EJ03V0DS 6 μPA828TD 1 10 100 VCE = 1 V f = 1 GHz NF Ga 3 12 1 10 100 VCE = 2 V f = 1 GHz NF Ga 3 12 1 10 100 VCE = 1 V f = 1.5 GHz NF Ga 3 12 1 10 100 VCE = 2 V f = 1.5 GHz NF Ga 3 12 1 10 100 VCE = 1 V f = 2 GHz NF Ga3 12 1 10 100 VCE = 2 V f = 2 GHz NF Ga 3 12 Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Collector Current IC (mA) NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT Noise Figure NF (dB) Associated Gain Ga (dB) Remark The graphs indicate nominal characteristics.
Data Sheet PU10402EJ03V0DS 7 μPA828TD PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (M16, 1208 PKG) (UNIT: mm) 0.5±0.05 0.125+0.1 –0.05 0.40.4 0.8 0.15±0.05 1.2+0.07 –0.05 0.8+0.07 –0.05 1.0±0.05 1 2 3 6 5 4 kL PIN CONNECTIONS 1. Collector (Q1) 2. Emitter (Q1) 3. Collector (Q2) 4. Base (Q2) 5. Emitter (Q2) 6. Base (Q1) (Top View)
μPA828TD The information in this document is current as of February, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":