UPA1602GS

UPA1602 NEC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 8

Technical content

COMPOUND FIELD EFFECT POWER TRANSISTOR uPA1602 MONOLITHIC POWER MOS FET ARRAY

DESCRIPTION

The uPA1602 is Monolithic N-channel Power MOS FET Array that built CONNECTION DIAGRAM in 7 circuits designed for LED, Relay, Thermal Head, and so on. FEATURES OQ: Oz Os Os Os Os O7 Voo © Direct driving is possible by standard Logic IC or Microcomputer. is fal fol [9] (4 V driving is possible) oe © Output Voltage: Vo = 30 V MAX. AAAAAAA Output Current: lo = 500 mA MAX. , 7 7 7 Pe FP @ Low Input Active a CT ET Bl 5] © Ron = 3.Q TYP. at: lo = 150 mA, Vi= 4.5 V i ko b bw b& b b GND © Large Operation Temperature: -40 to +85 °C 1 Input O : Output ORDERING INFORMATION Voo : Supply Voltage Equivalent Cireuits (1/7 Circuit) Please refer to “Quality grade on NEC Semiconductor Devices” (Docu- Voo ment number IEI-1209) published by NEC Corporation to know the [7° OUT specification of quality grade on the devices and its recommended i applications. N = a ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) Loan Supply Voltage Vop -0.5 to +7.0 Vv Output Voltage Voie) 30 Vv Output Peak Voltage* Voipeak) 50 Vv Input Voltage vi —0.5 to Vop +0.5 Vv Output Current (DC) loioc) 430 mA/unit Output Current (pulse)** loxputse) 500 mAJunit Input Current h +10 mA/unit Total Power Dissipation Pr 1.0 W/PKG Operating Temperature Topt 40 to +85 °c Storage Temperature Tstg -55 to +150 °c * PW 10 ms, Duty Cycle £10 % ** PW S$ 10 ms, Duty Cycle 5 30 % Document No. IC-3370 Date Published March 1994 M Printed in Japan © NEC Corporation 1994

RECOMMENDED OPERATING CONDITIONS (Ta = -40 to +85 °C) CHARACTERISTIC [svmeor [win [ave | wax | owt | Test conomions ee Output Current , Ajunit PW £10 ms, Ouse) mNun't | Duty Cycle $25 %, 7 circuits fieavee wpe pp ELECTRICAL CHARACTERISTICS (Ta = 25 °C) CHARACTERISTIC sympo. | MIN. | Typ. | max. | UNIT | TEST CONDITIONS [ap ma [vor s5v, Vico supply Current [| tooo fo | Output Leakage Coron ee ee eS Output On-state Voltage input Voltage Input Current [iow cede Pe belay Ti ee ee eee y Time , pow fo P| Vive sv, = 15 oF See Fig. 1 Fig. 1 Switching Wave Forms and Test Circuits t t ve ov oc = 1 30% Input 50 % Voo = 5V ho % 1002 1 ouT ‘tPLH: ‘TPHL @s v 15 pF ‘tH ‘tHe 1 J , 30% i 7 Output 50 % 10 %

TYPICAL CHARACTERISTICS (Ta = 25 °C) Pr - Ta Characteristic lo - Vo Characteristic 1.2 1.2 et IN| | | on a

3 L Z\\

& 08 ~ N = 08 Wa a 5 ft | IN | Ft | I de = 04 NS 6 04 L ee ee 0 fo eo | Zr are a Yi | | | 0 20 40 60 80 100 120 0 1 2 3 4 5 Ta - Ambient Temperature ~ °C Vo - Output Voltage - V lo - Von Characteristic Vion), Vuorr) - Ta Characteristic Se 1.70 EERE ER SSS Tet | | | | TT 4 whee 165 , == SSS ey tT Ty ey § oft Zoo SS _

2 SS TL | Shed

== SS — i PMor

9 Qo Sass ox

—=—— === == ev] TT yt yt ya wl TT Py tT tT Py 1.50 (0) 1 2 3 4 5 -50 oO 50 100 150 Voo - Supply Voltage - V Ts - Ambient Temperature - °C Ron — lo Characteristic Ron ~ Voo Characteristic 4 ‘ lo = 150 mA 8 8 Cl FA 10 100 1000 it) 2 4 6 8 10 lo — Output Current - mA Voo - Supply Voltage - V

Ron ~ Ta Characteristic Iso ~ Vso Characteristic a § == t . SS = SSS 7 eee .===S=——— & 4 ea # a a ace, Pitt) pee E wlbeee Zoom 2° pea . JSS @ Le] 2 Peo g ? PT TTT TT £ ott tft f | fd ge, a ° lo = 150 mA 1 SS SS UN NN SN SCCCCCEF) 3 ARREEEEA & 4 hen wll | tT | | tT -50 0 50 100 150 0 04 08 1.2 1.6 Ta- Ambient Temperature - °C Vso — Source to Drain Voltage - V ‘tent, teLH, tra, trun — lo Characteristic o — os oc io |

2 Eee ed

= L TTT Tri Py & SSS ae

1 SSS Coin ot

SES eae att & tee CE 2.0L LLM TTT TTT 10° 10° 107 10° lo - Output Current - mA

• uPA1602CX 16PIN PLASTIC DIP (300 mil) 16 9 1 8 A K P ° VOID ORR in Wy F He D cB M O~15" P16C-100-3008.¢ NOTES TEM MILLIMETERS INCHES 1) Each lead centerline is located within 0.25 — fe 2) Item “k" to center of leads when formed | ——_-__— alae parallel \\ La 0.50 0.020 - 0.008 iF 1.2 MIN. 0.047 MIN i 203 +0.012 LL G - 3.5 0.138* | oH 0.51 MIN 0.020 MIN. | 1 4.31 MAX 0.170 MAX. | oJ 5.08 MAX. 0.200 MAX. i L 6.4 0.252 M 0.25 8:08 0.010 “8.885 N 0.25 0.01 P 1.0 MIN 0.039 MIN.

+ uPA1602GS

16 PIN PLASTIC SOP (300 mil)

— On, ORR ESE ® oOoooOoOndonOoo oo 7 8 A H oO i] J En | ul {Arroyo aan He w Ee] aL) B o (elm @) P16GM-50-3008-3 NOTE iTeEM| = MILLIMETERS INCHES Each lead centerline is located within 0.12 1.8 MAX. 0.071 MAX. 7.7403 0.303+0.012 bef ae [a8 cx [ver | 000]

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICES MOUNTING TECHNOLOGY MANUAL” (IEI-1207). uPA1602GS Soldering proves Soldering conditions Infrared ray reflow Peak package's surface temperature: 235 °C or below, 1R35-00-2 Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2 or below, Exposure limit*: None VPS Peak package's surface temperature: 215 °C or below, VP15-00-2 Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2 or below, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, WS60-00-1 Flow time: 10 seconds or below, Number of flow process: 1, Exposure Limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method”. TYPES OF THROUGH HOLE MOUNT DEVICE HPA1602CX Soldering process Soldering conditions Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below Reference Quality control guide of semiconductors devices. Assembly manual of semiconductors devices. 1EI-1207 Semiconductor device package manual | terizis | SMD surface mount technology manual

[MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6