UP5 EATON | Alldatasheet

Document overview

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Technical content

Description

  • 18.54 x 15.24 x 7.11mm maximum surface mount package
  • Ferrite core material
  • Inductance range from 1.0μH to 1000μH
  • Current range from 0.56 to 20 Amps
  • Frequency range up to 1MHz
  • RoHS compliant

Applications

  • Buck or boost inductor
  • Desktop computer
  • Workstations/servers
  • DVD Players
  • Portable power devices
  • Base stations
  • Industrial power supplies
  • Output filter chokes
  • Test equipment instrumentation Environmental Data
  • Storage temperature range: -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE UP5 High power, drum inductors

High power, drum inductors www.eaton.com/elx Product Specifications Part Number5 OCL1 μH ± 20% Irms2 (amps) sat3 (amps) @25°C SRF MHz typical DCR mΩ @ 20°C Maximum K-factor4 UP5-101-R 100 1.8 3.0 5.7 190 7.98 UP5-151-R 150 1.5 2.6 4.5 250 6.56 UP5-221-R 220 1.2 2.4 3.7 380 5.39 UP5-331-R 330 1.0 1.9 3.0 560 4.39 UP5-471-R 470 0.82 1.4 2.7 850 3.70 UP5-681-R 680 0.72 1.2 2.2 1100 3.08 UP5-102-R 1000 0.56 1.0 2.0 1800 2.54 Dimensions (mm) 1. OpenCircuitInductance(OCL)TestParameters:100kHz,0.25Vrms,0.0Adc 2. Irms: DC current for an approximate ΔT rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generat- ing components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 10% rolloff at 25°C. 4. K-factor:UsedtodetermineBp-pforcoreloss(seegraph).Bp-p=K*L* ΔI,Bp-p:(Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 5. Part Number Definition: UP5-xxx-R

  • UP5 = Product code and size
  • xxx= Inductance value in μH, R = decimal point. If no R is present, then third digit equals the number of zeros.
  • “-R” suffix = RoHS compliant xxx = Inductance value in μH (R = Decimal point). If no “R” is present, then the third digit equals the number of zeros. wwllyy = Date code R = Revision level

High power, drum inductors www.eaton.com/elx T emperature rise vs. total loss Packaging information Supplied in tape-and-reel packaging, 250 parts per reel, 13” diameter reel. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Temerature Rise (°C) Total Loss (W)

High power, drum inductors www.eaton.com/elx Core loss Inductance characteristics 0.001 0.01 0.1 000010001001 Core Loss (W) B( Gauss) Core Loss vs. Bp-p 300kHz 200kHz 100kHz p-p 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 20% 40% 60% 80% 100% 120% 140% 160% 180% 200% % of OCL % of Isat % of OCL vs. Isat -40°C +25°C +85°C

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4409 BU09493 December 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4409 Effective December 2015 UP5 High power, drum inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C