UP2UC EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • 12.7 mm x 9.5 mm x 5.21 mm drum core
  • Inductance range from 1.0 µH to 1000 µH
  • Current range from 0.30 A to 9.0 A
  • Ferrite core material

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant UP2UC UNI-PAC™ drum core power inductors
  • Desktop computer
  • Workstations/servers
  • DVD Players
  • Portable power devices
  • Base stations
  • Industrial power supplies
  • Output filter chokes
  • Test equipment instrumentation
  • Buck or boost inductor Environmental data Pb HALOGEN HFFREE

www.eaton.com/electronics Technical Data 4369 Effective August 2017 Product specifications Dimensions-mm UP2UC UNI-PAC™ drum core power inductors Tolerances are ±0.254 mm unless otherwise specified. Do not route traces or vias underneath the inductor Packaging information-mm 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc 2I rms: DC current for an approximate ΔT rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generat- ing components will affect the temperature rise. It is recommended the part temperature not exceed +125 °C under worst case operating conditions verified in the end application. 3I sat: Peak current for approximately 7.5% rolloff at +25 °C. 4 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI, Bp-p: (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

6 Part Number Definition: UP2CU-xxx-R

 UP2CU = Product code and size  xxx= Inductance value in μH, R = decimal point. If no R is present, then third digit equals the number of zeros.  “-R” suffix = RoHS compliant OCL1 Irms2 Isat3 SRF MHz DCR mΩ@ +20 °C DCR mΩ@ +20 °C Part Number5 µH ± 20% (A) (A) @ +25 °C Typical Typical Maximum K-factor 4 UP2UC-101-R 100 1.3 1.2 9.0 211 280 20.89 UP2UC-151-R 150 1.0 1.0 6.0 347 400 15.80 UP2UC-221-R 220 0.80 0.80 5.0 491 610 13.04 UP2UC-331-R 330 0.60 0.60 4.5 750 1020 10.85 UP2UC-471-R 470 0.50 0.50 3.5 1188 1270 9.39 UP2UC-681-R 680 0.40 0.40 2.5 1811 2020 7.56 UP2UC-102-R 1000 0.30 0.30 2.0 2757 3000 6.13 Top View Side View Bottom View Recommended Pad Layout Schematic 9.3 ±0.2 8.4 ±0.15 5.21 max 2.54 ±0.2 7.62 typ 2.54 ±0.2 2.92 ref 7.62 ref 2.79 ref 12.7 ±0.25 UP2UC- xxx wwllyy R Part Marking: UP2UC xxx = Inductance value in μH (R = Decimal point). If no “R” is present, then the third digit equals the number of zeros. wwllyy = Date code R = Revision level 2.0 1.5 dia. 1.75 4.0 16 11.5 24 ±0.30 UP2UC- UP2UC- UP2UC- 13.4 xxx xxx xxx wwllyy R wwllyy R wwllyy R 4.40 User direction of feed 5.5 9.70 Section A-A Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel.

3www.eaton.com/electronics Technical Data 4369 Effective August 2017 UP2UC UNI-PAC™ drum core power inductors Temperature rise vs total loss Core loss vs Bp-p Inductance characteristics Total Loss (W ) Tem perature Ri se (°C) Co re Lo ss v s . B p -p 500kHz 400kHz 1 300kHz 200kHz 0.1 100kHz 0.01 0. 001 0. 0001 0. 00001 100 1000 10000 Co re Loss (W ) Bp-p (Gauss) % of O CL v s I sat 110% 100% 90% 80% -40°C 70% +25°C 60% +85°C 50% 40% 30% 20% 10% % of I s at % of OC L 20% 40% 60% 80% 100% 120% 140% 160% 180%

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4369 BU09493 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Technical Data 4369 Effective August 2017 UP2UC UNI-PAC™ drum core power inductors