UMX5101 MICROSEMI | Alldatasheet
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Technical content
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 1Copyright 2006 Rev. A, 2006-12-28 UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS www.MICROSEMI.com RoHS COMPLIANT
DESCRIPTION
The UMX5101 PIN diode series was designed to provide ultra low magnetic PIN diodes for in bore surface coil applications associated with higher field strength (3T and greater) MR scanners. These PIN diodes produce the minimum artifacts (magnetic field distortions) available in the industry, today. The diodes have been tested in magnetic fields of ±7 Tesla. The UMX5101 PIN diodes have a magnetic moment at 7 T of 2E-8 (J/T). The diodes are offered in a surface mount package. The SM package utilizes a square end cap to mark the cathode. The anode is round. The fully SOGO passivated PIN diode chip is full face metallurgically bonded to high conductive pins for lower thermal and electrical resistances. The PIN diodes feature low forward bias resistance and high zero bias impedance. The UMX5101 PIN diodes are characterized at 64, 128, and 300 MHz. The UMX5101 meets RoHS requirements per EU Directive 2002/95/EC. ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 100 100 100 V RMS Reverse Voltage V R (RMS) 75 V Storage Temperature T stg -65 to +175 ºC Operating Temperature Non-Repetitive Peak T op -65 to +150 ºC THERMAL CHARACTERISTICS AT 25º C (UNLESS OTHERWISE SPECIFIED) Thermal Resistance UMX5101SM θ 20 ºC/Watt IMPO RT ANT:F orth emos tcu rr entda t a,co n sul tMICROSEMI’swebsite: www.MICROSEMI.com KEY FEATURES Ultra low magnetic construction SOGO passivated chip Thermally matched configuration RoHS compliant 1 Low capacitance at 0 V bias Low conductance at 0 V bias Metallurgical bond Fused-in-glass construction Non cavity design Available in surface mount package. Compatible with automatic insertion equipment 1- These devices are supplied with Silver terminations. Other terminal finishes may be available on request. Consult factory for details. APPLICATIONS/BENEFITS High B Field (3T+) in bore APPLICATIONS: Active or semi-active (not passive) MR blocking circuits MR detuning circuits MR disable circuits MR receiver protector circuits UUMMXX55110011
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 2Copyright 2006 Rev. A, 2006-12-28 UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS www.MICROSEMI.com RoHS COMPLIANT ELECTRICAL PARAMETERS @ 25C (UNLESS OTHERWISE SPECIFIED) Parameter Symbol Conditions Min Typ. Max Units Forward Voltage (Note 1) VF IF = 100 mA 0.82 1.0 V Reverse Break Down Voltage VBR IR = 10 uA 100 V Reverse Current IR VR = 100 V 10 uA Inductance Ls 800 pH @ 7T 2E-8 Magnetic moment m @ 1T 5E-8 J/T @ 7T -2.7E-11 Mass Susceptibility χρ @ 1T 1.2E-9 m3/kg >1T to 7T -2.4E-7 Volume Susceptibility χ <1 T 1.0E-5 SI VR = 0 V, F = 1 MHz 2.5 3.0 Capacitance CT VR = 100 V, F = 1 MHz 1.0 1.2 pF VR = 0 V, F = 64 MHz 10 30 Parallel Resistance RP VR = 30 V, F = 64 MHz 800 1000 kΩ Series Resistance RS If = 100 mA F = 64 MHz 0.8 1.0 Ω Lifetime τ If = 10 mA 2 2.5 us EELLEECCTTRRIICCAALLSS
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 3Copyright 2006 Rev. A, 2006-12-28 UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS www.MICROSEMI.com RoHS COMPLIANT MAGNETIC MOMENT VS F IELD C - V CURVES R P –PARALLEL R ESISTANCE RS VS IF GGRRAAPPHHSS GGRRAAPPHHSS
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 4Copyright 2006 Rev. A, 2006-12-28 UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS www.MICROSEMI.com RoHS COMPLIANT VF VS IF S M STYLE SOLDER FOOTPR INT NOTES: 1. These dimensions will match the terminals and provide for additional solder fillets at the outboard ends at least as wide as the terminals themselves, assuming accuracy of device placement within .005 inches. 2. If the mounting method chosen requires use of an adhesive separate from the solder compound, a round (or square) spot of cement as shown should be centrally located. Dimensions shown are in inches “ SM” STYLE PACKAGE O UTLINE D I M E N S I O N S S H O W N A R EI N I N C H E S GGRRAAPPHHSS//MMEECCHHAANNIICCAALL
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 5Copyright 2006 Rev. A, 2006-12-28 UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS www.MICROSEMI.com RoHS COMPLIANT NOTES: NNOOTTEESS