UML6N MCC | Alldatasheet

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Features

  • 2SC5585 and RB521S-30 are housed independently /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents

20736 Marilla Street Chatsworth

/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06 /G06 /G06 /G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 www.mccsemi.com MARKING:L6 D E1 E e A2 C b L1 L SOT-353 DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A2 .035 .039 0.900 1.000 b .006 .014 0.150 0.350 c .003 .006 0.080 0.150 D 0.79 .087 2.000 2.200 E .045 .053 1.150 1.350 E1 .085 .096 2.150 2.450 e .026TYP 0.650TYP e1 .047 .055 1.200 1.400 L .021REF 0.525REF L1 .010 .018 0.260 0.460 Revision: A 2011/01/011 of 4 Tr2Di1 (1) (2) (3) (4)(5) zAbsolute maximum ratings (Ta=25°C) Di1 Parameter Symbol IO IFSM VR Tj Limits 200 125 Unit mA A V Average revtified forward current Forward current surge peak (60Hz, 1∞) Reverse voltage (DC) Junction temperature Tr2 Parameter Symbol VCBO VCEO VEBO IC ICP Pd Tj Limits 500 120 150 Unit V V V mA A mW ∗1 Each terminal mounted on a recommended. Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Power dissipation Junction temperature Di1 / Tr2 Parameter Symbol Pd Tstg Limits 150 −55 to +125 Unit mW Power dissipation Storage temperature * Each terminal mounted on a recommended. MCC TM Micro Commercial Components 3 2 1

  • Lead Free Finish/RoHS Compliant ("P" Suffix designates RoHS Compliant. See ordering information)
  • Epoxy meets UL 94 V-0 flammability rating
  • Moisure Sensitivity Level 1

www.mccsemi.com Revision: A 2011/01/01 TM Micro Commercial Components 2 of 4 zElectrical characteristics (Ta=25°C) Di1 Parameter Symbol Min. Typ. Max. Unit Conditions VF − 0.40 0.50 V IF=200mAForward voltage Reverse current IR − 4.0 30 µAV R=10V Tr2 Parameter Symbol Min. Typ. Max. Unit Conditions VCB=10V, IE=0mA, f=1MHz Transition frequency fT − 320 − MHz VCE=2V, IE=−10mA, f=100MHz BVCEO 12 −− V IC=1mACollector-emitter breakdown voltage BVCBO 15 −− V IC=10µACollector-base breakdown voltage BVEBO 6 −− V IE=10µAEmitter-base breakdown voltage ICBO −− 100 nA V CB=15VCollector cut-off current IEBO −− 100 nA V EB=6VEmitter cut-off current VCE(sat) − 90 250 mV IC=200mA, IB=10mACollector-emitter saturation voltage hFE 270 − 680 − VCE=2V, IC=10mADC current gain Cob − 7.5 − pFCollector output capacitance

www.mccsemi.com Revision: A 2011/01/01 TM Micro Commercial Components 3 of 4 zElectrical characteristic curves Tr2 Fig.3 Grounded emitter propagation characteristics 100 1000 BASE TO EMITTER VOLTAGE : VBE (V) COLLECTOR CURRENT : IC (mA) VCE=2V Pulsed Ta=125 Ta=25 Ta= −40 1 10 100 1000 COLLECTOR CURRENT : IC (mA) Fig.4 DC current gain vs. collector current DC CURRENT GAIN : hFE 1000 100 Ta=125°C Ta=−40°C Ta=25°C VCE=2V Pulsed Fig.5 Collector-emitter saturation voltage vs. collector current ( Ι ) 1 10 100 1000 COLLECTOR CURRENT : IC (mA) COLLECTOR SATURATION VOLTAGE : VCE(sat) (mV) 1000 100 Ta=25°C Pulsed IC/IB=50 IC/IB=20 IC/IB=10 Fig.6 Collector-emitter saturation voltage vs. collector current ( ΙΙ ) 1 10 100 1000 COLLECTOR CURRENT : IC (mA) COLLECTOR SATURATION VOLTAGE : VCE (sat) (mV) 1000 100 Ta=125°C 25°C −40°C IC/IB=20 Pulsed 1 10 100 1000 COLLECTOR CURRENT : IC (mA) Fig.7 Base-emitter saturation voltage vs. collector current BASER SATURATION VOLTAGE : VBE (sat) (mV) 100 10000 1000 Ta=25°C Ta=−40°C Ta=125°C IC/IB=20 Pulsed Fig.8 Gain bandwidth product vs. emitter current 1 10 100 1000 EMITTER CURRENT : IE (mA) TRANSITION FREQUENCY : fT (MHz) 1000 100 VCE=2V Ta=25°C Pulsed Di1 10µ 100µ 10m 100m FORWARD CURRENT : IF (A) FORWARD VOLTAGE : VF (V) C°521=aT C°57 C°52 C°52− Fig.1 Forward characteristics 10n 100n 10µ 100µ 10m REVERSE CURRENT : IR (A) REVERSE VOLTAGE : VR (V) 01 0 2 0 30 Ta=125°C 75°C 25°C −25°C Fig.2 Reverse characteristics

Revision: A 2011/01/01 TM Micro Commercial Components www.mccsemi.com 4 of 4 Ordering Information : Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. MCC's products are not authorized for use as critical components in life support devices or systems without the express written approval of Micro Commercial Components Corporation. Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. Device Packing Part Number-TP Tape&Reel;3Kpcs/Reel