UMC3N FS | Alldatasheet

Document overview

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Technical content

Features

  • Pb−Free Packages are Available
  • Simplifies Circuit Design
  • Reduces Board Space
  • Reduces Component Count

Ordering Information

Thermal Resistance − Junction-to-Ambient (surface mounted) RθJA 833 °C/W V V R1 R2 13 2

  1. 08. 30 2/5Revision No : 0 UMC3N OFF CHARACTERISTICS Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO − − 100 nAdc Collector-Emitter Cutoff Current (VCB = 50 V, IB = 0) ICEO − − 500 nAdc Emitter-Base Cutoff Current (VEB = 6.0, IC = 0 mA) IEBO − − 0.5 mAdc ON CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 − − Vdc Collector-Emitter Breakdown Voltage (IC = 2.0 mA, IB = 0) V(BR)CEO 50 − − Vdc DC Current Gain (VCE = 10 V, IC = 5.0 mA) hFE 35 60 − Collector−Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(SAT) − − 0.25 Vdc Output Voltage (on) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k ) VOL − − 0.2 Vdc Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k ) VOH 4.9 − − Vdc Input Resistor R1 7.0 10 13 k Resistor Ratio R1/R2 0.8 1.0 1.2 Electrical Characteristics (TA = 25°C) Q1 Transistor:PNP OFF CHARACTERISTICS Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO − − 100 nAdc Collector-Emitter Cutoff Current (VCB = 50 V, IB = 0) ICEO − − 500 nAdc Emitter-Base Cutoff Current (VEB = 6.0, IC = 0 mA) IEBO − − 0.5 mAdc ON CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 − − Vdc Collector-Emitter Breakdown Voltage (IC = 2.0 mA, IB = 0) V(BR)CEO 50 − − Vdc DC Current Gain (VCE = 10 V, IC = 5.0 mA) hFE 35 60 − Collector−Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) VCE(SAT) − − 0.25 Vdc Output Voltage (on) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k ) VOL − − 0.2 Vdc Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k ) VOH 4.9 − − Vdc Input Resistor R1 7.0 10 13 k Resistor Ratio R1/R2 0.8 1.0 1.2 Q2 Transistor:NPN
  1. 08. 30 5/5Revision No : 0 UMC3N NOTES: 1. D MENSIONING AND TOLERANC NG PER ANSI Y14 5M, 1982. 2. CONTROLLING D MENSION: NCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. D MENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 B0.2 (0.008)M M 1 2 3 A G S D 5 PL H C N J K −B− SC−88A/SOT−353 SOLDERING FOOTPRINT* mm inchesSCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748