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Rev: 3/30/2009 WWW . Microsemi. CO M Microsemi Microwave Products

75 Technology Drive, Lowell MA 01851 Tel: (978) 442-5600

SWITCHING / ATTENUATOR PIN DIODES

DESCRIPTION

The UM4300 and UM7300 series combine a diode chip of extremely thick intrinsic region with a low thermal resistance constr uction. This results in diodes uniquely applicable to very low distortion linear attenuators and specialized functions. The UM4300 series, with large cross-sectional chip area offers the highest power capability, of the two series. The UM7300 series offers lower capacitance. Both diode series are intended for use in lin ear attenuators operating from HF to beyond 1 GHz. Low distortion is a result of transit time frequencies below 5 MHz. Operated as RF switches, either diode se ries can be operated at low dc reverse bias voltages, to hold off much higher RF voltage levels. ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) UM4300 UM7300 Pkg Condition PD (W) θ (°C/W) PD (W) θ (°C/W) A 25 °C Pin Temperature 20 7.5 7.5 20 B & E ½ in. total length to 25 °C Contact Free Air 2.5 15 4 37.5 C 25 °C Stud Temperature 20 7.5 7.5 20 D 25 °C Stud Temperature 15 10 6 25 SM 25 °C End Cap Temperature 15 20 5.5 18 ALL 1 us pulse (Single) 500 kW 100 kW KEY FEATURES  Extremely low distortion performance  Useful frequency range extends below 500 kHz  Power dissipation to 20 W (UM4300)  Capacitance as low as 0.7 pF (UM7300)  Voltage ratings to 1000V  Non cavity design  Thermally matched  Isolated stud package available APPLICATIONS / BENEFITS  RF Switching  RF Attenuators  Pick and Place compatible  Surface Mount Versions RoHS compliant packaging available: use UMX4301SM, etc VOLTAGE RATINGS Reverse Voltage @ 10uA Part Number

100 UM4301 UM7301

200 UM4302 UM7302

600 UM4306 UM7306

1000 UM4310 UM7310

IMPORTANT: For the most current data consult MICROSEMI’s website: www.MICROSEMI.com 1 - RoHS compliant versions of the UM4300 and UM7300 are available. Specify UMX4300 or UMX7300 for RoHS version. Consult factory for details. UUMM44330000 // UUMM77330000

Rev: 3/30/2009 WWW . Microsemi. CO M Microsemi Microwave Products SWITCHING / ATTENUATOR PIN DIODES ELECTRICAL CHARACTERISTICS (@ 25°C unless otherwise specified) Parameter Symbol Conditions UM4300 UM7300 Units Reverse Current (Max) IR At rated voltage 10 10 uA Series Resistance(Max) RS If = 100 mA, F= 100 MHz 1.5 3.0 Ohms Series Resistance(Min) RS If = 10 uA, F= 100 MHz 1000 3000 Ohms Capacitance (Max) CT VR = 100 V, F = 1 MHZ 2.2 0.7 pF Parallel Resistance(Min) RP VR = 100 V, F = 100 MHz 200k 150k Ohms Carrier Lifetime(Min) τ IF = 10 mA 6.0 4.0 us I-Region Width (Min) W - - 250 250 um TYPICAL RS VS IF TYPICAL IF VS VF Vf (V) -510 -410 -310 -210 -110 010 If (A) TYPICAL UM4300 UM7300 RP VS VR (UM4300) RP VS VR (UM4300) 010 110 210 310 Vr (V) 010 110 210 Rp (kOhms)

100 MHz

500 MHz

1 GHz

3 GHz

Rev: 3/30/2009 WWW . Microsemi. CO M Microsemi Microwave Products SWITCHING / ATTENUATOR PIN DIODES THERMAL IMP. VS PULSE WIDTH NORMALIZED RS VS TEMP. -610 -510 -410 -310 -210 -110 010 PULSE WIDTH (SEC) -310 -210 -110 010 110 210 PULSE THERMAL IMPEDANCE ( C/W) UM7300 UM4300 o -60 -40 -20 0 20 40 60 80 100 120 TEMPERATURE ( C) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 NORMALIZED DIODE RESISTANCE o POWER DISS. VS LEAD TEMP. (UM4300) POWER DISS. VS LEAD TEMP. (UM7300) POWER RATINGS (STUD PKG) 0 25 50 75 100 125 150 175 STUD TEMPERATURE ( C) MAX POWER DISSIPATION (W) UM4300C UM4300D UM7300C UM7300D 6 W 15 W 18 W 7.5 W o GGRRAAPPHHSS

Rev: 3/30/2009 WWW . Microsemi. CO M Microsemi Microwave Products SWITCHING / ATTENUATOR PIN DIODES PACKAGE STYLES STYLE ‘A’ STYLE ‘B’ STYLE ‘C’ STYLE ‘CR’ STYLE ‘D’ STYLE ‘DR’ STYLE ‘E’ STYLE ‘SM’ MMEECCHHAANNIICCAALL

Rev: 3/30/2009 WWW . Microsemi. CO M Microsemi Microwave Products SWITCHING / ATTENUATOR PIN DIODES UM7300 STYLE ‘SM’ FOOTPRINT UM4300 STYLE ‘SM’ FOOTPRINT UM7300 Style SM, A Size Footprint UM4300 Style SM, B Size Footprint 1. These dimensions will match the terminals and prov ide for additional solder fillets at the outboard ends at least as wide as the terminals themselves, assuming accuracy of placement within 0.005” 2. If the mounting method chosen requires use of an ad hesive separate from the solder compound, a round (or square) spot of cement as shown should be centrally located. MMEECCHHAANNIICCAALL