UM5304 UNIONSEMI | Alldatasheet
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Technical content
http://www.union-ic.com Rev.03 May.2008 1 / 8 UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF SC70-6/SC88/SOT363 UM5304EEBF SC89-6/SOT563/SOT666 UM5304EECF TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from over-voltage caused by ESD (electrostatic discharge). The unique design incorporates surge rated, low capacitance steering diodes in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The low capacitance array configuration allows the user to protect four high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for ESD protection of portable electronics. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (± 15kV air, ± 8kV contact discharge). Applications Features USB 2.0 USB OTG Monitors and Flat Panel Displays digital Visual Interface (DVI) High-Definition Multimedia Interface (HDMI) SIM Ports IEEE 1394 Firewire Ports Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) ± 15kV (air), ± 8kV (contact) Array of surge rated diodes Protects up to four I/O lines & power line Low capacitance (<2pF) for high-speed interfaces No insertion loss to 2.0GHz Low leakage current and clamping voltage Low operating voltage: 5.0V P i n C o n f i g u r a t i o n s T o p V i e w M: Monthly Code UM5304EEAF SC70-6/SC88/SOT363 M: Monthly Code UM5304EEBF SC89-6/SOT563/SOT666 XX: Weekly Code UM5304EECF TSOP-6/SOT23-6
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Ordering Information
Voltage Packaging Type Channel Marking Code Shipping Qty UM5304EEAF SC70-6/ SC88/ SOT363 UAP UM5304EEBF SC89-6/SOT563/SOT666 UBP UM5304EECF 5.0V TSOP-6/SOT23-6 UCP Inch Tape & Reel Absolute Maximum Ratings Peak Pulse Power (tp = 8/20µS) P pk 150 Watts Peak Pulse Current (tp = 8/20µS ) I PP 6 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD 15 8 kV Operating Temperature T J -55 to +125 °C Storage Temperature T STG -55 to +150 °C
Electrical Characteristics
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Reverse Stand-Off Voltage V RWM 5.0 V Reverse Breakdown Voltage V BR It = 1mA Pin 5 to 2 6.0 V Reverse Leakage Current I R VRWM = 5V, T=25°C Pin 5 to 2 2 µA Clamping Voltage V C I PP = 1A, 8/20µS Any pin to pin 2 15 V Clamping Voltage V C I PP = 6A, 8/20µS Any pin to pin 2 25 V VR = 0V, f = 1MHz Any I/O pin to pin 2 2 pF Junction Capacitance C j VR = 0V, f = 1MHz Between I/O pins 1 pF Note 1: I/O pins are pin 1, 3, 4, and 6
http://www.union-ic.com Rev.03 May.2008 3 / 8 UM5304EEXF Typical Operating Characteristics 0.1 1 10 100 1000 0.01 0.1 Peak Pulse Power – PPK (kW) Pulse Duration – tp (µs) Non-Repetitive Peak Pulse Power vs. Pulse Time 0 12 34 56 Forward Voltage – VF (V) Forward Current – IF (A) Waveform Parameters: tr=8μs td=20μs Forward Voltage vs. Forward Current 0 25 50 75 100 125 150 100 Ambient Temperature - TA( ) Power Derating Curve % of Rated Power or Ipp 110 0 5 10 15 20 25 30 100 Time (µs) Pulse Waveform Percent of Ipp 110 Waveform Parameters: tr=8μs td=20μs e-t td=IPP/2 0123456 28Clamping Voltage – Vc (V) Peak Pulse Current – Ipp (A) Waveform Parameters: tr=8μs td=20μs Clamping Voltage vs. Peak Pulse Current Pin 1, 3, 4, 6 to Pin 2 Pin 5 to Pin 2 0 12 3 45 0.5 1.5 2.5Capacitance – Cj (pF) Reverse Voltage – VR (V) Junction Capacitance vs. Reverse Voltage f=1MHz Any I/O Pin to Pin2
http://www.union-ic.com Rev.03 May.2008 4 / 8 UM5304EEXF Applications Information Device Connection Options for Protection of Four High-Speed Data Lines This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. Pin 2 should be connected directly to a ground plane. The path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at pin 5. The options for connecting the positive reference are as follows: To protect data lines and the power line, connect pin 5 directly to the positive supply rail (VCC). In this configuration the data lines are referenced to the supply voltage. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
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Package Information
UM5304EEAF SC70-6/SC88/SOT363 DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.900 1.100 0.035 0.043 A1 0.000 0.100 0.000 0.004 A2 0.900 1.000 0.035 0.039 b 0.150 0.350 0.006 0.014 c 0.080 0.150 0.003 0.006 D 2.000 2.200 0.079 0.087 E 1.150 1.350 0.045 0.053 E1 2.150 2.450 0.085 0.096 e 0.650REF 0.026REF e1 1.200 1.400 0.047 0.055 L 0.525REF 0.021REF L1 0.260 0.460 0.010 0.018 θ 0° 8° 0° 8° Land Pattern Tape and Reel Specificatio
http://www.union-ic.com Rev.03 May.2008 6 / 8 UM5304EEXF UM5304EEBF SC89-6/SOT563/SOT666 DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.525 0.600 0.021 0.024 A1 0.000 0.050 0.000 0.002 b 0.170 0.270 0.007 0.011 c 0.090 0.160 0.004 0.006 D 1.500 1.700 0.059 0.067 E 1.100 1.300 0.043 0.051 E1 1.500 1.700 0.059 0.067 e 0.450 0.550 0.018 0.022 L 0.100 0.300 0.004 0.012 θ 7°REF 7°REF Land Pattern Tape and Reel Specification
http://www.union-ic.com Rev.03 May.2008 7 / 8 UM5304EEXF UM5304EECF TSOP-6/SOT23-6 DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950REF 0.037REF e1 1.800 2.000 0.071 0.079 L 0.600REF 0.023REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Land Pattern Tape and Reel Specification
http://www.union-ic.com Rev.03 May.2008 8 / 8 UM5304EEXF IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 7F, No. 5, Bibo Road, Shanghai 201203 Tel: 021-51097928 Fax: 021-51026018 Website: www.union-ic.com