UM5202EEDF UNIONSEMI | Alldatasheet

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Technical content

Features

z USB 2.0 z USB OTG z Monitors and Flat Panel z Displays digital Visual Interface (DVI) z High-Definition Multimedia Interface (HDMI) z SIM Ports IEEE 1394 Firewire Ports z Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) ± 15kV (air), ± 8kV (contact) z Array of surge rated diodes with internal TVS Diode z Protects two I/O lines & power line z Low capacitance (<2pF) for high-speed interfaces z No insertion loss to 2.0GHz z Low leakage current and clamping voltage z Low operating voltage: 5.0V z Solid-state silicon-avalanche technology P i n C o n f i g u r a t i o n s T o p V i e w U2A PIN1 2 WK: Week Code UM5202EEDF SOT143 PIN1 PIN2 PIN3 PIN4

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Ordering Information

Voltage Packaging Type Channel Marking Code Shipping Qty UM5202EEDF 5.0V SOT143 2 U2A 3000pcs /7Inch Tape & Reel Absolute Maximum Ratings Peak Pulse Power (tp = 8/20µS) P pk 150 Watts Peak Pulse Current (tp = 8/20µS ) I PP 6 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±15 ±8 kV Operating Temperature T J -55 to +125 °C Storage Temperature T STG -55 to +150 °C Electrical Characteristics （Note 1） PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Reverse Stand-Off Voltage VRWM 5.0 V Reverse Breakdown Voltage VBR It = 1mA, Pin 4 to Pin1 6.0 V Reverse Leakage Current IR VRWM = 5V, T=25°C, Pin4 to Pin1 2 µA Clamping Voltage V C IPP = 1A, 8/20µS, Any pin to pin1 15 V Clamping Voltage V C IPP = 6A, 8/20µS, Any pin to pin1 25 V VR = 0V, f = 1MHz, Any I/O pin to pin1 2 pF VR = 0V, f = 1MHz , Between I/O pins 1 pF VR = 0V, f = 1MHz, Pin4 to pin1 60 pF Junction Capacitance Cj VR = 2.5V, f = 1MHz, Pin4 to pin1 40 pF Pin1to Pin4 40 ns Pin1 to I/O Pin 160 ns Reverse Recovery Time Trr Pin4 to I/O Pin 45 ns Note 1: I/O pins are pin 2, 3.

http://www.union-ic.com Rev.01 Aug.2012 3 / 5 UM5202EEDF Applications Information Device Connection Options for Protection of two High-Speed Data Lines This device is designed to protect data lines by clamping them to a fixed reference. When the voltage on the protected line exceeds the referenc e voltage the steering diodes are forward biased, conducting the transient current away from the sensitiv e circuitry. Data lines are connected at pins 2, 3. Pin 1 should be connected directly to a ground plane. The path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at pin 4. The options for connecting the positive reference are as follows: 1. To protect data lines and the power line, connect pin 4 directly to the positive supply rail (VCC). In this configuration the data lines are referenc ed to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. 2. In applications where the supply rail does not exit the system, the internal TVS may be used as the reference. In this case, pin 4 is not connect ed. The steering diodes will begin to conduct when the voltage on the protected line exceeds the working voltage of the TVS (plus one diode drop). Matte Tin Lead Finish Matte tin has become the industry standard lead-fr ee replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume th at is placed on the land pattern of the PCB, the reflow profile will be determined by the requireme nts of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any a dded alloys that can cause degradation of the solder joint.

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Package Information

MILLIMETERS INCHES Symbol Min Max Min Max A 0.763 1.220 0.031 0.049 A1 0.013 0.150 0.001 0.006 A2 0.750 1.070 0.030 0.043 b 0.300 0.510 0.012 0.020 b2 0.760 0.930 0.030 0.037 C 0.080 0.200 0.003 0.008 D 2.800 3.040 0.112 0.122 E 2.200 2.640 0.088 0.211 E1 1.200 1.400 0.048 0.056 e 1.920BSC 0.077BSC e1 0.200BSC 0.008BSC L1 0.540REF 0.022 L 0.400 0.600 0.016 0.024 Land Pattern NOTES: 1. Compound dimension: 2.90×1.30; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.01 Aug.2012 5 / 5 UM5202EEDF IMPORTANT NOTICE The information in this document has been ca refully reviewed and is believed to be accurate. Nonetheless, this document is subjec t to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane 647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com