UM5084_16 UNIONSEMI | Alldatasheet
Document overview
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Technical content
Features
Cell Phone Handsets and Accessories Personal Digital Assistants (PDA’s) Notebooks, Desktops and Servers Portable Instrumentation Cordless Phones Smart Card Digital Cameras MP3 Players Transient Protection for Data Lines to IEC 61000-4-2 (ESD): ±15kV (Air), ±8kV (Contact) Small Package for Use in Portable Electronics Suitable Replacement for MLV’s in ESD Protection Applications Bidirectional TVS Protection Stand-off Voltages: 12V Low Leakage Current Low Diode Capacitance Small Body Outline Dimensions: 1.0mm×0.6mm Pin Configurations Top View 12 E5 UM5084 DFN2 1.0×0.6
http://www.union-ic.com Rev.04 Mar.2016 2/5 UM5084
Ordering Information
Voltage Packaging Type Channel Marking Code Shipping Qty UM5084 12.0V DFN2 1.0×0.6 1 E5 5000pcs/7 Inch Tape & Reel Absolute Maximum Ratings Rating Symbol Value Unit Peak Pulse Power (tP=8/20μs) PPK 140 Watts Maximum Peak Pulse Current (tP=8/20μs) IPP 5.9 Amps Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C Storage Temperature TSTG -55 to +150 °C Symbol Definition Parameter Symbol Maximum Reverse Peak Pulse Current IPP Clamping V oltage @ Ipp VC Working Peak Reverse V oltage VRWM Maximum Reverse Leakage Current @ VRWM IR Breakdown V oltage @ IT VBR Test Current IT Peak Power Dissipation PPK Max. Capacitance @ VR=0V , f=1MHz CJ
http://www.union-ic.com Rev.04 Mar.2016 3/5 UM5084
Electrical Characteristics
(T=25°C, Device for 12.0V Reverse Stand-off Voltage) Parameter Symbol Conditions Min Typ Max Unit Reverse Stand-Off Voltage VRWM 12 V Reverse Breakdown Voltage VBR IT=1mA 16.7 18.7 V Reverse Leakage Current IR VRWM=12V, T=25°C 0.5 μA Clamping Voltage VC IPP=5.9A, tP=8/20μs 23.7 V Junction Capacitance CJ VR=0V, f=1MHz 10 15 pF Applications Information Device Connection Options UM5084 ESD protection diode is designed to protect one bidirectional data, I/O or power supply line from the damage caused by ESD and surge pulses . The device is bidirectional and may be used on lines where the signal polarity is above ground and below ground. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: 1. Place the TVS near the input terminals or connectors to restrict transient coupling. 2. Minimize the path length between the TVS and the protected line. 3. Minimize all conductive loops including power and ground loops. 4. The ESD transient return path to ground should be kept as short as possible. 5. Never run critical signals near board edges. 6. Use gr ound planes whenever possible. For multilayer printed -circuit boards, use ground vias. 7. Keep parallel signal paths to a minimum. 8. Avoid running protection conductors in parallel with unprotected conductor. 9. Avoid using shared transient return paths to a common ground point.
http://www.union-ic.com Rev.04 Mar.2016 4/5 UM5084
Package Information
UM5084 DFN2 1.0×0.6 Outline Drawing e L(2×) b(2×) Pin #1 ID R A Side View Bottom View D E Note: R is optional. DIMENSIONS Symbol MILLIMETERS INCHES Min Typ Max Min Typ Max A 0.40 - 0.53 0.016 - 0.021 A1 0.00 - 0.05 0.000 - 0.002 e 0.65TYP 0.026TYP Land Pattern 0.65 0.65 0.35 NOTES: 1. Compound dimension: 1.00×0.60; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation
http://www.union-ic.com Rev.04 Mar.2016 5/5 UM5084 GREEN COMPLIANCE Union Semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been imp lemented to reduce the use of hazardous substances and/or emissions. All Union components are compliant with the RoHS directive, which helps to support customers in their compliance with environmental directives. For more green compliance information, please visit: http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or desig n and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com