UM5055_16 UNIONSEMI | Alldatasheet

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Technical content

Features

 Cell Phone Handsets and Accessories  Microprocessor Based Equipment  Personal Digital Assistants (PDA’s)  Notebooks, Desktops and Servers  Portable Instrumentation  Cordless Phones  Digital Cameras  Peripherals  MP3 Players  Transient Protection for Data & Power Lines to IEC 61000 -4-2 (ESD) ±15kV ( Air), ±8kV (Contact)  Small Package for Use in Portable Electronics  Suitable Replacement for MLV’s in ESD Protection Applications  Protect One I/O or Power Line  Low Clamping Voltage  Stand-off Voltage: 5V  Low Leakage Current  Solid-State Silicon-Avalanche Technology Pin Configurations Top View +- ZF UM5055 SOD523

http://www.union-ic.com Rev.05 Jun.2016 2/5 UM5055

Ordering Information

Voltage Packaging Type Channel Marking Code Shipping Qty UM5055 5.0V SOD523 1 ZF 3000pcs/7 Inch Tape & Reel Absolute Maximum Ratings Rating Symbol Value Unit Peak Pulse Power (tP=8/20μs) PPK 140 Watts Maximum Peak Pulse Current (tP=8/20μs) IPP 11 Amps Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C Storage Temperature TSTG -55 to +150 °C Symbol Definition Parameter Symbol Maximum Reverse Peak Pulse Current IPP Clamping V oltage @ Ipp VC Working Peak Reverse V oltage VRWM Maximum Reverse Leakage Current @ VRWM IR Breakdown V oltage @ IT VBR Test Current IT Forward Current IF Forward Voltage @ IF VF Peak Power Dissipation PPK Max. Capacitance @ VR=0V , f=1MHz C

http://www.union-ic.com Rev.05 Jun.2016 3/5 UM5055

Electrical Characteristics

(T=25°C, Device for 5.0V Reverse Stand-Off V oltage) Parameter Symbol Conditions Min Typ Max Unit Reverse Stand-Off Voltage VRWM 5 V Reverse Breakdown Voltage VBR IT=1mA 6 6.8 7.8 V Reverse Leakage Current IR VRWM=5V, T=25°C 0.1 μA Clamping Voltage VC IPP=5A, tP=8/20μs 9.1 V IPP=11A, tP=8/20μs 13 Forward Voltage VF IF=10mA 0.8 V Junction Capacitance CJ VR=0V, f=1MHz 40 55 pF Junction Capacitance CJ VR=2.5V, f=1MHz 30 40 pF Applications Information Device Connection Options UM5055 ESD protection diode is designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines wh ere the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced tran sients. The following guidelines are recommended: 1. Place the TVS near the input terminals or connectors to restrict transient coupling. 2. Minimize the path length between the TVS and the protected line. 3. Minimize all conductive loops including power and ground loops. 4. The ESD transient return path to ground should be kept as short as possible. 5. Never run critical signals near board edges. 6. Use ground planes whenever possible. For multilayer printed -circuit boards, use ground vias. 7. Keep parallel signal paths to a minimum. 8. Avoid running protection conductors in parallel with unprotected conductor. 9. Minimize all printed-circuit board conductive loops including power and ground loops. 10. Avoid using shared transient return paths to a common ground point. Matte Tin Lead Finish Matte tin has become the industry standard lead -free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead -free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.

http://www.union-ic.com Rev.05 Jun.2016 4/5 UM5055

Package Information

D E E2 A θ θ c L Side View Top View End View DIMENSIONS Symbol MILLIMETERS INCHES Min Typ Max Min Typ Max c 0.08 - 0.15 0.003 - 0.006 E2 0.20REF 0.008REF θ 7°REF 7°REF Land Pattern 1.40 0.60 0.35 NOTES: 1. Compound dimension: 1.20×0.80; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.05 Jun.2016 5/5 UM5055 GREEN COMPLIANCE Union Semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful pro grams have been implemented to reduce the use of hazardous substances and/or emissions. All Union components are compliant with the RoHS directive, which helps to support customers in their compliance with environmental directives. For more green complianc e information, please visit: http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration IMPORTANT NOTICE The information in this document has been carefully reviewed and is bel ieved to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at a ny time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com