UM50125

UM50125 UNIONSEMI | Alldatasheet

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Technical content

http://www.union-ic.com Rev.01 Mar. 2012 1 / 7 UM50125/50129 Single Line ESD Protection Diode Array UM50125 SOD523 1.2×0.8 UM50129 DFN2/FBP2 1.0×0.6 General Description The UM50125/50129 ESD protection diode is designed to replace multilayer varistors (MLVs) in portable instrumentation, notebook computers, digital power meter, digital camera and communication systems. They feature large cross-sectional area junctions for conducting high transient currents, offer desirable electrical charac teristics for board level protection, such as fast response time, lower operating voltage, lower cl amping voltage and no device degradation when compared to MLVs. The UM50125/50129 ESD protection diode protects sensitive semiconductor components from damage or upset due to electrost atic discharge (ESD) and other voltage induced transient events. The UM50125 is available in SOD523 package and the UM50129 is available in DFN2/FBP2 1.0 ×0.6 (compatible with SOD923 & SOD882) package, both with working voltages of 12 volt. It gives designer the flexibility to protect one unidirectional line in applications where arrays are not practical. A dditionally, it may be “sprinkled” around the board in applications where board space is at a premiu m. It may be used to meet the ESD immunity requirements of IEC 61000-4-2, ±30kV air, ±30kV contact discharge. Applications Features z Cell Phone Handsets and Accessories z Notebooks, Desktops and Servers z Portable Instrumentation and Accessories z Digital Power Meter z Digital Cameras z Communication Systems z Transient protection for data lines to IEC 61000-4-2 (ESD): ±30kV (air), ±30kV (contact) z Small package for use in portable electronics z Suitable replacement for MLV’s in ESD protection applications z Protect one I/O or power line z Low clamping voltage z Stand off voltage:12V z Low leakage current z Solid-state silicon-avalanche technology P i n C o n f i g u r a t i o n s T o p V i e w UM50125 SOD523 1.2×0.8 UM50129 DFN2/FBP2 1.0×0.6

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Ordering Information

Voltage Packaging Type Channel Marking Code Shipping Qty UM50125 12.0V SOD523 1.2×0.8 mm2 1 ZA 3000pcs/7 Inch Tape & Reel UM50129 12.0V DFN2/FBP2 1.2×0.8 mm2 1 EA 5000pcs/7 Inch Tape & Reel Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20μs) PPK 140 Watts Maximum Peak Pulse Current (t=8/20μs) IPP 5.9 Amps Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature T J -55 to +125 °C Storage Temperature T STG -55 to +150 °C Symbol Definition Parameter Symbol Maximum Reverse Peak Pulse Current I PP Clamping V oltage @ Ipp V C Working Peak Reverse V oltage V RWM Maximum Reverse Leakage Current @ VRWM I R Breakdown V oltage @ It V BR Test Current I t Forward Current I F Forward V oltage @ IF V F Peak Power Dissipation P PK Max. Capacitance @ VR = 0V , f = 1MHz C

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Electrical Characteristics

(T=25°C, Device for 12.0V Reverse Stand-off Voltage) Parameter Symbol Conditions Min Typ Max Unit Reverse Stand-Off Voltage VRWM 12 V Reverse Breakdown Voltage VBR It = 1mA 16 18 V Reverse Leakage Current I R V RWM = 12V, T=25°C 0.5 μA Clamping Voltage V C I PP =5.9A, tp = 8/20μS 23 V Junction Capacitance C J V R = 0V, f = 1MHz 20 30 pF Applications Information Device Connection Options UM50125/50129 ESD protection diode is designed to pr otect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode dot should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the s uppression of ESD induced transients. The following guidelines are recommended: 1. Place the TVS near the input terminals or connectors to restrict transient coupling. 2. Minimize the path length between the TVS and the protected line. 3. Minimize all conductive loops including power and ground loops. 4. The ESD transient return path to ground should be kept as short as possible. 5. Never run critical signals near board edges. 6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. 7. Keep parallel signal paths to a minimum. 8. Avoid running protection conductors in parallel with unprotected conductor. 9. Minimize all printed-circuit board conductive loops including power and ground loops. 10. Avoid using shared transient return paths to a common ground point.

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Package Information

UM50125 SOD523 1.2×0.8 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.510 0.770 0.020 0.031 A1 0.500 0.700 0.020 0.028 b 0.250 0.350 0.010 0.014 c 0.080 0.150 0.003 0.006 D 0.750 0.850 0.030 0.033 E 1.100 1.300 0.043 0.051 E1 1.500 1.700 0.059 0.067 E2 0.200REF 0.008REF L 0.010 0.070 0.001 0.003 θ 7 °REF 7 °REF Land Pattern NOTES: 1. Compound dimension: 1.20×0.80; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.01 Mar. 2012 5 / 7 UM50125/50129 UM50129 DFN2 1.0×0.6 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.470 0.530 0.019 0.021 A1 0.000 0.050 0.000 0.002 b 0.200 0.300 0.008 0.012 D 0.950 1.075 0.037 0.042 E 0.550 0.675 0.022 0.027 E1 0.450 0.550 0.018 0.022 e 0.400 0.016 R 0.050 0.150 0.002 0.006 Land Pattern NOTES: 1. Compound dimension: 1.00×0.60; 2. Unit: mm; 3. General tolerance ±0.025mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.01 Mar. 2012 6 / 7 UM50125/50129 UM50129 FBP2 1.0×0.6 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.550 0.021 A1 0.010 0.070 0.000 0.003 b 0.275 0.325 0.011 0.013 D 0.950 1.050 0.037 0.041 D1 0.275 0.325 0.011 0.013 E 0.400REF 0.016REF E1 0.550 0.650 0.022 0.026 L 0.450REF 0.018REF Land Pattern NOTES: 1. Compound dimension: 1.00×0.60; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.01 Mar. 2012 7 / 7 UM50125/50129 IMPORTANT NOTICE The information in this document has been ca refully reviewed and is believed to be accurate. Nonetheless, this document is subjec t to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane 647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com