UM4750 UNIONSEMI | Alldatasheet
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Technical content
Features
Bluetooth/802.11 Cards PDAs and Notebook Computers Portable Instruments and Battery-Powered Systems Cellular Phones Very Low Dropout: 200mV(max) at 100mA Maximum Input Voltage: 5.5V Low Noise:200μVRMS (10Hz to 100kHz) Fast Transient Response Dual LDO Outputs(300mA/300mA) Output Current Limit Stable with 1μF Output Capacitor Thermal Overload Protection Low Profile SOT23-6, 6-Lead DFN2.0×2.0 and 8-Lead DFN 3.0×3.0 Packages Pin Configurations Top View VOUT1 VOUT2 VIN GND EN1 EN2 7XX M 1 2 3 456 M: Month Code UM4750S-xx SOT23-6
http://www.union-ic.com Rev.05 Mar.2014 2/13 UM4750 Pin Description Naming Information UM4750 Channel 1 Output Voltage Package Type S: SOT23-6 DA: DFN6 2.0×2.0 DB: DFN8 3.0×3.0 Channel 2 Output Voltage 1VIN GND EN1 EN2 VOUT2 VOUT1 3 4 7XX M Marking Pin1 M: Month Code UM4750DA-xx DFN6 2.0×2.0 GND VIN EN2 EN1 NC VOUT1 NC GND VOUT2 7XX M M: Month Code UM4750DB-xx DFN8 3.0×3.0 Pin Number Symbol Function UM4750S-xx UM4750DA-xx UM4750DB-xx 1 5 5 VOUT2 Channel2 output voltage 2 2 6 GND Ground 3 4 3 EN2 Enable2 Input, Active High 4 3 2 EN1 Enable1 Input, Active High 5 1 1 VIN Power Supply 6 6 8 VOUT1 Channel1 output voltage - - 4,7 NC No connection
http://www.union-ic.com Rev.05 Mar.2014 3/13 UM4750 Available Voltage Version Code Voltage Code Voltage Code Voltage Code Voltage A 5 F 4.2 L 3.3 R 1.8 B 4.8 G 4 M 3 S 1.5 C 4.7 H 3.8 N 2.8 T 1.3 D 4.5 J 3.6 P 2.7 U 1.2 E 4.3 K 3.5 Q 2.5
Ordering Information
Part Number Packaging Type Marking Code Shipping Qty UM4750S-RN SOT23-6 UDS 3000pcs/7Inch Tape & Reel UM4750S-RL UDT UM4750S-NR UGS UM4750S-xx 7XX UM4750DA-xx DFN6 2.0×2.0 7XX UM4750DB-xx DFN8 3.0×3.0 7XX Absolute Maximum Ratings (Note 1) Symbol Parameter Value Unit VIN Supply Voltage on IN Pin -0.3 to +6.5 V VOUT Voltage on OUT Pin -0.3 to +7.5 V TJ Operating Junction Temperature (Notes 2, 3) -40 to +125 °C TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature for Soldering 10 seconds +300 °C ESD Susceptibility HBM 2000 V PD Power Dissipation at TA = 25° C SOT23-6 0.5 W DFN6 2.0×2.0 0.7 DFN8 3.0×3.0 0.9 Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: The device is guaranteed to meet performance specifications from 0 ℃ to 70 ℃. Specifications over the – 40℃ to 125 ℃ operating junction temperature range are guaranteed by design, characterization and correlation with statistical process controls. Note 3: This IC includes over temperature protection circuit inside that is intended to protect the device during momentary overload conditions. Over temperature protection trip point is around 160 ℃. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
http://www.union-ic.com Rev.05 Mar.2014 4/13 UM4750 Recommended Operating Conditions (Note 4) Supply Input Voltage 2.5V to 5.5V Enable Input Voltage 0V to 5.5V Junction Temperature Range -40° C to 125° C Ambient Temperature Range -40° C to 85° C Note 4: The device is not guaranteed to function outside its operating conditions. Internal Block Diagram Shutdown and Logic Control Current-Limit VREF Thermal Protection Shutdown and Logic Control Current-Limit + - 1.2V Error Amplifier 1.2V Error Amplifier EN2 EN1 VIN VOUT1 GND VOUT2 GND
http://www.union-ic.com Rev.05 Mar.2014 5/13 UM4750
Electrical Characteristics
VCC=+5V± 10%,CIN=1μF,COUT1=COUT2=1μF,TA=-40℃ to +85℃.Typical conditions are at Vcc=5V, TA=25℃. Parameter Symbol Test Conditions Min Typ Max Unit Input Voltage Range VIN 2.5 5.5 V Output Voltage Range VOUT 1.2 5.0 V Operating Quiescent Current IQ IOUT=0mA 110 190 μA Shut Down Current IQ_SD EN1=EN2=GND 2 μA EN Input Current IEN EN=VIN or GND 1 μA Output Current IOUT 300 mA Output Voltage Accuracy IOUT=10mA -2 2 % Dropout Voltage ΔVDO IOUT=100mA, VOUT>2.8V 100 200 mV Output Current Limit ILIMT 330 450 700 mA Startup Time Response t RL=68Ω, COUT=1μF 20 μs EN Input Low Voltage VIL VIN=2.5V to5.5V 0.3× VIN V EN Input High Voltage VIH 0.7× VIN V Output Voltage TC 100 ppm/℃ Thermal-Shutdown Temperature TSHDN 150 ℃ Thermal-Shutdown Hysteresis ΔTSHDN 30 ℃ Line Regulation LNR 1.5<VOUT≤4V VOUT+1V≤VIN≤5.5V, IOUT=10mA 0.3 %/V 4V<VOUT≤5V or 1.2V≤VOUT≤1.5V VOUT+1V≤VIN≤5.5V and VIN>2.5V,IOUT=10mA 0.6 Load Regulation LDR VOUT≤4V 1mA≤IOUT≤300mA 0.6 % 4V<VOUT≤5V 1mA≤IOUT≤300mA 0.8 Output Voltage Noise 10Hz to 100KHz CIN=1μF, IOUT=10mA 200 μVRMS Power Supply Ripple Rejection PSRR VIN=VOUT+1V IOUT=100mA F=100Hz 60 dB F=1KHz 45 ESD Rating Human Body Mode 2 KV
http://www.union-ic.com Rev.05 Mar.2014 6/13 UM4750 Typical Performance Characteristics Quiescent Current vs Input Voltage 100 105 110 115 120 125 130 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Quiescent Current (uA) Output Voltage vs Input Voltage 2.72 2.73 2.74 2.75 2.76 2.77 2.78 2.79 2.8 2.81 2.82 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage(V) Output_1 Voltage(V) 1.7 1.72 1.74 1.76 1.78 1.8 1.82 1.84 1.86 1.88 1.9 Output_2 Voltage(V) VOUT2 VOUT1 Dropout Voltage vs Output Current 120 160 200 240 280 320 360 400 440 480 520 0 25 50 75 100 125 150 175 200 225 250 275 300 Output Current(mA) Dropout Voltage(mV) UM4750S-NR UM4750S-NR UM4750S-NR VOUT1=2.8V VOUT2=1.8V VOUT2=1.8V VOUT1=2.8V Outpout Voltage vs Output Current 2.73 2.74 2.75 2.76 2.77 2.78 2.79 2.80 2.81 2.82 2.83 0 50 100 150 200 250 300 Output Current(mA) Output_1 Voltage(V) 1.76 1.77 1.78 1.79 1.8 1.81 1.82 1.83 1.84 1.85 1.86 Output_2 Voltage(V) VOUT1=2.8V VOUT2=1.8V UM4750S-NR Output Voltage vs Temperature 2.70 2.72 2.74 2.76 2.78 2.80 2.82 2.84 -40 -20 0 20 40 60 80 100 120 140 Temperature(℃) Output_1 Voltage(V) 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 Output_2 Voltage(V) VOUT1=2.8V VOUT2=1.8V UM4750S-NR UM4750S-NR VIN=5.0V
http://www.union-ic.com Rev.05 Mar.2014 7/13 UM4750 Typical Performance Characteristics (Continued) Line Transient Response Load Transient Response VIN=3.8V to 4.8V VIN=3.5V to 4.5V (2V/div) VOUT1=2.8V, IOUT1=10mA (50mV/div) (2V/div) (50mV/div) VOUT2=1.8V, IOUT2=10mA UM4750S-NR 100μs/div UM4750S-NR 100μs/div UM4750S-NR 100μs/div UM4750S-NR 100μs/div Iload=20mA to 220mA 100mA/div Iload=10mA to 120mA 50mA/div VIN=2.8V, VOUT2=1.8V VIN=3.8V, VOUT1=2.8V 200mV/div 100mV/div
http://www.union-ic.com Rev.05 Mar.2014 8/13 UM4750 Typical Application Circuit VIN EN1 EN2 GND VOUT2 VOUT1 VIN CIN 1μF Chip Enable COUT2 1μF COUT1 1μF VOUT1 VOUT2 Pin Function VIN : Unregulated input supply. A small 1.0uF capacitor should be connected from VIN to GND. GND : Ground and Heat Sink. Solder to a ground plane or large pad to maximize heat dissipation. EN: Enable, Active High. This pin is used to put the UM4750 into shutdown. The EN pin cannot be left floating and must be tied to the input pin if not used. VOUT : Regulated V oltage Output. Applications Information The UM4750 series are 300mA very lo w dropout regulators with micropower q uiescent current and shutdown. The maximum dropout is only 200mV at the load current of 1 00mA. Output voltage noise is as low as 200μVRMS over a 10Hz to 100kHz bandwidth. In addition to the low quiescent current, the UM4750 regulators incorporate several protection features which make them ideal for use in battery -powered systems. Devices include current limit and thermal overload protection. Output Capacitance and Transient Response The UM4750 regulators are designed to be stable with a wide range of output capacitors. The ESR of the output capacitor affects stability, most notably with small capacitors. A minimum output capacitor of 1 μF with an ESR of 0.3Ω or less is recommended to ensure stability. The UM4750 series are micropower device s and output transient response will be a function of output capacitance. Larger values of output capacitance decrease the peak deviations and provide improved transient response for larger load current changes. Extra consideration must be given to the use of ceramic capacitors. The X5R and X7R dielectrics result in more stable characteristics and are more suitable for use as the output capacitor. The X 7R type has better stability across temperature, while the X5R is less expensive and is available in higher values. Board Layout Recommendations to Improve PSRR and Noise Performance To improve AC performance such as PSRR, output noise, and transient res ponse, it is recommended that the board be designed with separate ground planes for Vin and V out, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should connect directly to the GND pin of the device. High ESR capacitors may degrade PSRR.
http://www.union-ic.com Rev.05 Mar.2014 9/13 UM4750 Internal Current Limit The UM4750 internal current limits help protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largel y independent of output voltage. For reliable operation, the device should not be operated in a limit state for extended periods of time. The PMOS pass element in the UM4750 has a built-in body diode that conducts current when the voltage at OUT exceeds th e voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of rated output current may be appropriate. Dropout Voltage The UM4750 use a PMOS pass transistor to achieve low dropout. When (Vin-V out) is less than the dropout voltage, the PMOS pass device is in its linear region of operation and the input-to-output resistance is the Rds of the PMOS pass element. Vd rop approximately scales with output current because the PMOS device behaves like a resistor in dropout. Thermal Protection Thermal protection disables the output when the junction tempera ture rises to approximately +150℃ allowing the device to cool. When the junction temper ature cools to approximately +120℃ the output circuit is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may circle on and off . This cycling limits the dissipation of the regulator, protecting it from damage due to overheating. Thermal Considerations Thermal protection limits power dissipation in UM4750. When the operation junction temperature exceeds 150℃, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turns on again after the junction temperature cools by 25 ℃. For continuous operation, do not exceed absolute maximum operation junction temperature 125 ℃. The power dissipation definition in device is: PD =(VIN -VOUT1)×IOUT1 + (VIN -VOUT2)×IOUT2 + VIN×IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junctions to am bient. The recommended maximum power dissipation of SOT23 -6, DFN6 2.0×2.0 and DFN8 3.0×3.0 packages for 25℃ ambient temperature are 0.5W, 0.7W and 0.9W.
http://www.union-ic.com Rev.05 Mar.2014 10/13 UM4750
Package Information
b D e E θ L A c DIMENSIONS Symbol MILLIMETERS INCHES Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950REF 0.037REF e1 1.800 2.000 0.071 0.079 L 0.600REF 0.023REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Land Pattern 0.7 0.9 0.95 0.95 2.4 NOTES: 1. Compound dimension: 2.92×1.60； 2. Unit: mm; 3. General tolerance ± 0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation M7XX
http://www.union-ic.com Rev.05 Mar.2014 11/13 UM4750 UM4750DA-xx DFN6 2.0×2.0 Outline Drawing D2/2 D E2/2 E e b L R 0.100 Bottom View A A3Side View DIMENSIONS Symbol MILLIMETERS Min Typ Max A 0.57 0.60 0.63 A1 0 0.03 0.05 A3 0.15TYP b 0.20 0.25 0.30 D 1.95 2.00 2.075 E 1.95 2.00 2.075 D2 1.45 1.55 1.65 E2 0.76 0.86 0.96 e 0.65TYP L 0.30 0.35 0.40 Land Pattern 1.00 1.20 2.50 0.65 0.65 0.25 NOTES: 1. Compound dimension: 2.00×2.00; 2. Unit: mm; 3. General tolerance ± 0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation 7XX M
http://www.union-ic.com Rev.05 Mar.2014 12/13 UM4750 UM4750DB-xx DFN8 3.0× 3.0 Outline Drawing D E eb L A DIMENSIONS Symbo l MILLIMETERS INCHES Min Max Min Max A 0.7 0.8 0.028 0.031 A1 0 0.05 0 0.002 A3 0.2 REF 0.008 REF b 0.25 0.35 0.01 0.014 D 2.95 3.05 0.116 0.12 E 2.95 3.05 0.116 0.12 D2 2.3 2.55 0.091 0.1 E2 1.5 1.75 0.059 0.069 e 0.650BSC 0.026BSC L 0.3 0.5 0.012 0.02 Land Pattern 0.65 0.35 0.75 1.7 3.6 NOTES: 1. Compound dimension: 3.00×3.00; 2. Unit: mm; 3. General tolerance ± 0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation 7XX M
http://www.union-ic.com Rev.05 Mar.2014 13/13 UM4750 IMPORTANT NOTICE The information in this document has been carefully review ed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contain ed information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com