UM4401 UNIONSEMI | Alldatasheet

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Technical content

Features

z EMI Filtering and ESD Protection for Data Lines z Wireless Phones z Handheld Products z Notebook Computers z LCD Displays z EMI/RFI Filter with Integrated TVS for ESD Protection z ESD Protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) z 25dB Minimum Attenuation: 800MHz to 2.5GHz z Working Voltage: 5V z Resistor: 100Ω ±15% z Typical Capacitance: 10pF (VR = 2.5V) z Solid-state Technology z DFN8 Package: 2.1mm x 1.6 mm z Moisture Sensitivity Level 1 P i n C o n f i g u r a t i o n s T o p V i e w Cd Cd Cd Cd Cd Cd Cd Cd M: Monthly Code UM4401 DFN8 2.1×1.6

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Ordering Information

Part Number Packaging Type Marking Code Shipping Qty UM4401 DFN8 2.1×1.6 4401 3000pcs/7Inch Tape & Reel Absolute Maximum Ratings Symbol Parameter Value Unit TJ Junction Temperature 125 °C PR Steady State Power per Resistor @ 25 ℃ 328 mW TOP Operating Temperature Range -40 to 85 °C TSTG Storage Temperature Range -55 to 150 °C TL Maximum Lead Temperature for Soldering 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limi t values (not normal ope rating conditions) and are not valid simultaneously. If these limits are exceed ed, device functional operation is not implied, damage may occur and reliability may be affected. Electrical Characteristics (TJ = 25°C unless otherwise noted) Symbol Parameter Test Conditions Min Typ Max Unit VRWM Reverse Stand-Off Voltage 5.0 V VBR Reverse Breakdown Voltage It = 1.0mA 6 .0 7.0 8.0 V IR Reverse Leakage Current VRWM = 3.3V 100 nA RA Total Series Resistance IR=10mA Each Line 85 100 115 Ω Cd Total Capacitance Input to Gnd, Each Line VR = 0V, f = 1MHz 16 20 24 pF Cd Total Capacitance Input to Gnd, Each Line VR = 2.5V, f = 1MHz 9 10 12 pF f3dB Cut-Off Frequency (Notes) Above this frequency, appreciable attenuation occurs

150 MHz

Notes: 50Ω source and 50Ω load termination.

http://www.union-ic.com Rev.01 Apr.2008 3 / 6 UM4401 Typical Operating Characteristics Typical Insertion Loss S21 An alog Crosstalk Curve (S41) 1E7 1E8 1E9 -45 -40 -35 -30 -25 -20 -15 -10 S21 (dB) FREQUENCY (Hz) 1E7 1E8 1E9 -60 -55 -50 -45 -40 -35 -30 S41(dB) Frequency(Hz) Typical Resistance vs. Temperature Ca pacitance vs. Reverse Voltage - 4 0 - 2 00 2 04 06 08 0 100 101 102 103 104 Resistance(ohm) Temperature(Celsiur scale) 012345 0.4 0.5 0.6 0.7 0.8 0.9 1.0 f=1M Cj(Vr)/Cj(Vr=0) Reverse Voltage - Vr(V) ESD Clamping (+8KV Contact) ESD Clamping (-8KV Contact)

http://www.union-ic.com Rev.01 Apr.2008 4 / 6 UM4401 Applications Information Device Connection The UM4401 is comprised of four identical ci rcuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin DFN package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in th e board traces. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout w ill affect the filtering performance of the device. As frequency increases, the effect of the inductan ce becomes more dominant. This effect is given by Equation 1. Pin Identification 1 - 4 Input Lines 5 - 8 Output Lines Center Tab Ground Equation 1: The Impedance of an Inductor at Frequency XLF XLF(L,f ) = 2×л×f ×L Where: L= Inductance (H) f = Frequency (Hz) Via connections to the ground plan e form rectangular wire loops or ground loop inductance as shown in Figure 2. Gr ound loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductanc e. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in)

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Package Information

UM4401: DFN8 2.1×1.6 Outline Drawing DIMENSIONS MILLIMETERS Symbol Min Typ Max *D 2.05 2.10 2.175 *E 1.55 1.60 1.675 D2 1.60 1.70 1.80 E2 0.30 0.40 0.50 A 0.545 0.575 0.605 A1 0 0.02 0.05 A3 - 0.13 - b 0.20 0.25 0.30 *L 0.275 0.325 0.375 e -- 0.50 - Land Pattern NOTES: 1. Compound dimension: 2.10×1.60; 2. Unit: mm; 3.General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation

http://www.union-ic.com Rev.01 Apr.2008 6 / 6 UM4401 IMPORTANT NOTICE The information in this document has been ca refully reviewed and is believed to be accurate. Nonetheless, this document is subjec t to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 7F, No. 5, Bibo Road, Shanghai 201203 Tel: 021-51097928 Fax: 021-51026018 Website: www.union-ic.com