UM2777 STMICROELECTRONICS | Alldatasheet
Document overview
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Technical content
Datasheet sections
- 1 STWIN kit components
- 2 Functional blocks
- 2.1 Sensing
- 2.1.1 LPS22HH MEMS pressure sensor
- 2.1.2 STTS751 digital temperature sensor
- 2.1.3 TS922 rail-to-rail, high output current, dual operational amplifier
- 2.1.4 ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
- 2.1.5 IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
- 2.1.6 IIS2DH ultra-low power 3-axis high-performance accelerometer
- 2.1.7 IIS2MDC 3-axis magnetometer
- 2.1.8 IMP23ABSU analog MEMS microphone with extended frequency response up to 80 kHz for
- 2.1.9 IMP34DT05 digital MEMS microphone
- 2.2 Processing and connectivity
- 2.2.1 STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM
- 2.2.3 STEVAL-STWINWFV1 Wi-Fi expansion (not included in the kit) for the SensorTile wireless
- 2.2.5 USB connector
- 2.2.8 Clock sources
- 2.3 Power management
- 2.3.1 Battery connectors
- 2.3.2 Power supply
- 2.3.3 Power ON/OFF procedure
- 2.3.4 Power consumption evaluation
- 2.4 Buttons, LEDs and connectors
- 2.4.1 Flex expansion connector
- 2.4.2 STMod+ connector
- 2.4.3 Connectivity expansion connector
- 2.4.4 Sensor expansion connector
- 2.5 Protective plastic box
- 2.6 STLINK-V3MINI debugger and programmer for STM32
- 3 How to program the board
audio and ultrasound spectra, and high precision local temperature and environmental monitoring. dashboard application, all provided to help speed up design cycles for end-to-end solutions. boards associated with the STM32 family, such as the LTE Cell pack. Figure 1. STEVAL-STWINKT1B SensorTile Wireless Industrial Node For further information contact your local STMicroelectronics sales office.
1 STWIN kit components
The SensorTile Wireless Industrial Node (STWIN) is packaged with the components shown below. Figure 2. STWIN Core System board top and bottom Figure 3. Protective plastic case Figure 4. 480mAh 3.7V Li-Po Battery
2 Functional blocks
Figure 7. STEVAL-STWINKT1B functional block diagram
16 MHz
(*) The HTS221 is not recommended for new designs.
2.1 Sensing
Figure 8. STEVAL-STWINKT1B functional block diagram of sensing elements and STM32L4R9ZIJ6 (*) The HTS221 is not recommended for new designs. high data rates, while the magnetometer and environmental sensors communicate via I2C.
managed by the digital filter for Sigma-Delta modulators (DFSDM) interface in the MCU. Figure 9. Core system board sensor locations
2.1.1 LPS22HH MEMS pressure sensor
I3CSM or SPI from the sensing element to the application. dedicated process developed by ST. temperature range extending from -40 °C to +85 °C.
2.1.2 STTS751 digital temperature sensor
The STTS751 is a digital temperature sensor which communicates over a 2-wire SMBus 2.0 compatible bus. conversion time is 21 milliseconds.
2.1.3 TS922 rail-to-rail, high output current, dual operational amplifier
The TS922 is a rail-to-rail dual BiCMOS operational amplifier optimized and fully specified for 3 V and 5 V operation. The very low noise, low distortion, low offset, and high output current capability render this device highly suitable for high quality, low voltage, or battery operated audio systems. Related links Visit the product web page for the TS922 rail-to-rail, high output current, dual operational amplifier
2.1.4 ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and +3D digital gyroscope tailored for Industry 4.0 applications. The sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, which ensures superior stability and robustness. Several embedded features such as programmable FSM, FIFO, sensor hub, event decoding and interrupts allow the implementation of smart and complex sensor nodes able to deliver high performance at very low power. Related links Visit the product web page for the ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
2.1.5 IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
The IIS3DWB is a system-in-package featuring a 3-axis digital accelerometer with low noise over an ultra-wide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +105 °C), render the device particularly suitable for vibration monitoring in industrial applications. The high performance delivered at low power consumption, together with the digital output and embedded digital features like FIFO and interrupts are of primary importance in battery-operated industrial wireless sensor nodes. Related links Visit the product web page for the IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
2.1.6 IIS2DH ultra-low power 3-axis high-performance accelerometer
The IIS2DH is an ultra-low-power high-performance three-axis linear accelerometer with digital I2C/SPI serial interface standard output. The device may be configured to generate interrupt signals from two independent inertial wake-up/free-fall events, as well as from the position of the device itself. Related links Visit the product web page for the IIS2DH ultra-low power 3-axis high-performance accelerometer
2.1.7 IIS2MDC 3-axis magnetometer
The IIS2MDC is a high-accuracy, ultra-low-power 3-axis digital magnetic sensor. It has a magnetic field dynamic range up to ±50 gauss, and includes an I²C serial bus interface that supports 100 kHz, 400 kHz, 1 MHz, and 3.4 MHz rates and an SPI serial standard interface. The device can be configured to generate an interrupt signal from magnetic field detection. Related links Visit the product web page for the IIS2MDC 3-axis magnetometer UM2777 Sensing UM2777 - Rev 4 page 6/44
2.1.8 IMP23ABSU analog MEMS microphone with extended frequency response up to 80 kHz for
The IMP23ABSU is a compact, low-power microphone based on a capacitive sensing element and an IC interface. The sensing element can detect acoustic waves and is manufactured using a special silicon micro-machining process to produce audio sensors. The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio. The IMP23ABSU sensitivity is -38 dBV ±1 dB at 94 dBSPL, 1 kHz. The IMP23ABSU is available in a package compliant with re-flow soldering and is guaranteed to operate over an extended temperature range (-40 to +85 °C). Related links Visit the product web page for the IMP23ABSU analog MEMS microphone
2.1.9 IMP34DT05 digital MEMS microphone
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface; the device features 64 dB signal-to-noise ratio and -26 dBFS ±3 dB sensitivity. The IC interface includes a dedicated circuit able to provide a digital signal externally in PDM format. Related links Visit the product web page for the IMP34DT05 digital MEMS microphone
2.2 Processing and connectivity
The STWIN core system board features several wired and wireless connectivity options and the STM32L4R9ZI ultra-low-power microcontroller, which is part of the STM32L4+ series MCUs based on the high-performance Arm Cortex-M4 32-bit RISC core, operating at up to 120 MHz and equipped with 640 Kb SRAM and 2 MB Flash memory. UM2777 Processing and connectivity UM2777 - Rev 4 page 7/44
Figure 10. Main connectivity components and the STM32L4R9ZI processing unit
Figure 11. MCU and connectivity element locations
2.2.1 STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM
performance Arm Cortex-M4 32-bit RISC core, which operates at a frequency of up to 120 MHz. APB buses, two AHB buses and a 32-bit multi-AHB bus matrix. write protection, proprietary code readout protection and a firewall.
- Four I2Cs
- Three SPIs
- Three USARTs, two UARTs and one low-power UART
- Two SAIs
- One SDMMC UM2777 Processing and connectivity UM2777 - Rev 4 page 9/44
- One CAN
- One USB OTG full-speed
- Camera interface
- DMA2D controller The device operates in the -40 to +85 °C (+105 °C junction) and -40 to +125 °C (+130 °C junction) temperature ranges from a 1.71 to 3.6 V for VDD power supply when using internal LDO regulator and a 1.05 to 1.32 V V DD12 power supply when using external SMPS supply. A comprehensive set of power-saving modes allows the design of low-power applications. Some independent power supplies are supported, such as an analog independent supply input for ADC, DAC, OPAMPs and comparators, a 3.3 V dedicated supply input for USB and up to 14 I/Os, which can be supplied independently down to 1.08 V. A VBAT input allows backup of the RTC and the registers. Dedicated VDD12 power supplies can be used to bypass the internal LDO regulator when connected to an external SMPS. Related links Visit the product web page for the STM32L4R9ZI micrcontroller 2.2.2 BlueNRG-M2 very low power application processor module for Bluetooth® low energy v5.0 The BlueNRG-M2 is a Bluetooth® low energy system-on-chip application processor certified module compliant with BT specifications v5.0 and BQE qualified. The module simultaneously supports multiple roles and can act at the same time as Bluetooth master and slave device. The BlueNRG-M2 is based on the BlueNRG-2 system-on-chip and provides a complete RF platform in a tiny form factor, integrating radio, embedded antenna and high frequency oscillators to offer a certified solution that optimizes the final application time-to-market. The BlueNRG-M2 can be directly powered by a pair of AAA batteries or any power source from 1.7 to 3.6 V. Related links Visit the product web page for the BlueNRG-M2SA application module for Bluetooth® low energy v5.0 wireless technology
2.2.3 STEVAL-STWINWFV1 Wi-Fi expansion (not included in the kit) for the SensorTile wireless
industrial node (STWIN) kit The STEVAL-STWINWFV1 expansion board (sold separately) adds 2.4 GHz Wi-Fi connectivity to the SensorTile Wireless Industrial Node (STWIN) kit. Through the CN3 connectivity expansion connector, the STEVAL-STWINWFV1 can be plugged into the STWIN core system board. It is based on the ISM43362-M3G-L44-E Wi-Fi module and its main features are:
- 802.11 b/g/n compatible
- based on Broadcom MAC/Baseband/Radio device
- fully contained TCP/IP stack
- host interface: SPI up to 25 MHz The RF power emitted is +9 dBm (limited by firmware). The module operating band is 2400 MHz ~ 2483.5 MHz (2.4 GHz ISM Band). Related links Visit the product web page for further details on the STEVAL-STWINWFV1 2.2.4 STR485LV 3.3V RS485 up to 20Mbps The STR485 is a low power differential line transceiver for RS485 data transmission standard applications in half-duplex mode. Data and enable signals are compatible with 1.8 V or 3.3 V supplies. Two speeds are selectable via the SLR pin: fast data rate up to 20 Mbps or slow data rate up to 250 kbps for extended cables. UM2777 Processing and connectivity UM2777 - Rev 4 page 10/44
Excessive power dissipation caused by bus contention or faults is prevented by a thermal shutdown circuit that forces the driver outputs into a high impedance state. The receiver has a fail-safe feature that guarantees a high output state when the inputs are left open, shorted or idle. Related links Visit the product web page for the STR485LV 3.3V RS485 up to 20Mbps
2.2.5 USB connector
The Micro-USB connector on the board can be used for both power supply and data transfer (USB Device only). Different examples of USB class implementation can be found in STSW-STWINKT01 software package.
2.2.6 STSAFE-A110 authentication, state-of-the-art security for peripherals and IoT devices
The STSAFE-A110 is a highly secure solution that acts as a secure element providing authentication and secure data management services to a local or remote host. It consists of a full turnkey solution with a secure operating system running on the latest generation of secure microcontrollers. The STSAFE-A110 can be integrated in IoT devices, smart-home, smart-city and industrial applications, consumer electronics devices, consumables and accessories. Related links Visit the product web page for the STSAFE-A110 authentication, state-of-the-art security for peripherals and IoT devices 2.2.7 microSD card socket On the bottom side of the STWIN core system board is a microSD Card socket that is accessible even when the board is mounted in the plastic box. The card is accessed through a 4-bit wide SDIO port for maximum performance. A couple of firmware examples involving high speed data logging on the SD card are available in the STSW- STWINKT01 software package.
2.2.8 Clock sources
There are two external clock sources on the STWIN core system board:
- X1: 16 MHz high speed external (HSE) oscillator for the MCU.
- X2: 32.768 kHz low speed external (LSE) oscillator for the RTC embedded in the MCU.
2.3 Power management
The STWIN core system board includes a range of power management features that enable very low power consumption in final applications. The main supply is through a lithium ion polymer battery (3.7 V, 480 mAh) and the integrated battery charger (STBC02) with Vin [4.8 -5.5 V]. UM2777 Power management UM2777 - Rev 4 page 11/44
2.3.1 Battery connectors
STWIN kit to the dedicated battery connector, or by supplying an external voltage through the J4 connector. Figure 14. Battery and J4 connectors for VBAT supply
2.3.2 Power supply
- V_USB: through micro USB connector [5 V]
- V in: through J5 connector [4.8-5.5 V]. The current on this port needs to be limited to 2 A
- VBAT: lithium ion polymer battery (3.7 V, 480 mAh), STBC02 battery charger integrated in the board The battery is always optional. The STBC02 battery charger automatically checks the available power inputs and selects one to power the system. When the battery is connected as well as one of the other sources, the STBC02 automatically charges the battery. When battery-powered, the equipment is intended to work properly with an operating temperature of 35°C. Without the battery, the equipment is intended to work properly with an operating temperature of 45°C.
Figure 15. Power circuits
2.7 LDO
2.3.3 Power ON/OFF procedure
and disconnect an external supply, respectively. Follow the steps below to power the board on and off when it is powered by a LiPo battery. Step 1. Push the PWR button for about a second to power the board on. Power on is managed by the STBC02 battery charger WAKE-UP hardware feature. Step 2. Push the PWR button again to turn the board off. action and activates the battery charger SHUTDOWN command to switch the power supply off.
2.3.4 Power consumption evaluation
in each of the four main power supply domains on the board. provide 5 V directly on the J5 connector. Figure 16. Power monitoring points
2.4 Buttons, LEDs and connectors
Figure 17. Buttons, LEDs and connectors
2.4.1 Flex expansion connector
Figure 18. CN1 Flex connector top view This is a general purpose expansion connector. Table 1. CN1 pin descriptions
1 USART3_CTS PB13 -
2 STMOD2 PD8/ PC3 USART3_TX/ SPI2_MOSI
3 STMOD3 PD9/ PD3 USART3_RX/ SPI2_MISO
4 STMOD4 PD1/ PB1 SPI2_CLK/ USART3_RTS
5 GND - -
6 VEXT - -
7 I2C4_SCL PD12 -
Pin No. Description STM32 pin Default Signal
8 SPI2_MOSI_p2 PB15 -
9 SPI2_MISO_p2 PC2 -
10 I2C4_SDA PD13 -
11 PC5/WKUP5 PC5 WKUP5
12 EX_RESET PD11 -
13 EX_ADC PA5 -
14 EX_PWM PA15 -
15 VEXT - -
16 GND - -
17 PG12 PG12 EX_CN (ex tint)
18 PG10 PG10 TIM
19 PG9 PG9 TIM
20 PB14 PB14 TIM, DSFDMD2
21 PA9 PA9 -
22 PA10 PA10 -
23 PB11 PB11 DSI_TE,TIM,LPUART_TX
24 PC13 PC13 TAMP, WKUP
25 PB9 PB9
CAN, TIM, DSFDM,I2C1
26 PB8 PB8
27 PE9 PE9 TIM, DSFDMCLK
28 3V3_Ext - -
29 DSI_D1_N -
STM32 Display Serial Interface (DSI) Host
30 DSI_D1_P -
31 GND - -
32 DSI_D0_N -
STM32 Display Serial Interface (DSI) Host
33 DSI_D0_P -
34 SYS - -
35 DSI_CLK_N -
STM32 Display Serial Interface (DSI) Host
36 DSI_CLK_P -
37 3V3_Ext - -
38 PA0 PA0 ADC_IN5
39 PA1 PA1 ADC_IN6
40 SYS - -
View the vendor documentation on handling FH34SRJ series connectors UM2777 Buttons, LEDs and connectors UM2777 - Rev 4 page 16/44
2.4.2 STMod+ connector
Figure 19. STMod+ connector top views Table 2. STMod+ connector pin assignments and descriptions
1 SPIx_NSS(2) / UARTy_CTS Output / Input
2 SPIx_MOSIp(3) / UARTy_TX Output / Output Output / Output
3 SPIx_MISOp(4) / UARTy_RX Input / Input Input / Input
4 SPIx_SCK / UARTy_RTS Output / Output Output / Output
5 GND Ground Reference Ground reference
7 I2Cz_SCL Input / Output Input / Output
8 SPIx_MOSIs(3) Output Output
9 SPIx_MISOs(4) Input / Output Input / Output
10 I2Cz_SDA Input / Output Input / Output
11 INT(6) Input Input
12 RESET Output Output
13 ADC Input Input
14 PWM Output Output
16 GND Ground Reference Ground reference
17 GPIO(7) Output / Input
18 GPIO(7) Output / Input
19 GPIO(7) Output / Input
20 GPIO(7) Output / Input
- If two functions are provided on a STMod+ connector pin, you can connect two different I/O ports from STM32: the firmware
the corresponding STM32 datasheet available on www.st.com.
- Instead of SPIx_NSS, a GPIO can be used as SPI Chip Select.
- Pins 2 and 8 are the same SPIx_MOSI signals, but they must come from two different I/O ports.
- Pins 3 and 9 are the same SPIx_MISO signals, but they must come from two different I/O ports.
- Power Supply is Output or Input, depending on host / daughterboard configuration.
- INT is an interrupt line.
- GPIO ports with many alternate functions (like UART, I²C, SPI and analog inputs/outputs) are privileged to offer optimum
2.4.3 Connectivity expansion connector
Figure 20. CN3 connectivity connector top view This connector is suitable for the STEVAL-STWINWFV1 Wi-Fi expansion board. Table 3. CN3 pin descriptions
2.4.4 Sensor expansion connector
Figure 21. CN4 sensor connector top view This connector is suitable for the STEVAL-STWINMAV1 analog microphone expansion board. Table 4. CN4 pin descriptions
2.5 Protective plastic box
The plastic case is designed to protect and hold the STWIN core system board and the LiPo battery together. wireless industrial node on appropriate metallic areas in the monitored equipment.
2.6 STLINK-V3MINI debugger and programmer for STM32
JTAG/SWD interfaces for communication with any STM32 microcontroller located on an application board. It provides a Virtual COM port interface for host PCs to communication with target MCUs via UART. The STLINK-V3MINI is supplied with an STDC14 to STDC14 flat cable. Figure 22. STLINK-V3MINI and STDC14 cable
3 How to program the board
3.1 How to program the STWIN with the STLINK-V3MINI
Follow the procedure below to program the STWIN core system board. Step 1. Connect the STWIN core system board to the STLINK-V3MINI programmer using the 14-pin flat cable. The programmer and the cable are included in the STEVAL-STWINKT1B hardware kit. Step 2. Connect both the boards to a PC using micro USB cables. Figure 23. STLINK-V3MINI connected to STWIN core system board
3.2 How to program STWIN without STLINK-V3MINI using STM32CubeProgrammer
The STEVAL-STWINKT1B can also be reprogrammed via USB using the STM32CubeProgrammer "USB mode". Step 1. Unplug the STWIN core system board. Step 2. Press the USR button. Step 3. While keeping the button pressed, connect the USB cable to the PC. Now the board is in DFU mode.
Step 4d. Go to the [Erasing & Programming] tab. Step 4e. Search for the new .bin or .hex binary file to be flashed into the board. Step 4f. Click on [Start Programming]. Figure 26. STM32CubeProgrammer - programming
4 STWIN assembly steps
- STWIN core system board
- 4x M3 bolts and nuts
- Plastic box (2 parts)
- Battery
- 2x Magnets (optional - not included in the kit): – RS Stock No. 177-4040 Brand Eclipse Mfr Part No.N859
Figure 27. Exploded cad drawing of STWIN node components
Step 4. Fasten the core system board to the case using the nuts and bolts provided with the kit. Figure 30. Core system board fastened with bolts
5 How to run the HSDatalog application
The HSDatalog (High-Speed Datalog) application is part of the FP-SNS-DATALOG1 STM32ODE function pack. the FAT32 file system, or can be streamed to a PC via USB. state, waiting for the start command either via USB, push button or Bluetooth® low energy. Figure 31. HSDatalog data flow automatically read and plot the data saved by the application. The script has been successfully tested with MATLAB v2019a and Python 3.7. tool available in MATLAB v2019a.
Figure 32. Folder structure in the SD card
- Reads and decodes the JSON file
- Reads the raw data and uses the information from the JSON to translate them into readable data (data + timestamp)
- Plots the data Note: The handling of JSON scripts requires MATLAB v2019a or above. UM2777 How to run the HSDatalog application UM2777 - Rev 4 page 27/44
6 Schematic diagrams
Figure 33. STEVAL-STWINKT1B schematic (1 of 7)
2.7 V Analog LDO
2 GND
Figure 34. STEVAL-STWINKT1B schematic (2 of 7)
10 PG12
8 DSI_CLK_P
Figure 35. STEVAL-STWINKT1B schematic (3 of 7) (*) The HTS221 is not recommended for new designs.
Figure 36. STEVAL-STWINKT1B schematic (4 of 7)
100 OHM
Figure 37. STEVAL-STWINKT1B schematic (5 of 7)
7 DAT0_Ex
3 DE B
5 CMD_In
Figure 38. STEVAL-STWINKT1B schematic (6 of 7)
Figure 39. STEVAL-STWINKT1B schematic (7 of 7)
4 GND
3 NC#1
7 Bill of materials
Table 5. Bill of materials
Item Q.ty Ref. Part / Value Description Manufacturer Order code 19 1 J2 STDC14 STDC14 - ARM MIPI10 compatible Samtec FTSH-107-01-L-DV-K 20 1 J3 CON5_1 V_EXT selector - - 21 1 J4 STRIP254P-M-2 - - 22 1 J5 CON2 Morsettiera a 2 vie, passo 2.54mm - - 23 1 J6 0 OHM 1206 or
2.54 Jumper
mic current monitoring: RES SMD Yageo AF1206JR-070RL 24 1 J7 0 OHM 1206 or monitoring: RES SMD Yageo AF1206JR-070RL 25 1 J8 N.M. STRIP254P-M-5-90- SMD (not mounted) - - 26 1 J9 0 OHM 1206 or Bluetooth® low energy current monitoring: RES SMD Yageo AF1206JR-070RL 27 1 J10 0 OHM 1206 or monitoring: RES SMD Yageo AF1206JR-070RL 28 1 LED_C Red LED, LED_0402 Vishay Semiconductor Opto Division VLMS1500-GS08 29 1 LED1 Green LED, LED_0402 Panasonic Electronic Components LNJ347W83RA 30 1 LED2 Orange LED, LED_0402 Panasonic Electronic Components LNJ847W86RA 31 2 L1, L2 2.2uH, ±20% Inductor, 2520 Wurth Wurth-74438323022 32 1 M1 1.3A MEMS audio sensor ST IMP23ABSU 33 1 M2 MEMS audio sensor ST IMP34DT05 34 2 USR, PWR 4.2x3.2x2.5mm, white SW PUSHBUTTON- SPST-2 ALPS SKRPABE010 35 1 RESET 4.2x3.2x2.5mm, black SW PUSHBUTTON- SPST-2 ALPS SKRPADE010 36 1 R1 10k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0710KL 37 8 R2, R3, R7, R26, R30, R31, R32, R33 4.7k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) TE Connectivity Passive Product CRG0402F4K7 38 2 R4, R5 7.5k, 100ppm/C, 1/16W, ±5% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402JR-077K5L 39 4 R6, R12, R14, R20 100k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) TE Connectivity Passive Product CRG0402F100K 40 3 R8, R9, R15 1M, 100ppm/C, ±1% RES SMD 0402, 0402 (1005 Metric) TE CONNECTIVITY CRG0402F1M0 41 1 R10 47.5K, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0747K5L 42 2 R11, R16 20K, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0720KL 43 1 R13 10k N.M., ±1% RES, SMD, 0402 (not mounted), 0402 (1005 Metric) TE CONNECTIVITY CRG0402F10K UM2777 Bill of materials UM2777 - Rev 4 page 36/44
Item Q.ty Ref. Part / Value Description Manufacturer Order code 44 2 R17, R22 2k, 100ppm/C, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RT0402FRE072KL 45 1 R18 56K, 100ppm/C, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0756KL 46 2 R19, R21 0R RES SMD 0402, 0402 (1005 Metric) Vishay Dale CRCW04020000Z0ED 47 1 R23 100K, 100ppm/C, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-07100KL 48 2 R24, R25 62, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0762RL 49 1 R27 47k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Samsung Electro- Mechanics America, Inc. RC1005F473CS 50 1 R28 10k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-0710KL 51 1 R29 160, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) TE Connectivity Passive Product CRG0402F160R 52 1 R34 1k, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-071KL 53 1 R35 560R, 100ppm/C, 1/16W, ±1% RES SMD 0402, 0402 (1005 Metric) Yageo RC0402FR-07560RL 54 13 SB1, SB2, SB3, SB7, SB9, SB10, SB13, SB14, SB15, SB16, SB17, SB22, SB24 0 OHM N.M. RES SMD 0402 (not mounted), 0402 (1005 Metric) Vishay Dale CRCW04020000Z0ED 55 12 SB4, SB5, SB6, SB8, SB11, SB12, SB18, SB19, SB20, SB21, SB23, SB25 0R RES SMD 0402, 0402 (1005 Metric) Vishay Dale CRCW04020000Z0ED 56 1 SD Micro-SD Wurth Electronics 693071010811 57 1 SP1 N.M. (not mounted) - - 58 7 TP4, TP5, TP6, TP7, TP8, TP9, TAMPER 1mm N.M. TEST POINT 1MM SMD PADSTASCK (not mounted) - - 59 1 TP1 Test Point Through Hole Keystone Electronics 5001 60 2 TP2, TP3 N.M. Test Point Through Hole (not mounted) - - 61 1 USB USB Micro-B, USB- Micro-B GCT USB3075-30-A 62 1 U1 6-line IPAD™, EMI filter and ESD protection ST EMIF06-MSD02N16 63 1 U2 Humidity, Temperature, HLGA-6L(2 x 2 x 0.9 mm) ST HTS221TR (Not recommended for new designs) 64 1 U3 MEMS NANO PRESSURE SENSOR: 260-1, (2 x 2 x 0.73 mm) ST LPS22HHTR 65 1 U4 STM32L496, UFBGA144 ST STM32L4R9ZIJ6 UM2777 Bill of materials UM2777 - Rev 4 page 37/44
Item Q.ty Ref. Part / Value Description Manufacturer Order code 66 1 U5 Very low power application processor module for Bluetooth® low energy v5.0 ST BlueNRG-M2SA 67 1 U6 Digital temperature sensor, UDFN-6L ST STTS751-0DP3F 68 1 U7 Secure element, SO8N ST STSAFE-A110 69 1 U8 OpAmp - excellent audio performance / low distortion (0.005%) ST TS922EIJT 70 1 U9 3D accelerometer and 3D gyroscope, LGA-14L (2.5 x 3 x 0.83 mm) ST ISM330DHCX 71 1 U10 300 mAvery low noise LDO, DFN6 ST LDK130PU-R 72 1 U11 Accelerometor Ultra Wide Bandwidth, LGA-14L (2.5 x 3 x 0.83 mm) ST IIS3DWB 73 1 U12 Accelerometor Ultra- low-power, LGA-12 (2.0x2.0x1 mm) ST IIS2DHTR 74 1 U13 MEMS Magnetometer, (2.0x2.0x0.7) ST IIS2MDCTR 75 2 U14, U16 400mA step-down switching regulator, Flip-chip ST ST1PS01EJR 76 1 U15 Li-Ion Linear Battery Charger with LDO 3.3V, Flip Chip30 (2.59x2.25 mm) ST STBC02AJR 77 1 U17 Low voltage high bandwidth quad SPDT switch ST STG3692 78 1 U18 USB Protection ST USBLC6-2P6 79 1 U19 Low power transceiver for RS-485, DFN10 ST STR485LV 80 1 X1 16MHz 16.00MHz Crystal 8pF NDK NX3225GA-16MHZ-STD-CRG-1 81 1 X2 32.7680KHZ CRYSTAL 32.7680KHz 6PF SMD NDK NX3215SA-32.768K-STD- MUA-14 82 1 STLINK-V3MINI ST STLINK-V3MINI 83 1 Programming Cable (Included in ST-LINK) - - 84 1 Plastic Box - - 85 1 480mAh Battery LiPo Himax LiPo-752535 86 4 12mm M3 Pan head phillips - steel - - 87 4 M3 HEX Nut - steel - - UM2777 Bill of materials UM2777 - Rev 4 page 38/44
Revision history
Table 6. Document revision history 17-Nov-2020 1 Initial release. Buttons, LEDs and connectors. Figure 35. STEVAL-STWINKT1B schematic (3 of 7).
3.2 How to program STWIN without STLINK-V3MINI using STM32CubeProgrammer "USB
Contents
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