UM2362 UNIONSEMI | Alldatasheet
Document overview
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Technical content
Features
z Battery-powered Portable Equipment z Cellular and Cordless Telephones z Drain-Source Voltage(max):60V z Low On-Resistance(typ): 1.2Ω@VGS=10V 1.7Ω@VGS=5V z Continuous Drain Current(max): 115mA@25℃ P i n C o n f i g u r a t i o n s T o p V i e w
Ordering Information
Part Number Packaging Type Marking Code Shipping Qty UM2362S SOT23-3 10C 3000pcs/7 Inch Tape & Reel UM2362P SOT323 VLB 3000pcs/7 Inch Tape & Reel M: Month Code XXX :UM2362S, 10C U M 2 3 6 2 P , V L B
http://www.union-ic.com Rev.02 Jul.2012 2 / 5 UM2362 Absolute Maximum Ratings (Tamb=25℃) Symbol Parameter Value Units VDSS Drain-Source voltage 60 V VGS Gate-Source voltage ±20 V ID Continuous Drain Current 115 mA PD Power Dissipation 200 mW TJ Junction Temperature +150 ℃ Tstg Storage Temperature -55 to +150 ℃ Electrical Characteristics (Tamb=25 , U℃ nless otherwise noted) Symbol Parameter Test Condition Min Typ Max Unit Off Characteristics VGS=0V, ID=10μA 60 BVDSS Drain to Source Breakdown Voltage VGS=0V, ID=3mA 60 V IDSS Zero Gate Voltage Drain Current VDS=60V, VGS=0V 1 μA IGSS Gate-to-Source Leakage Current VGS=±20V, VDS=0V ±100 nA On Characteristics VGS=10V, ID=500mA 1.2 7.5 RDS(ON)* Static Drain-to-Source On-Resistance VGS=5V, ID=50mA 1.7 7.5 Ω VGS(TH)* Gate Threshold Voltage VDS= VGS , ID=250μA 1 2.5 V ID(ON)* Drain-to-Source On Current VGS=10V, VDS=7V 500 mA VGS=10V, ID=500mA 3.75 VDS(ON)* Drain-to-Source On Voltage VGS=5V, ID=50mA 0.375 V gfs* Forward Transconductance VDS=10V, ID=200mA 80 mS Drain-Source Diode Characteristics and Maximum Ratings VSD Forward Diode Voltage VGS=0V, IS=115mA 1.2 V *Pulse test: Pulse Width≤300μs, Duty Cycle≤2%
http://www.union-ic.com Rev.02 Jul.2012 3 / 5 UM2362
Package Information
MILLIMETERS INCHES Symbol Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950REF 0.037REF e1 1.800 2.000 0.071 0.079 L 0.550REF 0.022REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Land Pattern NOTES: 1. Compound dimension: 2.92×1.60; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation
http://www.union-ic.com Rev.02 Jul.2012 4 / 5 UM2362 MILLIMETERS INCHES Symbol Min Max Min Max A 0.900 1.100 0.035 0.043 A1 0.000 0.100 0.000 0.004 A2 0.877 1.000 0.035 0.039 b 0.150 0.350 0.006 0.014 c 0.080 0.220 0.003 0.009 D 1.800 2.200 0.071 0.087 E 1.150 1.350 0.045 0.053 E1 2.000 2.450 0.079 0.096 e 0.650REF 0.026REF e1 1.200 1.400 0.047 0.055 L 0.488REF 0.020REF L1 0.260 0.460 0.010 0.018 θ 0° 8° 0° 8° Land Pattern NOTES: 1. Compound dimension: 2.10×1.25; 2. Unit: mm; 3.General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation
http://www.union-ic.com Rev.02 Jul.2012 5 / 5 UM2362 IMPORTANT NOTICE The information in this document has been ca refully reviewed and is believed to be accurate. Nonetheless, this document is subjec t to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane 647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com