UM2362_14 UNIONSEMI | Alldatasheet

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Technical content

Features

 Battery Packs  Battery-Powered Portable Equipment  Cellular and Cordless Telephones  Drain-Source Voltage(Max): 60V  Low On-Resistance(Typ): 1.2Ω@VGS=10V 1.7Ω@VGS=5V  Continuous Drain Current(Max): 115mA@25℃ Pin Configurations Top View

Ordering Information

Part Number Packaging Type Marking Code Shipping Qty UM2362S SOT23-3 10C 3000pcs/7 Inch Tape & Reel UM2362P SOT323 VLB 3000pcs/7 Inch Tape & Reel G S D XXX M: Month Code XXX：UM2362S, 10C UM2362P, VLB

http://www.union-ic.com Rev.03 Dec.2014 2/5 UM2362 Absolute Maximum Ratings (Tamb=25ºC) Symbol Parameter Value Units VDSS Drain-Source voltage 60 V VGS Gate-Source voltage ±20 V ID Continuous Drain Current 115 mA PD Power Dissipation 200 mW TJ Junction Temperature +150 ℃ Tstg Storage Temperature -55 to +150 ℃ Electrical Characteristics (Tamb=25ºC, Unless otherwise noted) Symbol Parameter Test Condition Min Typ Max Unit Off Characteristics BVDSS Drain to Source Breakdown Voltage VGS=0V, ID=10μA 60 V VGS=0V, ID=3mA 60 IDSS Zero Gate Voltage Drain Current VDS=60V, VGS=0V 1 μA IGSS Gate-to-Source Leakage Current VGS=± 20V, VDS=0V ± 100 nA On Characteristics RDS(ON)* Static Drain-to-Source On-Resistance VGS=10V, ID=500mA 1.2 7.5 Ω VGS=5V, ID=50mA 1.7 7.5 VGS(TH)* Gate Threshold Voltage VDS= VGS , ID=250μA 1 2.5 V ID(ON)* Drain-to-Source On Current VGS=10V, VDS=7V 500 mA VDS(ON)* Drain-to-Source On Voltage VGS=10V, ID=500mA 3.75 V VGS=5V, ID=50mA 0.375 gfs* Forward Transconductance VDS=10V, ID=200mA 80 mS Drain-Source Diode Characteristics and Maximum Ratings VSD Forward Diode Voltage VGS=0V, IS=115mA 1.2 V *Pulse test: Pulse Width≤300μs, Duty Cycle≤2%

http://www.union-ic.com Rev.03 Dec.2014 3/5 UM2362

Package Information

D EL e 1 2 0.2 θ c Top View End View Side View A1 A2 A b DIMENSIONS Symbol MILLIMETERS INCHES Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950REF 0.037REF e1 1.800 2.000 0.071 0.079 L 0.550REF 0.022REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Land Pattern 1.90 2.02 0.80 NOTES: 1. Compound dimension: 2.92×1.60; 2. Unit: mm; 3. General tolerance ± 0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation 10C M

http://www.union-ic.com Rev.03 Dec.2014 4/5 UM2362 UM2362P SOT323 Outline Drawing b D HE E PIN 1 e e L c A Top View End View Side View DIMENSIONS Symbol MILLIMETERS INCHES Min Max Min Max D 1.80 2.20 0.072 0.088 E 1.15 1.35 0.006 0.054 HE 1.80 2.40 0.072 0.050 b 0.25 0.40 0.010 0.016 e 0.65BSC 0.026BSC Q1 0.10 0.40 0.004 0.016 A 0.80 1.10 0.032 0.044 A1 0.00 0.10 0.00 0.004 A2 0.80 1.00 0.032 0.040 c 0.10 0.18 0.004 0.007 L 0.10 0.30 0.004 0.012 L1 0.425TYP 0.017TYP Land Pattern 0.65 0.65 0.50.6 1.80 NOTES: 1. Compound dimension: 2.00× 1.25; 2. Unit: mm; 3.General tolerance ± 0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation VLB

http://www.union-ic.com Rev.03 Dec.2014 5/5 UM2362 IMPORTANT NOTICE The information in this document has been c arefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep curr ent the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com