UM2101

UM2101 STMICROELECTRONICS | Alldatasheet

Document overview

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• PDF pages: 33

Technical content

Datasheet sections

• 1 Getting started
• 1.1 Overview
• 1.2 Package components
• 1.3 Initial setup with pre-loaded demo
• 1.4 System requirements
• 2 STEVAL-STLCS01V1 hardware description
• 2.1 Power supply
• 3 STLCX01V1 hardware description
• 3.1 Power supply
• 3.2 USB device
• 3.3 Audio DAC
• 3.4 Solder bridge details
• 4 STLCR01V1 hardware description
• 4.1 Power supply
• 4.2 SensorTile and cradle assembly in form factor case
• 5 SensorTile programming interface
• 6 Sensors and Bluetooth low energy connectivity
• 6.1 LSM6DSM
• 6.2 LSM303AGR
• 6.3 LPS22HB
• 6.4 MP34DT04
• 6.5 BLUENRG-MS
• 6.6 BALF-NRG-01D3
• 7 Board schematic and bill of materials
• 7.1 Bill of materials
• 7.2 Schematic diagrams
• 9 Formal notices required by the Industry Canada ("IC")
• 10 Revision history

Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform Introduction The STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated development platform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results. The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, a barometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicated hardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smart connectivity and the integrated balun maximizes RF performance for minimum size and design effort. The kit includes a cradle expansion board for software and system architecture des ign support and a compact cradle host featuring a battery charger and SD card interface for on -field testing and data acquisition; both boards come complete with SWD programming interfaces. The system accomplished the RF Test for FCC certification (FCC ID: S9NSTILE01) and IC certification (IC ID: 8976C-STILE01). Figure 1: SensorTile functional block diagram The BLUEMICROSYSTEM firmware provides a complete framework to build wearable applications. The BlueMS™ application based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configuration parameters for the connected boards.

1 Getting started

1.1 Overview

STEVAL-STLKT01V1 is the development kit includes everything you need to remotely sense and measure motion, environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and can be used in the contexts below. An evaluation system  Evaluate high accuracy and very low power ST sensors in an optimized system architecture  Field-test data fusion and embedded signal processing algorithms  Deploy data collection campaigns to support custom algorithm development Reference design  Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact form-factor designs  Complete hardware and software examples form the starting point for new designs with:  hardware: schematics, Gerber, BoM, 3D CAD  software: from basic examples (starter firmware) to complete applications (BLUEMICROSYSTEM) Embedded software development kit  Source code project examples based on the STM32Cube architecture  Fully compatible with the Open.Software embedded processing libraries, and supported by the STM32 ODE  host board implements the Arduino UNO R3 expansion connector to enable bridging to well-known development ecosystems such as STM32 ODE and Arduino Fast prototyping tool  Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication functions to your design  Use the 3D CAD files to integrate the SensorTile in your mechanical design

1.2 Package components

Inside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on this optimized platform and to start developing you application

Figure 2: SensorTile kit blister

1.3 Initial setup with pre-loaded demo

The easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together with the cradle expansion (STLCX01V1).

1 Take the SensorTile and plug it on the cradle expansion through the dedicated

connector. Take care to match the orientation shown below Figure 3: Orientation of SensorTile and cradle expansion connectors Figure 4: SensorTile mounted on cradle expansion

2 Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify

that the J2 jumper is in position 2-3 (power supply from USB). If everything works fine then you’ll see the SensorTile LED blinking approximately every 2 seconds.

3 The board is now ready to connect to the “ST BlueMS” mobile App: available on official

stores for Android or iOS. For more details on the embedded software and the apps, please refer to the BLUEMICROSYSTEM2 documentation on www.st.com/bluemicrosystem.

1.4 System requirements

As the STEVAL-STLKT01V1 is already programmed with BLUEMICROSYSTEM firmware, to run the demo, you only need:  A smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems and minimum BLE technology 4.0  A USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter or any other source) To start designing your own project, you will need:  A Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment  A USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the PC for power supply  An STM32 Nucleo board with ST-Link V2.1 in-circuit debugger/programmer (preferred) or other compatible device  The ST-LINK Utility for firmware download (latest embedded software version on www.st.com)

UM2101 STEVAL-STLCS01V1 hardware description

2 STEVAL-STLCS01V1 hardware description

STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support development of monitoring and tracking applications as standalone sensor nodes connected to iOS™/Android™ smartphone applications. The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic components on the top side and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout is repeated on 18 PCB pads that render the SensorTile a solderable system on module as well. The figure below and following two tables provide the main board component and pinout details. Figure 5: STEVAL-STLCS01V1 main components and pinout Table 1: STEVAL-STLCS01V1 main components Reference Device Description A MP34DT04 MEMS audio sensor digital microphone B LD39115J18R 150 mA low quiescent current low noise LDO 1.8 V C STM32L476JGY6 ARM Cortex-M4 32-bit microcontroller D LSM6DSM iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope E LSM303AGR Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer F LPS22HB MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer G BlueNRG-MS Bluetooth low energy network processor H BALF-NRG-01D3 50 Ω balun with integrated harmonic filter

STEVAL-STLCS01V1 hardware description UM2101 Table 2: STEVAL-STLCS01V1 pinout Board pin CONN pin Pin name MCU pin Main functions(1) 1 2 MIC_CLK PC2 DFSDM1_CKOUT, ADC 2 4 VDD_OUT VDD/VBAT 1.8V from onboard LDO 3 6 VIN / Power supply for LDO [2V-5.5V] 4 8 VDDUSB VDDIO2 VDDUSB Power supply for USB peripheral and VDDIO2 [1.8V-3.3V] 5 10 GND VSS Ground 6 12 RXD/USB_DP PD2/PA12 USART5 RX or USB_OTG_FS DP(2) 7 14 TXD/USB_DM PC12/PA11 USART5 TX or USB_OTG_FS DM 1 8 16 SAI_CLK PG9(3) SAI2_SCK_A, SPI3_SCK 9 15 SAI_FS PG10(3) SAI2_FS_A, SPI3_MISO 10 13 SAI_MCLK PG11(3) SAI2_MCLK_A, SPI3_MOSI 11 11 SAI_SD PG12(3) SAI2_SD_A, SPI3_NSS 12 9 GPIO2 PB8/PB9/PC1 DFSDM_DATIN6, I2C3_SDA 13 7 GPIO3 PC0 DFSDM_DATIN4, I2C3_SCL 14 5 NRST NRST STM32 Reset 15 3 SWD_CLK SWD Programming interface clock 16 1 SWD_IO SWD Programming interface IO 17 / GND Ground 18 / GND Ground Notes: (1)Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin (2)USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V (3)Logic level of this pins is referred to VDDIO2

2.1 Power supply

The SensorTile board has the following input supply pins: 1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max). 2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the STM32L4 USB OTG peripheral, VDDUSB must be ≥ 3 V) VDD is an output for 1.8 V. If the USB peripheral and other 3.3 V signals are not needed for a particular application, you can connect VDD to VDDUSB so that one power supply can power the whole system. This connection can be done externally (e.g., SB8 on STLCX01V1) or by soldering a 0 Ω resistor on R2 (bottom layer).

UM2101 STEVAL-STLCS01V1 hardware description Figure 6: STEVAL-STLCS01V1 power supply block diagram

STLCX01V1 hardware description UM2101

3 STLCX01V1 hardware description

The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradle boards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradle expansion board, but can be plugged onto the dedicated connector (see Figure 3: "Orientation of SensorTile and cradle expansion connectors" and Figure 4: "SensorTile mounted on cradle expansion". Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to an STM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality. Figure 7: STLCX01V1 main components Table 3: STLCX01V1 main components Reference Device Description A SensorTile connector and footprint To plug or solder the SensorTile board B Arduino UNO R3 UNO R3 connector For STM32 Nucleo board compatibility C ST2378ETTR 8-bit dual supply 1.71 V to 5.5 V level translator D micro-USB connector, USBLC6-2P6 (U1), LDK120M-R (U4) micro USB power supply /communication port and 3.3 V voltage regulation E Audio DAC, phono jack 16-Bit, low-power stereo audio DAC and 3.5 mm stereo phono jack F SWD connector, Reset button 5-pin SWD connector for programming debugging and board reset button

UM2101 STLCX01V1 hardware description

3.1 Power supply

The power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3 connector (CN6.5). Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:  position 1-2: 5 V external  position 2-3: 5 V via USB (default) The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other external components by soldering SB18 (default OFF). The VDDUSB pin of the SensorTile can be connected to two different power sources:  3.3 V – SB9 (default ON)  1.8 V (SensorTile VDD) – SB8 (default OFF)

3.2 USB device

The USB connector on the board can be used to supply power and for communication (USB_OTG_FS). To use the USB peripheral, use the following solder bridge configuration:  SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)  SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)

3.3 Audio DAC

The PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven by the SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connect headphones or active loudspeakers. In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to the component using the following configuration:  SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino UNO R3 connector)  SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)

3.4 Solder bridge details

Table 4: STLCX01V1 solder bridge details Solder Bridge SensorTile signal Onboard signal Arduino signal SB1 Reset CN8.2 SB2(1) GPIO3 DAC control – I2C SCL (pull-up) SB3(1) GPIO2 DAC control – I2C SDA (pull-up) SB4(1) SAI_SD DAC Audio – I2S_SD SB5(1) SAI_SCK DAC Audio – I2S_SCK SB6(1) SAI_FS DAC Audio – I2S_WS SB7(1) SAI_MCLK DAC Audio – I2S_MCLK SB8 VDDUSB VDD – 1.8V from SensorTile SB9(1) VDDUSB 3V3 from regulator

STLCX01V1 hardware description UM2101 Solder Bridge SensorTile signal Onboard signal Arduino signal SB10 RXD-USB_DP Level Translator - UART_RX CN9.2 SB11 RXD-USB_DP Level Translator - UART_TX CN9.1 SB12 SAI_SD SPI_CS CN5.3 SB13 SAI_MCLK SPI_MOSI CN5.4 SB14 SAI_FS SPI_MISO CN5.5 SB15 SAI_SCK SPI_SCK CN5.6 SB16(1) GPIO3 CN5.10 SB17(1) GPIO2 CN5.9 SB18 MIC_CLK Level Translator - MIC_CLK_3V3 CN9.5 SB19 3V3 – 3V3_Nucleo CN6.2 CN6.3 SB20 TXD-USB_DM Level Translator - UART_RX CN9.2 SB21 TXD-USB_DM Level Translator - UART_TX CN9.1 SB22 GPIO2 Level Translator - GPIO2_3V3 CN9.6 SB23 GPIO3 Level Translator – GPIO3_3V3 CN9.7 Notes: (1)closed by default

UM2101 STLCR01V1 hardware description

4 STLCR01V1 hardware description

The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factor prototypes. You need to solder the SensorTile board to this board to render the system robust. The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes. Figure 8: STLCR01V1 cradle main components Table 5: STLCR01V1 main components Reference Device Description A SensorTile footprint To solder the SensorTile board B HTS221 Capacitive digital sensor for relative humidity and temperature C STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6 800 mA standalone linear Li-Ion battery charger with thermal regulation, Gas gauge IC, 200 mA low quiescent current very low noise LDO, very low capacitance ESD protection D Power on/off switch E SWD connector 5-pin SWD connector for programming and debugging F Micro USB connector, 3- pin battery connector micro USB battery charging supply /communication port and connector for Li-Ion battery power supply G micro-SD card socket Solder the SensorTile board onto the cradle board as shown in the figure below.

STLCR01V1 hardware description UM2101 Figure 9: SensorTile soldered onto cradle board

4.1 Power supply

The main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connector on the PCB. Figure 10: Battery connection and power switch The battery can be recharged via USB connected to a PC or any micro -USB battery charger. A red LED indicates the charging status:  steady ON: the USB plug is correctly connected and the board is charging  steady OFF: charging complete  blinking: battery not present

UM2101 STLCR01V1 hardware description The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It is possible to modify this current by changing the R5 resistor value. Equation 1: 𝐼𝑐ℎ𝑟𝑔 = 1𝑉 𝑅5∙1000 The default 20 kΩ value for R5 hence gives: 20𝑘 ∙1000 = 50𝑚𝐴 During normal usage, the battery needs to be connected to the board for proper operation. When the battery is plugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin, which powers all board components.

4.2 SensorTile and cradle assembly in form factor case

Refer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated form factor case. Figure 11: SensorTile and cradle in plastic case

SensorTile programming interface UM2101

5 SensorTile programming interface

To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable is provided in the SensorTile Kit package. The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1 debugger and programmer. Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cable provided, paying attention to the polarity of the connectors. Pin 1 is identified by:  a small circle on the PCB silkscreen – STM32 Nucleo board and SensorTile cradle expansion  the square shape of the soldering pad – connector on the SensorTile cradle. Figure 12: STM32 Nucleo board, cradle and cradle expansion SWD connectors

UM2101 SensorTile programming interface Figure 13: SWD connections with 5-pin flat cable

Sensors and Bluetooth low energy connectivity UM2101

6 Sensors and Bluetooth low energy connectivity

6.1 LSM6DSM

The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 Kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both gyroscope and accelerometer. High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products.

6.2 LSM303AGR

The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The Device has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss. The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can be configured to generate an interrupt signal for free - fall, motion detection and magnetic field detection. The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

6.3 LPS22HB

The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application. The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST. The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.

6.4 MP34DT04

The MP34DT04 is an ultra-compact, low-power, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting

UM2101 Sensors and Bluetooth low energy connectivity acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. The MP34DT04 has an acoustic overload point of 120 dBSPL with a 64 dB signal-to-noise ratio and –26 dBFS sensitivity.

6.5 BLUENRG-MS

The BLUENRG-MS is a very low power Bluetooth Low Energy (BLE) single-mode network processor, compliant with Bluetooth specification v4.2. The BLUENRG-MS can act as master or slave. The entire Bluetooth low energy stack runs on the embedded ARM Cortex M0 core. The non-volatile Flash memory allows on-field stack upgrading. The BLUENRG-MS allows applications to meet the tight advisable peak current requirements imposed with the use of standard coin cell batteries. The maximum peak current is only 8.2 mA at 0 dBm of output power. Ultra low-power sleep modes and very short transition times between operating modes allow very low average current consumption, resulting in longer battery life. The BLUENRG-MS offers the option of interfacing with external microcontrollers using SPI transport layer.

6.6 BALF-NRG-01D3

BALF-NRG-01D3 is a 50 Ω conjugate match to BLUENRG-MS (QFN32 package) that integrates balun transformer and harmonics filtering. It features high RF performances with a very small footprint and a RF BOM reduction. It has been chosen as the best trade -off for costs, area occupation and high radio performances. The layout has been optimized to suit a 4-layer design and a chip antenna.

Board schematic and bill of materials UM2101

7 Board schematic and bill of materials

This section contains the bill of materials and schematics.

7.1 Bill of materials

Table 6: STEVAL-STLCS01V1 bill of materials Item Q.ty Ref Value Notes Part number Manufacturer 1 1 U1 ARM Cortex-M4 32b MCU Microcontroller STM32L476JGY6T R ST 2 1 U2 150 mA, 1.8 V low quiescent current low noise LDO LD39115J18R ST 3 1 U9 Ultra-low Power Acc + Magn LSM303AGRTR ST 4 1 U10 Low-Power Accelerometer + Gyroscope LSM6DSMTR ST 5 1 U6 Bluetooth Low- Energy Chip V4.1 - MS BlueNRG-MSCSP ST 6 1 U13 Low-Power Pressure sensor LPS22HBTR ST 7 1 U11 MEMS audio sensor digital microphone MP34DT04 ST 8 1 U4 Bluetooth Low- Energy Balun Chip BALF-NRG-01D3 ST 9 1 X2 CRYSTAL 32MHZ 8PF SMD CX2016DB32000D 0FLJCC AVX 10 1 X1 32.7680kHz, 20ppm, 4pF, 60kΩ Crystal ABS06-107- 32.768KHZ-T Abracon 11 2 C2, C20 4pF 25V CAP CER NP0 0201 CBR02C409B3GA C Kemet 12 2 C12, C17 15pF 25V CAP 0201 NP0 02013A150JAT2A AVX 13 1 FT1 10pF 25V CAP CER NP0 0201 250R05L100GV4T Johanson Technology 14 1 R2 0 Ω Resistor SMD R0402 Any 15 1 FT2 16 1 MT 0.40pF 25V CAP CER NP0 0201 250R05L0R4AV4T Johanson Technology 17 2 C32, C34 2.2µF 6.3V CAP CERAMIC X5R, 0201 02016D225MAT2A AVX

UM2101 Board schematic and bill of materials Item Q.ty Ref Value Notes Part number Manufacturer 18 1 C9 0.22µF 6.3V CAP CER X7S 0201 C0603X7S0J224K0 30BC TDK 19 1 C30 150nF, 10V CAP, MLCC, X5R, 0201 C0603X5R1A154K 030BB TDK 20 2 C14, C31 100pF 25V CAP CER NP0 0201 250R05L101JV4T Johanson Technology 21 1 ANT1 2.4GHZ ANTENNA SMD ANT016008LCS24 42MA1 TDK 22 9 C4, C5, C10, C11, C13, C18, C29, C33, C43 0.1µF 6.3V ±10% CAP CER X5R 0201 GRM033R60J104K E19D Murata 23 1 R1 560 Ω Resistor SMD Any 24 9 C1, C3, C6, C7, C8, C15, C16, C19, C44 1µF 6.3V CAP CER X5R 0201 CL03A105KQ3CS NC Samsung 25 1 LED 605 nm, 2 V, 10 mA, 50 mcd LED, Low Power, Orange KPG-0603SEC-TT KINGBRIGHT 26 1 CONN 0.4mm Connector Board- to-Board BM10NB(0.8)- 16DS-0.4V(51) Hirose 27 1 L1 3.9nH 400mA

300 MΩ FIXED IND LQP03TN3N9B02D Murata

2.54mm, L=15cm 5 pin ribbon cable Table 7: STLCX01V1 bill of materials Item Q.ty Ref Value Notes Part number Manufacturer 1 1 CN2 BM10JC-16DP- 0.4V(53) BM10JC-16DP- 0.4V(53) Hirose 2 1 CN5 HEADER 10 SSQ-110-03-L-S Samtec 3 2 CN6,CN9 HEADER 8 SSQ-108-03-L-S Samtec 4 1 CN8 HEADER 6 SSQ-106-03-L-S Samtec 5 5 C1,C5,C1 0,C13,C14 100nF X7R 6 2 C4,C6 47uF, 6.3V Tantal 7 4 C8,C9,C1 1,C12 4.7uF, >6.3V, <2 Ω ESR Tantal 8 2 C15,C16 4.7uF, 10V X5R 9 1 J1 PHONOJACK STEREO 35RASMT4BHNTR X Switchcraft 10 1 J2 Header M 3x1

Board schematic and bill of materials UM2101 Item Q.ty Ref Value Notes Part number Manufacturer 11 4 J3,J4,J5,J

6 PCB Hole

12 1 RESET SYS_MODE PTS820 J20M SMTR LFS C&K Components 13 1 R1 47kΩ ±1% 14 1 R2 147kΩ±1% 15 11 SB2,SB3, R3,SB4,R 4,SB5,SB 6,SB7,SB 9,SB16,S B17 16 2 R5,R6 4K7 17 14 SB1,SB8, SB10,SB1 1,SB12,S B13,SB14, SB15,SB1 8,SB19,S B20,SB21, SB22,SB2 NC 18 1 SWD CON5 19 1 USB USB-MICRO USB3075-30-A GCT 20 1 U1 USBLC6-2P6 USBLC6-2P6 ST 21 1 U3 PCM1774RGP PCM1774RGP TI 22 1 U4 LDK120M-R LDK120M-R ST 23 1 U5 ST2378ETTR ST2378ETTR ST Table 8: STLCR01V1 bill of materials Item Q.ty Ref Value Notes Part number Manufacturer 1 1 BATT Battery Connector 78171-0003 Molex 2 1 CHRG LED Red 3 3 C1,C8,C9 100nF X7R 4 4 C2,C3,C6, C7 10V, 4.7µF X5R 6 1 C10 10V, 1µF X5R 7 1 LED1 LED Green 8 1 R1 47kΩ±1% 9 1 R2 147kΩ±1% 10 1 R3 2kΩ 11 2 R4,R8 1kΩ 12 1 R5 20kΩ±1%

UM2101 Board schematic and bill of materials Item Q.ty Ref Value Notes Part number Manufacturer 13 3 R6,R7,R1 1 NC 14 1 R10 0 Ω 15 1 R9 50mΩ±1%, >=1/16W 16 1 SD Micro-SD DM3D-SF Hirose 17 1 SWD CON5 18 1 SW1 PWR SSAJ120100 Alps Electric Co. 19 1 USB USB-MICRO USB3075-30-A GCT 20 1 U1 USBLC6-2P6 USBLC6-2P6 ST 21 1 U2 STBC08PMR STBC08PMR ST 22 1 U3 LDK120M-R LDK120M-R ST 23 1 U4 STC3115IQT STC3115IQT ST 24 1 U5 HTS221 HTS221 ST 25 1 Battery 3.7V 100mAh LiPO-501225 3pin connector LiPO-501225 Himax electronics 26 1 Plastic Box Plastic Box 27 2 M2-Nut HEX shape HEX Nut M2 - steel RS or equivalent 28 1 M2-Screw Pan head - Phillips 10mm M2 Pan head Phillips - steel RS or equivalent 29 1 M2-Screw Pan head - Phillips 12mm M2 Pan head Phillips - steel RS or equivalent

Board schematic and bill of materials UM2101

7.2 Schematic diagrams

Figure 14: STEVAL-STLCS01V1 schematic diagram (1 of 2) Decoupling Capacitors LED 1KPG-0603SEC-TT GND R1LED SAI_SD 1u1u 100n 100n1u GND GNDGNDGND GND GND GND C1C3 C4 C5C6C8 C15 VDD VDD VDD VDD VDD VDD VDDUSB Crystal ABS06-107-32.768KHZ-T 4p 4p GND GND C2 C20 OSC32_OUT OSC32_IN Ultra-low-power DSP STM32L476xx Microcontroller STM32L476JGY6 VDDUSBA1 PA15A2 PD2A3 PG9A4 PG14A5 PB3A6 PB7A7 VSS1A8 VDDA9 VSS2B1 PA14B2 PC12B3 PG10B4 PG13B5 VDDIO2B6 PB6B7 PC13B8 VBATB9 PA12C1 PA13C2 PC11C3 PG12C5 PG11C4 PB4C6 PB5C7 PC15C8 PC14C9 PA11D1 PA10D2 PC10D3 BOOT0D7 PH1D8 PH0D9 PC9E1 PA8E2 PA9E3 PB8 E7PB9 E8NRST E9PC7 F1PC8 F2PC6 F3PC2 F7PC1 F8PC0 F9PB15 G1PB14 G2PB11 G3PA1 G4PA4 G5PA2 G6PC3 G7VREF+ G8VSSA G9 PB12 H1PB13 H2PB10 H3PA7 H4PA6 H5PA5 H6PA3 H7PA0 H8VDDA H9VDD2 J1VSS3 J2PB2 J3PB1 J4PB0 J5PC5 J6PC4 J7VDD3 J8VSS4 J9 BLUE_MOSI BLUE_SCK BLUE_IRQ BLUE_MISO BLUE_CS BLUE_RST GND GND GND GND GND GND VDD VDD VDD VDD VDD VDD NRST TXD-USB_DM TXD-USB_DM GPIO6 GPIO5 GPIO3 GPIO2 GPIO2 GPIO2 VDDUSB VDDUSB MIC_CLK RXD-USB_DP RXD-USB_DP SAI_SCK SAI_FS SAI_MCLK SAI_SD INT2 INT2 INT2 INT2 INT2 INT2 MIC_DATA OSC32_OUT OSC32_IN CS_AG CS_M CS_A CS_P SPI_CLK SPI_SDA TEST1 Low-Drop Out Voltage Regulator LD39115J18 VDD GND GND 100n GND GND GND VDD VDD VDD ENA2 GND A1 INB2 OUT B1 C10 C16C19 R2VDD VIN VDDUSB Hirose bottom connector (optional) BM10NB(0.8)-16DS-0.4V(51) P1P1 P2 P2 P3P3 P4 P4 P5P5 P6 P6 P7P7 P8 P8 P9P9 P10 P10 P11P11 P12 P12 P13P13 P14 P14 P15P15 P16 P16 G2G2 G1G1 G4 G4 G3 G3 CONN GND GND GND GND GND VDD NRST VIN TXD-USB_DM GPIO6 GPIO5 GPIO3 GPIO2 VDDUSB MIC_CLK RXD-USB_DP SAI_SCKSAI_FS SAI_MCLK SAI_SD SWD_GND SWD_IO SWD_CLK SWD_VDD LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6) LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4 ADC_IN3, DFSDM_CKOUT USART RX or USB DP USART TX or USB DM SWD_RST SPI3_NSS, SAI2_SD_A SPI3_MOSI, SAI2_MCLK_A SPI3_SCK, SAI2_SCK_A SPI3_MISO, SAI2_FS_A Moon Pin output GND GND GND VDD NRST VIN TXD-USB_DM GPIO6 GPIO5 GPIO3 GPIO2 VDDUSB MIC_CLK RXD-USB_DP SAI_SCK SAI_FS SAI_MCLK SAI_SD +5V supply 3.0V - 3.6V supply

UM2101 Board schematic and bill of materials Figure 15: STEVAL-STLCS01V1 schematic diagram (2 of 2) Digital Microphone MP34DT04GND CLK B3 DOUT B4 GNDG1*4 LR B2VDDB1 U11 GNDVDD MIC_CLK MIC_DATA Accelerometer + Gyroscope 100n 100n C11 C18 GND GND VDD VDD LSM6DS3H SDOP1 SDXP2 SCXP3 INT1P4 VDDIOP5 GND1P6 GND2P7 VDD P8INT2 P9OCS P10NC P11 CS P12SCL P13SDA P14 U10 GND GND GND GND VDD VDD VDD INT2 CS_AG SPI_CLK SPI_SDA Pressure Sensor LPS22HB SDOP5 VDD_IOP1 SCLP2 CS P6INT/DRDY P7 GND1 P8 GND2 P9 VDD P10RESP3 SDAP4 U13 GND GND GND VDD VDD CS_PSPI_CLK SPI_SDA Accelerometer + Magnetometer 220n GND LSM303AGR SCLP1 CS_XLP2 CS_MAGP3 SDAP4 DRDY P7GND2 P8 VDD P9VDD_IO P10 INT1 P12INT2 P11C1P5 GND1P6 GND GND VDD VDD CS_M CS_A SPI_CLK SPI_SDA BlueNRG - Bluetooth low energy chip Tuning Balun + chip antenna

Board schematic and bill of materials UM2101 Figure 16: STLCX01V1 schematic diagram SH1 OUT SensorTile SAI_FS SWDIO TILE_RESET SensorTile ConnectorUSB, SWD, Power RXD-USB_DP SWDCLK SB8 CN2 BM10B(0.8)-16DP-0.4V(51) C15 4.7μF 6 3V3 3V3 GND MIC_CLK VDDUSB GPIO2 D11 GPIO3 SAI_MCLK V_USB V_USB VIN RXD-USB_DP GPIO2 VIN

3 SB9

SAI_MCLK Max 200mA SAI_SCK C16 4.7μF TXD-USB_DM 3 EN SensorTile Footprint V_USB VDD ADJ SWDCLK SWDIO TXD-USB_DM G1 TXD-USB_DM VIN GPIO3 TILE_RESET SH2 VDD IN VDDUSB USB-MICRO MIC_CLK 17 VDDUSB 100nF SAI_SD Fixing holes On the corners Hole: 2.2mm Head: 4mm STM32 Nucleo 147K RXD-USB_DP VBUS 5 SAI_SCK VDD RESET

3 C14

TILE_RESET2 47K VIN SAI_FS SAI_SD GND2 SAI_SCK I2C_SCL 3V3 CN9 SB18 UART_TX SB19 7 GPIO2_3V3 CN5 4K7 SPI_CS SB15 SB14 SB12 UART_RX SB16 TILE_RESET SAI_MCLK GPIO3_3V3 SAI_FS SPI_SCK CN6 3V3_Nucleo GPIO21 I2C_SDA GPIO3 SB1 SPI_MOSI 4K7 SPI_MISO 3V3 CN8 SB17 SAI_SD MIC_CLK_3V3 SB13 SWDCLK 3 TILE_RESET 5 SWD VDD SWDIO SB10 C10 100nF UART_RX GPIO3 SB20 SB23 RXD-USB_DP VCC CC7 20 TXD-USB_DM CC3 CC1 ST2378ETTR UART_TX MIC_CLK_3V3 3 CC2 OE TXD-USB_DM CC4 MIC_CLK VDD CC5 CC6 SB22 GPIO3_3V3 SB11 GPIO2_3V3 CC8 VL VDD C13 100nF RXD-USB_DP GPIO2 GND SB21 3V3 U4 LDK120M-R ADR VCOM SAI_FS SCKI SAI_MCLK SB5 R40R 3V3 AGND SB4 11 P MODE PHONOJACK STEREO H_L VDD7 3V3 AIR VIO PAD C4 47μF LRCK C11 4.7μF SB2 PGNDGPIO3 DIN SB6 SB7 100nF VCC SAI_SCK GPIO2 206 R30R BCK C9 4.7μF SDA C12 4.7μF SAI_SD 3V3

8 DGND

H_R SB3 SCL C8 4.7μF VPA 5C6 47μF U3 PCM1774RGP U1 USBLC6-2P6

UM2101 Board schematic and bill of materials Figure 17: STLCR01V1 schematic diagram

Formal notices required by the U.S. Federal Communications Commission ("FCC") UM2101 8 Formal notices required by the U.S. Federal Communications Commission ("FCC") Model: STEVAL-STLKT01V1 FCC ID: S9NSTILE01 Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause harmful interference and void the user’s authority to operate this equipment. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. For Class A Digital Devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. For Class B Digital Devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference's by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and the receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help.

UM2101 Formal notices required by the Industry Canada ("IC")

9 Formal notices required by the Industry Canada

("IC") Model: STEVAL-STLKT01V1 IC: 8976C-STILE01 English: This Class A or B digital apparatus complies with Canadian CS-03. Changes or modifications not expressly approved by the party responsible for compl iance could void the user’s authority to operate the equipment. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. French: Cet appareil numérique de la classe A ou B est conforme à la norme CS-03 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. 'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Table 9: Document revision history Date Version Changes 17-Aug-2016 1 Initial release.