DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 18
Technical content
UBA2015P reference design 230 V (AC) Rev. 1.2 — 14 November 2011 User manual Document information Info Content Keywords UBA2015P, 2 x 28W/35W T5 fluorescent lamp ballast Abstract This document describes the UBA2015P reference design for 230 V (AC).
User manual Rev. 1.2 — 14 November 2011 2 of 18 Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC)
Revision history
v.1.2 20111114 third issue v.1.1 20110704 second issue v.1 20110503 first issue
User manual Rev. 1.2 — 14 November 2011 3 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) 1. Introduction This document describes the specification and use of the UBA2015P board. This reference ballast design is intended to drive two TL5HE28W or TL5HE35W lamps. Do not power the board without IC; the VDD decoupling capacitor voltage exceeds the rated value when the IC does not limit the voltage to 13 V. 2. Safety warning The board needs to be connected to the mains voltage. Touching the board while it is connected to the mains voltage must be avoided at all times. An isolated housing is obligatory when used in uncontrolled, non laboratory environments. Galvanic isolation of the mains phase using a variable transformer is always recommended. Fig 1. UBA2015P reference board 019aac298 WARNING Lethal voltage and fire ignition hazard The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended. a. Isolated b. Not isolated Fig 2. Variac isolation symbols 019aab173 019aab174
4.1 Block diagram
- The fuse
- Surge protection against fast AC transients
- ElectroMagnetic Interference (EMI) filter
- Full-wave rectifier
- Preconditioner or Power Factor Correction (PFC) The output of the PFC connects to a electrolytic buffer capacitor to supply the half-bridge circuit. The lamp connects to the half-bridge circuit. The UBA2015P controller IC controls the PFC and the half-bridge circuit. The PFC is implemented as an up converter in boundary conduction mode. The resonant circuit is voltage fed by the half-bridge which consists of two N-channel MOSFETs. The resonant circuit includes a transformer for electrode (pre)heating.
Table 1. Electrical board specification Table 2. Supported lamps Table 3. Ballast performance
User manual Rev. 1.2 — 14 November 2011 5 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) This type of topology with inductive heating is used in many commercial ballasts whose power exceeds 25 W, making it a cost-effective application. The lamps are connected in parallel.
4.2 Performance indicators
4.2.1 Input power, power factor and Total Harmonic Distortion (THD)
4.2.2 Lamp end of life detection
IEC asymmetrical power test: The End-Of-Life (EOL) resistor REOL is increased (manually controlled rheostat of 1 k) until the ballast shuts down. A rheostat is a two-terminal variable resistor. See IEC-61347-2-3 Section 17.3 where this test is described. When the EOL voltage exceeds the thresholds of the internal window comparator the slow fault timer (CPT pin) starts. Fig 3. Block diagram 019aac299 mains voltage input FUSE SURGE PROT EMI FILTER AC RECTIFIER PFC BUFFER CAP HALF BRIDGE RESONANT CIRCUIT UBA2015 CONTROLLER lamps Measured with a dummy lamp (resistors only) (1) Power factor (2) Current THD (3) Input power (W) Fig 4. THD, power factor and input power as a function of AC mains input voltage Mains voltage (V) 180 280260220 240200 019aac290 0.4 0.6 0.2 0.8 1.0 75.2 75.4 75.0 75.8 75.6 76.0 Power (W) 74.8 (1) (3) (2) Power factor, THD
User manual Rev. 1.2 — 14 November 2011 6 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) Measurements: P2 = Mean(PEOL) between divisions 4 and 5 on the plot Traces: (1) C1 = Z1 = EOL (2) C2 = Z2 = CPT (3) F1 = F2 P (REOL Fig 5. EOL shutdown triggered by V th(low)EOL 019aac291
User manual Rev. 1.2 — 14 November 2011 7 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC)
4.2.3 Lamp removal detection
The UBA2015/UBA2016 family has several fast protection features for lamp removal detection:
- Capacitive Mode Protection (CMP)
- Saturation protection
- OverVoltage Protection (OVP) In this application the overvoltage protection is triggered during lamp removal. Other applications with a different operating frequency with respect to the resonance frequency can be triggered differently. The main function of the IC is to shut down as fast as possible when a lamp is removed. The fast protection on the VFB pin is repeatedly triggered (VVFB > 3.35 V (typical)) during the lamp removal process and as a result the fast fault detection timer tdet(fault) ends. In this application the shutdown is not triggered by pin SLHB because of the 340 ns leading edge blanking time on this pin. Measurements: P2 = Mean(Peol) between divisions 4 and 5 on the plot Traces: (1) C1 = Z1 = EOL (2) C2 = Z2 = CPT (3) F1 = F2 P (REOL) Fig 6. EOL shutdown triggered by V th(high)EOL 019aac292
User manual Rev. 1.2 — 14 November 2011 8 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) (1) C1 = Z1 = GLHB (2) C2 = Z2 = SLHB (3) C3 = Z3 = VFB (4) C4 = Z4 = SHHB Fig 7. Shutdown after lamp removal triggered by Vth(ov)(VFB) 019aac293
User manual Rev. 1.2 — 14 November 2011 9 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC)
4.2.4 ElectroMagnetic Interference (EMI) - conducted emission tests
The board with lamp complies with EN55015 quasi-peak and average measurements, no metal shielding required for acceptable EMI performance. The ballast was tested on a reference luminare with two 35 W T5 lamps. Fig 8. Photograph of the EMI conducted emission measurement setup 019aac300
User manual Rev. 1.2 — 14 November 2011 10 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) a. Line L b. Line N Fig 9. EMI: conducted emission test results 019aac294 019aac295
User manual Rev. 1.2 — 14 November 2011 11 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) 5. Wiring diagram The ballast must be connected as shown in Figure 10. The chassis must be connected to ground which is available on mounting hole E1. Keep the hot wires to the lamps as short as possible (red and blue wires), so parasitic capacitance remains as low as possible. Fig 10. Wiring diagram 019aac296 BALLAST J2-7 RED J2-6 RED GREEN/YELLOW J1-1 BLACK J1-2 WHITE J1-3 protective ground hot neutral J2-5 BLUE J2-4 BLUE J2-3 BLACK J2-2 GREEN J2-1 GREEN LAMP LAMP
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x User manual Rev. 1.2 — 14 November 2011 12 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) 6. Schematic Fig 11. Schematic diagram 019aac301 330 kΩ 0.82 Ω 2SK3567 3.48 kΩ R18 180 kΩ R20 1 kΩ R12 464 kΩ R19 1 kΩ D13 1N4937 D12 1N4937 41.2 kΩ 41.2 kΩ R22 1 MΩ R13 1 Ω 562 kΩ 562 kΩ R21 D14 nm 1N4118 R16 10 MΩ R15 L3A 7608000901 3.9 mH R17 D11 1N4148 D10 1N4148 UF4006 2.2 nF 250 V FUSE HOLDER 20 × 5 mm F3 fuse holder cover, 20 × 5 mm F2 T1A 710 V 220 nF C21 47 nF C15 100 nF C18 220 nF C20 47 nF C19 2.7 nF C22 2.7 nF 10 nF 1N4007 1N4007 470 nF C14 1 nF 1N4007 1N4007 22 μF 2SK3567 WB1 6mains N 2 × 10 mH 81 109 AUXPFCGND GND GND T2A T2B 1.8 mH C27 220 nF 4.7 Ω LAMP STARTUP GPFC GHHB SHHB VFB FBPFC 82 kΩ R11 33 kΩ R10 330 kΩ R14 X11 GND jumper link 1 kΩ 10 kΩ nm 1N5244B 470 nF 1 nF 390 kΩ C16 82 nF C13 200 pFC17 100 nF C11 100 nF 3.5 mm E2 E3 E4 mounting hole 3.5 mm non plated E5 E6 1N4148 1N4148 100 nF 2.2 nFC12 68 nF C10 22 nF UBA2015P in socket GND GNDGND GND GND
11 PH/ENFBPFC
12 n.c.COMPPFC 9
13 CPTAUXPFC 8
14 CFGPFCGPFC 7
15 CIFBGND 6
16 IREFVDDVDD 5
17 VFBGLHBGLHB 4
18 EOLSHHBSHHB 3
19 IFBFSHB 2
20 SLHB
U X2 mains L TMP-3093 chassis L4C 9 μH C23 68 nF 109 L3C 9 μH
45 L4B
9 μH X56 X65 X74 X83 X92 X101 L3B 9 μH C25 68 nF C26 68 nF C24 68 nF L4A 7608000901 3.9 mH 81 2SK3567 GLHB SLHB STARTUP EOL VDD LAMP TMP-3094
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx User manual Rev. 1.2 — 14 November 2011 13 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) 7. PCB layout Fig 12. PCB layout 019aac297
Table 4. Bill of materials
2 C2 100 nF; 10 %; 275 V Vishay BFC233912104
3 C3 220 nF; 10 %; 400 V Xicon 146-MEF2G224K
6 C6 1 nF; 10 %; 500 V Vishay H102K25X7RL63J5R
7 C7 470 nF; 5 %; 63 V Kemet R82DC3470DQ60J
9 C9 100 nF; 10 %; 100 V Vishay BFC236525104
10 C10 22 nF; 10 %; 100 V BC components 2222 370 21223
11 C11 100 nF; 10 %; 100 V Vishay BFC236525104
14 C14 1 nF; 10 %; 50 V Vishay K102K15X7RF5TH5
15 C15 100 nF; 10 %; 100 V Vishay BFC236525104
16 C16 82 nF; 5 %; 63 V Kemet MMK5823M63J01L4BULK
17 C17 100 nF; 10 %; 100 V Vishay BFC236525104
18 C18 220 nF; 10 %; 400 V Xicon 146-MEF2G224K
20 C20 47 nF; 5 %; 100 V Kemet R82EC2470AA60J
21 C21 47 nF; 5 %; 100 V Kemet R82EC2470AA60J
23 C23 68 nF; 10 %; 400 V Epcos B32521C6683K
24 C24 68 nF; 10 %; 400 V Epcos B32521C6683K
25 C25 68 nF; 10 %; 400 V Epcos B32521C6683K
26 C26 68 nF; 10 %; 400 V Epcos B32521C6683K
27 C27 100 nF; 10 %; 275 V Vishay BFC233912104
28 D1 1N4007-E3/51 Vishay 1N4007-E3/51
29 D2 1N4007-E3/51 Vishay 1N4007-E3/51
30 D3 1N4007-E3/51 Vishay 1N4007-E3/51
31 D4 1N4007-E3/51 Vishay 1N4007-E3/51
32 D5 UF4006-E3/73 Vishay UF4006-E3/73
33 D6 1N4148 NXP Semiconductors 1N4148,133
34 D7 1N5244B Fairchild Semiconductor 1N5244B
35 D8 1N4148 NXP Semiconductors 1N4148,133
36 D9 1N4148 NXP Semiconductors 1N4148,133
37 D10 1N4148 NXP Semiconductors 1N4148,133
38 D11 1N4148 NXP Semiconductors 1N4148,133
39 D12 1N4937/54; 600 V; 1 A Vishay 1N4937-E3/54
40 D13 1N4937/54; 600 V; 1 A Vishay 1N4937-E3/54
41 D14 1N4007-E3/51 Vishay 1N4007-E3/51
42 F1 fuse holder; 20 5 mm Multicomp MCHTC-15M
44 F3 fuse holder cover; 20 5 mm Multicomp MCHTC-150M
45 J1 PCB mounted screw terminal
46 J2 PCB mounted screw terminal
47 L1 B82731T2102A020; 2 10 mH Epcos B82731T2102A020
50 Q1 2SK3567 Toshiba 2SK3567
51 Q2 2SK3567 Toshiba 2SK3567
52 Q3 2SK3567 Toshiba 2SK3567
53 R1 330 k; 5 %; 2 W Welwyn MFP2-330K J1
65 R13 1 ; 5 %; 1 W; 400 V KOA Speer MOSX1/2CT52R1R0J
66 R14 330 k ; 5 %; 2 W Welwyn MFP2-330K J1
75 T2 Transformer 760801095 Würth ElektroniK 760801095
Table 4. Bill of materials …continued
76 U1 UBA2015P NXP Semiconductors UBA2015P
710 Vclamp
78 WB1 wire-bridge-4E 3M 923345-04
79 X11 jumper link Fischer Elektro LB 03 G
User manual Rev. 1.2 — 14 November 2011 17 of 18 NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) 9. Legal information
9.1 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
9.2 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.
9.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
NXP Semiconductors UM10466 UBA2015P reference design 230 V (AC) © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 November 2011 Document identifier: UM10466 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 10. Contents