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NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative. Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use. Recommended Substitutions: Hall Effect Latches A3175 and A3177 For new customers and applications:

  • for the A3175, refer to the A1211
  • for the A3177, refer to the A1210 Date of status change: October 31, 2005 These parts are no longer in production The device should not be purchased for new design applications. Samples are no longer available. Discontinued Product

These Hall-effect latches are temperature-stable and stress-resistant sensor ICs especially suited for electronic commutation in brushless dc motors using multipole ring magnets. Each device includes a voltage regulator, quadratic Hall voltage generator, temperature compensation circuit, signal amplifier, Schmitt trigger, and an open-collector output on a single silicon chip. The on-board regulator permits operation with supply voltages of 4.5 volts to 18 volts. The switch output can sink 10 mA. With suitable output pull up, they can be used directly with bipolar or MOS logic circuits. The three package styles available provide a magnetically optimized package for most applications. Suffix ‘LT’ is a surface-mount SOT89/ TO-243AA package; suffixe ‘UA’ features wire leads for through-hole mounting. HALL-EFFECT LATCHES Always order by complete part number, e.g., UGN3175LT . See Magnetic Characteristics table for differences between devices. teehS ataD d4.90672

FEATURES

■ Symmetrical Response ■ 4.5 V to 18 V Operation ■ Open-Collector Output ■ Reverse Battery Protection ■ Activate With Small, Commercially Available Permanent Magnets ■ Solid-State Reliability ■ Small Size ■ Superior Temperature Stability ■ Resistant to Physical Stress ABSOLUTE MAXIMUM RATINGS Reverse Battery Voltage, VRCC . . . . -18 V Magnetic Flux Density, B . . . . Unlimited Continuous Output Current, IOUT . 15 mA Operating Temperature Range, Storage Temperature Range, Pinning is shown viewed from branded s ide.

3175 AND

Dwg. PH-003A 1SUPPLY VCC GROUND OUTPUT X

3175 AND 3177

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000 FUNCTIONAL BLOCK DIAGRAM NOTE: As used here, negative flux densities are defined as less than zero (algebraic convention). Complete part number includes a suffix denoting package type (LT or UA). TA = +25°CT A = -20°C to +85°C Operate Point, B OP UGN3175 25 — 170 15 — 180 UGN3177 50 — 150 25 — 150 Release Point, BRP UGN3175 -170 — -25 -180 — -15 UGN3177 -150 — -50 -150 — -25 Hysteresis, B hys UGN3175 100 200 — 80 180 — UGN3177 100 200 — 50 180 — VCC X REG. Dwg. FH-005-2 GROUND OUTPUT3 Part Number* Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Supply Voltage V CC Operating 4.5 — 18 V Output Saturation Voltage V OUT(SAT) VCC = 18 V, IOUT = 10 mA, B > BOP — 200 300 mV Output Leakage Current I OFF VOUT = 18 V, B < BRP — 0.05 5.0 µA Supply Current I CC VCC = 4.5 V, B < BRP (Output OFF) — 5.0 10 mA Output Rise Time t r VCC = 12 V, RL = 1.1 kΩ , CL = 20 pF — 0.04 2.0 µs Output Fall Time t f VCC = 12 V, RL = 1.1 kΩ , CL = 20 pF — 0.18 2.0 µs ELECTRICAL CHARACTERISTICS at TA = +25°C, VCC = 4.5 V to 18 V (unless otherwise noted). MAGNETIC CHARACTERISTICS in gauss; VCC = 4.5 V to 18 V. Copyright © 1991, 2002 Allegro MicroSystems, Inc.

www.allegromicro.com TYPICAL OPERATING CHARACTERISTICS Suffix “UA” -10 10 30 50 90 AMBIENT TEMPERATURE IN °°°°C -30 Dwg. GH-020 SWITCH POINT IN GAUSS 100 200 -100 -200 V = 14 V CC OPERATE POINT RELEASE POINT 1 32 Dwg. MH-011C 0.0195" 0.50 mm NOM BRANDED SURFACE ACTIVE AREA DEPTH 0.083" 2.12 mm 0.055" 1.39 mmA Suffix “LT” 0.045" 1.15 mm 1 32 Dwg. MH-008-1C 0.0305" 0.775 mm NOM ACTIVE AREA DEPTH 0.090" 2.30 mm A ELEMENT LOCATIONS (±0.005” [0.13mm] die placement) The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, o r manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support appliances, devices, or systems without express written approval. The information included herein is believed to be accurate a nd reliable. However, Allegro Micr oSystems, Inc. assumes no responsi- bility for its use; nor for any infringements of patents or other rights of third parties that may result from its use.

Worcester, Massachusetts 01615-0036 (508) 853-5000 PACKAGE DESIGNATOR ‘LT’ (SOT89/TO-243AA) Dimensions in Inches (for reference only) Dimensions in Millimeters (controlling dimensions) NOTES: 1. Exact body and lead configuration at vendor’s option within limits shown. 2. Supplied in bulk pack (500 pieces per bag) or add "TR" to part number for tape and reel. 3. Only low-temperature (≤240°C) reflow-soldering techniques are recommended for SOT89 devices. Dwg. MA-009-3A in 1 23 0.072 0.064 0.167 0.155 0.059 BSC 0.0189 0.01420.047 0.035 0.102 0.090 0.063 0.055 0.0173 0.0138 0.090 0.0840.0221 0.0173 0.118 BSC 0.181 0.173 Dwg. MA-009-3A mm 1 23 4.60 4.40 1.83 1.62 4.25 3.94 1.50 BSC 0.48 0.361.20 0.89 2.60 2.29 1.60 1.40 0.44 0.35 2.29 2.130.56 0.44 3.00 BSC B 0.098 0.031 0.102 0.047 0.181 0.079 Dwg. MA-012-3 in Pads 1, 2, 3, and A — Standard SOT89 Layout Pads 1, 2, 3, and B — Low-Stress Version Pads 1, 2, and 3 only — Lowest Stress, But Not Self Aligning 0.028 TYP 0.031 TYP A 3 13 B 2.5 0.8 2.6 1.2 4.6 2.0 Dwg. MA-012-3 mm Pads 1, 2, 3, and A — Standard SOT89 Layout Pads 1, 2, 3, and B — Low-Stress Version Pads 1, 2, and 3 only — Lowest Stress, But Not Self Aligning 0.7 TYP 0.8 TYP A

www.allegromicro.com Dimensions in Inches (controlling dimensions) Dimensions in Millimeters (for reference only) PACKAGE DESIGNATOR ‘UA’ NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line). 2. Exact body and lead configuration at vendor’s option within limits shown. 3. Height does not include mold gate flash. 4. Recommended minimum PWB hole diameter to clear transition area is 0.035" (0.89 mm). 5. Where no tolerance is specified, dimension is nominal. 6. Supplied in bulk pack (500 pieces per bag). Dwg. MH-014E in 0.164 0.159 0.062 0.058 0.0173 0.0138 0.050 BSC 45° 0.640 0.600 0.0189 0.0142 0.085 MAX 45° 0.031123 0.122 0.117 SEE NOTE Dwg. MH-014E mm 4.17 4.04 1.57 1.47 0.44 0.35 1.27 BSC 45° 16.26 15.24 0.48 0.36 2.16 MAX 45° 0.79123 3.10 2.97 SEE NOTE Radial Lead Form (order A317xxUA-LC) NOTE: Lead-form dimensions are the nominals produced on the forming equipment. No dimensional tolerance is implied or guaranteed for bulk packaging (500 pieces per bag). 0.620" 0.500" (15.7 mm 12.7 mm) 0.100" (2.5 mm) Dwg. MH-026 0.108" (2.74 mm) 123