UG3803X

UB3803X STANLEY | Alldatasheet

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Technical content

Features

Package φ3 Round shape type, UB,UC,UG : Water Clear epoxy UY : Pale Yellow Clear epoxy UR : Pale Red Clear epoxy Rank grouping parameter Soldering methods ESD Packing TTW (Through The Wave) soldering and manual soldering InGaN : Less than 1kV(HBM), AlGaInP : More than 2kV(HBM) Bulk : 200pcs(MIN.) Sorted by luminous intensity per rank taping 2006.7.31

Color and Luminous Intensity Page 2 TYP. I F MIN. T YP. I F UB3803X InGaN Blue 470 20 500 1,000 20 UC3803X InGaN Blue Green 505 20 1,200 3,360 20 UG3803X InGaN Green 525 20 1,680 3,360 20 UY3863X AlGaInP Yellow Pal e Yellow 590 20 720 1,440 20 UR3863X AlGaInP Red Pal e Red 630 20 640 1,280 20 Water Clear Part N o. M aterial Emitted Color Lens Color Clear Iv (m c d) Luminous Intens ityDominant Wavelength λd (nm) 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series (Ta=25℃)

Power Dissipation P d 105 105 105 150 150 mW Forward Current I F 25 25 25 50 50 mA Pulse Forward Current ※1 IFRM 60 60 60 100 100 mA De ra ting Reverse Voltage V R 55555V Ope ra ting Tem perature Topr ℃ St or age Tem perature Tst g ℃ Item S ymbol Unit Absolute M aximum Ratings -40~ +85 -40~+100 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series ※1 IFRM Measurement condition : Pulse Width≦1ms., Duty≦1/20. (Ta=25℃)

Electro-Optical Characteristics Page 4 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Conditions UB UC UG UY UR Reverse Current V R =5V I R MAX. 100 100 100 100 100 μA Peak Wavelengt h I F =20mA λp TYP . 465 502 517 592 641 nm Dominant Wavelength IF =20mA λd TYP . 470 505 525 590 630 nm Spect r al Li ne H al f Width IF =20mA ⊿λ TYP . 26 30 35 18 18 nm Half Intensity Angle IF =20mA 2 θ1 / 2 T Y P . 2 62 62 62 22 2 d e g . Item S ymbol Unit Forward Volt age I F =20mA V F V Characteristics (Ta=25℃)

Single Color φ3 Flush Mount Round Shape Type U□38□3X Series (Ta=25℃) A 1,200 2,400 720 1,440 640 1,280 B 1,680 3,360 1,000 2,000 900 1,800 C 500 1,000 2,400 4,800 1,680 3,360 1,440 2,880 1,280 2,560 D 700 1,400 3,360 6,720 2,400 4,800 2,000 4,000 1,800 3,600 E 1,000 2,000 4,800 9,600 3,360 6,720 2,880 5,760 2,560 5,120 F 1,400 2,800 6,720 - 4,800 9,600 4,000 - 3,600 - G 2,000 4,000 6,720 13,440 H 2,800 - 9,600 - URUB IV（mcd） Condition IF = 20mA Rank UC UG UY ˞Please contact our sales staff concerning rank designation of UY and UR. 2004.12.27

Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Page 6 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage VF(V) Forward Current IF(mA) Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Relative Intensity Technical Data(UB)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Ambient Temperature vs. Relative Intensity Condition : IF=20mA Ambient Temperature : Ta(℃) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Maximum Forward Current : IF MAX. (mA) Relative Intensity Technical Data(UB) Ambient Temperature vs. Forward Voltage Ambient Temperature : Ta(℃) Forward Voltage VF(V) Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW)

Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 8 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Technical Data(UB) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Duty (%) Maximum Forward Current : IF MAX. (mA) IF peak Max./IF DC MAX.

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage VF(V) Forward Current IF(mA) Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Relative Intensity Technical Data(UC)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Ambient Temperature vs. Relative Intensity Condition : IF=20mA Ambient Temperature : Ta(℃) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Maximum Forward Current : IF MAX. (mA) Relative Intensity Technical Data(UC) Ambient Temperature vs. Forward Voltage Ambient Temperature : Ta(℃) Forward Voltage VF(V) Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Technical Data(UC) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Pulse Width : tw (μs) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Duty (%) Maximum Forward Current : IF MAX. (mA) IF peak Max./IF DC MAX.

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage VF(V) Forward Current IF(mA) Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Relative Intensity Technical Data(UG)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Ambient Temperature vs. Relative Intensity Condition : IF=20mA Ambient Temperature : Ta(℃) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Maximum Forward Current : IF MAX. (mA) Relative Intensity Technical Data(UG) Ambient Temperature vs. Forward Voltage Ambient Temperature : Ta(℃) Forward Voltage VF(V) Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Technical Data(UG) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Pulse Width : tw (μs) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Duty (%) Maximum Forward Current : IF MAX. (mA) IF peak Max./IF DC MAX.

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage VF(V) Forward Current IF(mA) Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Relative Intensity Technical Data(UY)

Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Page 16 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Ambient Temperature vs. Relative Intensity Condition : IF=20mA Ambient Temperature : Ta(℃) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Maximum Forward Current : IF MAX. (mA) Relative Intensity Technical Data(UY) Ambient Temperature vs. Forward Voltage Ambient Temperature : Ta(℃) Forward Voltage VF(V) Power Dissipation : Pd (mW)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Technical Data(UY) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Pulse Width : tw (μs) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Duty (%) Maximum Forward Current : IF MAX. (mA) IF peak Max./IF DC MAX.

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage VF(V) Forward Current IF(mA) Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Relative Intensity Technical Data(UR)

Ambient Temperature vs. Relative Intensity Condition : IF=20mA Ambient Temperature : Ta(℃) Page 19 2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Maximum Forward Current : IF MAX. (mA) Relative Intensity Technical Data(UR) Ambient Temperature vs. Forward Voltage Ambient Temperature : Ta(℃) Forward Voltage VF(V) Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW)

2004.10.27 Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Technical Data(UR) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Pulse Width : tw (μs) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Duty (%) Maximum Forward Current : IF MAX. (mA) IF peak Max./IF DC MAX.

(Unit: mm) Single Color φ3 Flush Mount Round Shape Type U□38□3X Series 2007.10.12

Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Page 22 ※The detail is described to LED and Photodet ector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. TTW (Through The Wave) soldering Conditions Solder Bath Temp. Dipping Time 1) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to room temp. before the second dipping process. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 265℃ 5 s Pre-heating 100 ℃ (MAX.) (MAX.) (MAX.) 3 s 2 times 400℃ (MAX.) (MAX.) (MAX.) ※The detail is described to LED and Photodet ector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. 2006.3.31

Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Page 23 Reliability Testing Result Failure Criteria Reliability Testing Result Applicable Standard Testing Conditions Duration Failure Room Temp. Operating Life EIAJ ED- 4701/100(101) Ta = 25℃, IF = Maxium Rated Current 1,000 h 0/25 Resistance to Soldering Heat EIAJ ED- 4701/300(302) 260±5℃, 1.6mm from package base 10s 0/25 Temperature Cycling EIAJ ED- 4701/100(105) Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Wet High Temp. Storage Life EIAJ ED- 4701/100(103) Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 High Temp. Storage Life EIAJ ED- 4701/200(201) Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Low Temp. Storage Life EIAJ ED- 4701/200(202) Ta = Minimum Rated Storage Temperature 1,000 h 0/25 Lead Tension EIAJ ED- 4701/400(401) 10N,1time ( 0.4 and Flat Package : 5N) 10s 0/10 Vibration, Variable Frequency EIAJ ED- 4701/400(403) 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction 2 h 0/10 Items Symbols Conditions Failure criteria Luminous Intensity Iv IF Value of each product Luminous Intensity Testing Min. Value ＜ Spec. Min. Value x 0.5 Forward Voltage V F IF Value of each product Forward Voltage Testing Max. Value ≧ Spec. Max. Value x 1.2 Reverse Current I R VR = Maximum Rated Reverse Voltage V Testing Max. Value ≧ Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking 2007.8.31

Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet Single Color φ3 Flush Mount Round Shape Type U□38□3X Series Page 24 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31