UF5A400D1 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • Ultra-Fast Die Construction
  • Soft, Fast Switching Capability
  • Low Leakage Current
  • Lead Free Finish, RoHS Compliant (Note 1)
  • "Green" Molding Compound (No Br, Sb) Mechanical Data
  • Case: TO252-3L
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Finish – Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208
  • Polarity: See Diagram Ordering Information (Note 2) Part Number Case Packaging UF5A400D1-13 TO252-3L 2500 pieces/reel Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. For packaging details, go to our website at http://www.diodes.com. Marking Information Top View LEFT PIN RIGHT PIN Note: Pins Left & Right must be electrically connected at the printed circuit board. BOTTOMSIDE HEAT SINK AA C Top View Pin-Out UF5A400 = Product Type Marking Code = Manufacturers’ Code Marking YYWW = Date code marking YY = Last two digits of year (ex: 09 for 2009) WW = Week code (01 to 53) YYWW UF5A400

Document number: DS32142 Rev. 3 - 2 2 of 4 www.diodes.com December 2010 © Diodes Incorporated UF5A400D1 NEW PRODUCT Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 400 V Average Rectified Output Current IO 5 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load I FSM 100 A Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance Junction to Case RθJC 2.0 °C/W Typical Thermal Resistance Junction to Ambient (Note 3) RθJA 34 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +175 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Forward Voltage VF ⎯ 0.91 0.77 1.4

1.0 V I

F = 5A, TJ = 25°C IF = 5A, TJ = 125°C Reverse Leakage Current (Note 4) IR ⎯ 0.2 μA mA V R = 400V, TJ = 25°C VR = 400V, TJ = 125°C Reverse Recovery Time trr ⎯ 30 ns I F = 0.5A, IR = 1.0A, Irr = 0.25A IF = 1A, VR = 30V, di/dt = 100A/μs Maximum Junction Capacitance CJ ⎯ 31 50 pf VR = 10VDC, f = 1MHz Notes: 3. Device mounted on Polymide PCB, with 16X recommended pad layout. 4. Short duration pulse test used to minimize self-heating effect. 012345 6 Fig. 1 Forward Power Dissipation I , AVERAGE FORWARD CURRENT (A)F(AV) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 P , POWER DISSIPATION (W)D V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics F 0.00001 0.0001 0.001 0.01 0.1 I, I N STANTANEOUS FORWARD CURRENT (A)F T = 150°CA T = -55°CA T = 25°CA T = 125°CA T = 85°CA

Document number: DS32142 Rev. 3 - 2 3 of 4 www.diodes.com December 2010 © Diodes Incorporated UF5A400D1 NEW PRODUCT 0 50 100 150 200 250 300 350 400 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics R 0.01 0.1 100 II NSTANTANEOUS REVERSE CURRENT (µA)R, T = 125°CA T = 2 5 ° CA T = 8 5 ° CA T = 150°CA 100 0 5 10 15 20 25 30 35 40 Fig. 4 Total Capacitance vs. Reverse Voltage V , DC REVERSE VOLTAGE (V)R C , TOTAL CAPACITANCE (pF)T f = 1MHz I AVERAGE FORWARD CURRENT (A)F(AV), 0 50 75 100 125 175 T , AMBIENT TEMPERATURE ( C) Fig. 5 Forward Current Derating Curve A ° 150 Based on Lead T emperature (T ) R = R L θθJA JC Note 3 25 0 80 160 240 320 400 Fig. 6 Operating Temperature Derating V , DC REVERSE VOLTAGE (V)R 100 125 175T , DERATED AMBIENT TEMPERATURE (°C)A 150 Package Outline Dimensions TO252-3L Dim Min Max Typ A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07 b 0.64 0.88 0.783 b2 0.76 1.14 0.95 b3 5.21 5.46 5.33 c2 0.45 0.58 0.531 D 6.00 6.20 6.10 D1 5.21 − − e − − 2.286 E 6.45 6.70 6.58 E1 4.32 − − H 9.40 10.41 9.91 L 1.40 1.78 1.59 L3 0.88 1.27 1.08 L4 0.64 1.02 0.83 a 0° 10° − All Dimensions in mm E 2X b2 D A e L 3X b a H A2 E1

Document number: DS32142 Rev. 3 - 2 4 of 4 www.diodes.com December 2010 © Diodes Incorporated UF5A400D1 NEW PRODUCT Suggested Pad Layout IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does Di odes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or us er of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support dev ice or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com Dimensions Value (in mm) Z 11.6 X1 1.5 X2 7.0 Y1 2.5 Y2 7.0 C 6.9 E1 2.3 C Z