UF28100H MA-COM | Alldatasheet

Document overview

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Technical content

Features

  • N-channel enhancement mode device
  • DMOS structure
  • Lower capacitances for broadband operation
  • High saturated output power
  • Lower noise figure than competitive devices
  • RoHS Compliant ABSOLUTE MAXIMUM RATINGS AT 25° C Parameter Rating Drain-Source Voltage 65 Gate-Source Voltage 20 Drain-Source Current 12* Power Dissipation 250 Junction Temperature 200 Storage Temperature -55 to +150 Thermal Resistance 0.7 Symbol VDS VGS IDS PD TJ TSTG θJC Units V V A W °C/W ELECTRICAL CHARACTERISTICS AT 25°C Parameter Symbol Min Max Units Test Conditions Drain-Source Breakdown Voltage BVDSS 65 - V VGS = 0.0 V , IDS = 15.0 mA Drain-Source Leakage Current IDSS - 3.0 mA VGS = 28.0 V , VGS = 0.0 V Gate-Source Leakage Current IGSS - 3.0 µA VGS = 20.0 V , VDS = 0.0 V Gate Threshold Voltage VGS(TH) 2.0 6.0 V VDS = 10.0 V , IDS = 300.0 mA Forward Transconductance GM 1.5 - S VDS = 10.0 V , IDS 3000.0 mA , Δ VGS = 1.0V, 80 μs Pulse Input Capacitance CISS - 135 pF VDS = 28.0 V , F = 1.0 MHz Output Capacitance COSS - 90 pF VDS = 28.0 V , F = 1.0 MHz Reverse Capacitance CRSS - 24 pF VDS = 28.0 V , F = 1.0 MHz Power Gain GP 10 - dB VDD = 28.0 V, IDQ = 600.0 mA, POUT = 100.0 W F =500 MHz Drain Efficiency ŋD 50 - % VDD = 28.0 V, IDQ = 600.0 mA, POUT = 100.0 W F =500 MHz Load Mismatch Tolerance VSWR-T - 30:1 - VDD = 28.0 V, IDQ = 600.0 mA, POUT = 100.0 W F =500 MHz Return Loss RL 10 - dB VDD = 28.0 V, IDQ = 600.0 mA, POUT = 100.0 W F =500 MHz F (MHz) ZIN (Ω) ZLOAD (Ω) 300 2.25-j1.75 7.5j1.0 VDD=28V, IDQ=600 Ma, POUT =100.0 W TYPICAL DEVICE IMPEDANCES ZIN is the series equivalent input impedance of the device from gate to gate. ZLOAD is the optimum series equivalent load impedance as measured from drain *Per side PACKAGE OUTLINE

RF Power MOSFET Transistor 100W, 100-500 MHz, 28V M/A-COM Products Released - Ver 08.07 UF28100H

  • North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Typical Broadband Performance Curves SUPPLY VOLTAGE (V) POWER OUTPUT VS SUPPLY VOLTAGE PIN=10 W IDQ=600 mA F=500 MHz POPWER OUTPUT (W) 120 100 16 28 14 24 32 POWER OUTPUT VS POWER INPUT VDD =28 V IDQ =600 mA (Push pull device) POWER OUTPUT (W) POWER INPUT (W) 300MHz 200MHz 120 100 1 10 8 4 0 12 500MHz EFFICIENCY VS FREQUENCY PIN=10W IDD =600 mA (Push pull device) EFFICIENCY (%) 200 400 FREQUENCY (MHz) 300 100 500 400MHz

RF Power MOSFET Transistor 100W, 100-500 MHz, 28V M/A-COM Products Released - Ver 08.07 UF28100H

  • North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. TEST FIXTURE ASSEMBLY TEST FIXTURE SCHEMATIC