UDZ20B

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 8

Technical content

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 UDZ2.4B THRU UDZ36B Document ID Issued Date Revised Date Revision Page. DS-221736 2009/08/10 2014/02/26 C 8

Silicon epitaxial planar chip structure. Wide zener reverse voltage range 2.4V to 36V. Very small package size for high density applications. Ideally suited for automated assembly processes. Lead-free parts meet environmental standards of MIL-STD-19500 /228

Features

Suffix "-H" indicates Halogen-free part, ex.UDZ2.4B-H. Package outline Page 2 200mW Surface Mount Zener Diodes - 2.4V-36V PARAMETER Symbol PD MIN. TYP. MAX. 200 UNIT mW Storage temperature range Operating temperature range TSTG TJ -55 -55 +150 +150 o C o C Maximum ratings (at T =25 C unless otherwise noted)A o Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Zener Diode Dimensions in inches and (millimeters) SOD-323F 0.039(1.00) 0.031(0.80) 0.071(1.80) 0.063(1.60) 0.106(2.70) 0.091(2.30) Mechanical data Epoxy:UL94-V0 rated flame retardant Case : Molded plastic, Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting Position : Any Weight : SOD-323F Approximated 0.005 gram Document ID Issued Date Revised Date Revision Page. Junction temperature +150 TOPR o C Power Dissipation at T =25 CA ° VF 0.9 VForward voltage at IF=10mA RθJA Thermal Resistance from Junction to Ambient Junction to Case 635 o C/W UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8 RθJC 475 o C/W

IZT Z@ IZT ZT Max.(V) V@ IZZ T mA IZK IR Volts VRZ@ IZK ZK 100 100 110 100 100 100 100 120 150 200 250 300 0.5 0.5 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 2.0 100 2.0 100 1.0 10.0 1.0 5.0 0.5 5.0 0.5 0.5 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 1.0 1.0 1.5 1.0 2.5 1.0 3.0 3.5 4.0 5.0 1.0 1.0 6.0 7.0 8.0 9.0 10.0 11.0 13.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 800 1000 500 1000 200 1000 100 1000 1000 100 100 120 150 200 250 300 Part No. UDZ4.7B UDZ2.4B UDZ5.1B UDZ2.7B UDZ5.6B UDZ3.6B UDZ6.2B UDZ3.9B UDZ6.8B UDZ4.3B UDZ7.5B UDZ8.2B UDZ9.1B UDZ10B UDZ11B UDZ12B UDZ13B UDZ15B UDZ18B UDZ20B UDZ22B UDZ24B UDZ27B UDZ30B UDZ33B UDZ36B Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Min.(V) 4.55 2.43 4.98 2.69 5.49 3.60 6.06 3.89 6.65 4.17 7.28 8.02 8.85 9.77 10.76 11.74 12.91 14.34 17.56 19.52 21.54 23.72 26.19 29.19 32.15 35.07 4.75 2.63 5.20 2.91 5.73 3.845 6.33 4.16 6.93 4.43 7.60 8.36 9.23 10.21 11.22 12.24 13.49 14.98 18.35 20.39 22.47 24.78 27.53 30.69 33.79 36.87 SMD Zener Diode Electrical characteristics (at T =25 C unless otherwise noted)A o Document ID Issued Date Revised Date Revision Page. 120 120 0.5 0.5 50.0 20.0 1.0 1.0 1000 1000 UDZ3.0B UDZ3.3B 3.01 3.32 3.22 3.53 Note 1. The Zener voltage(Vz) is measured 40ms after power is supplied. 2. The operating resistances(Zzt, Zzk) are measured by superimposing a minute alternaring current on the regulated current(I ,I ). ZT ZK Max .()Ω Max .()ΩM a x .(uA) UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. ZENER CURRENT, I (A) Z ZENER VOLTAGE , V (V)Z FIG.1-ZENER VOLTAGE CHARACTERISTICS Rating and characteristic curves ( )UDZ2.4B THRU UDZ36B 10n 5 1 0 1 52 02 5 3 5 30 40 100n 10u 100u 10m 100m 4.7 POWER DISSIPATION, Pd(mW) AMBIENT TEMPERATURE, T ( C)A o FIG. 2-DRATING CURVE 25 50 100 100 200 150 300 TEMP. COEFFICIENT CHARACTERISTICS, (%/ C) O FIG. 3-ZENER VOLTAGE-TEMP COEFFICIENT CHARACTERISTICS CAPACTANCE BETWEEN TERMINALS,C (pF) T REVERSE VOLTAGE, V (V)R FIG. 4-V -C CHARACTERISTICSRT 100 10 20 30 f = 1MHz −.00 8 −.00 6 −.00 4 −.00 2 00 0. 00 2. 00 4. 00 6. 00 8. 01 0. Iz 5mA= Iz 500µA= 21 0 2 0 3 0 ZENER VOLTAGE Vz V:( ) 75 125 DS-221736 2009/08/10 2014/02/26 C 8

Pin Simplified outline Symbol Page 5 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Zener Diode Suggested solder pad layout Dimensions in inches and (millimeters) A C B Document ID Issued Date Revised Date Revision Page. B 0.025 (0.63) A 0.033 (0.83) C 0.063 (1.60) PACKAGE SOD-323F UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8

E B d F W PA D D1D2 C T Page 6 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Zener Diode unit:mm Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Item Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 1.46 2.95 1.25 Document ID Issued Date Revised Date Revision Page. UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Zener Diode Reel packing SOD-323F 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) Document ID Issued Date Revised Date Revision Page. Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <6 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 10~30sec 3.Reflow soldering 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SMD Zener Diode Document ID Issued Date Revised Date Revision Page. High reliability test capabilities 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Pressure Cooker 5. Temperature Cycling 6. Humidity 7. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. V =80% rate at T =150 for 168 hrs. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C C CC C C O O O O OO O O RJ SIG A A MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference UDZ2.4B THRU UDZ36B DS-221736 2009/08/10 2014/02/26 C 8