UDN2559EB

2559 ALLEGRO | Alldatasheet

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Always order by complete part number: a prefix to indicate operating temperature range + the basic four-digit part number + a suffix to indicate package style, e.g., UDK2559LB . UDx2559LB UDx2559B PROTECTED QUAD POWER DRIVER Providing improved output current limiting, the UDK, UDN, and UDQ2559B, EB, and LB quad power drivers combine AND logic gates and high-current bipolar outputs with complete output protection. Each of the four outputs will sink 700 mA in the on state. The outputs have a minimum breakdown voltage (load dump) of 60 V and a sustaining voltage of 40 V. The inputs are compatible with TTL and 5 V CMOS logic systems. Over-current protection for each channel has been designed into these devices and is activated at approximately 1 A. It protects each output from short circuits with supply voltages up to 25 V. When an output current trip point is reached, that output stage is driven linearly resulting in a reduced output current level. If an over-current or short- circuit condition continues, the thermal-limiting circuits will first sense the rise in junction temperature and then the rise in chip temperature, further decreasing the output current. Under worst-case conditions, these devices will tolerate short circuits on all outputs, simultaneously. These devices can be used to drive various loads including incan- descent lamps (without warming or limiting resistors) or inductive loads such as relays, solenoids, or dc stepping motors. The suffix ‘B’ devices are 16-pin power DIPs, the suffix ‘EB’ devices are 28-lead power PLCCs and suffix ‘LB’ devices are 16-lead power SOICs for surface-mount applications. All three packages are of batwing construction to provide for maximum package power dissipation.

FEATURES

I 700 mA Output Current per Channel I Independent Over-Current Protection for Each Driver I Thermal Protection for Device and Each Driver I Low Output-Saturation Voltage I Integral Output Flyback Diodes I TTL and 5 V CMOS Compatible Inputs I Pin-Compatible With UDQ2543B/EB and UDK2549B/EB ABSOLUTE MAXIMUM RATINGS at TA = 25°C Over-Current Protected Output Voltage, Package Power Dissipation, Operating Temperature Range, TA Prefix ‘UDK’ . . . . -40°C to +125°C Storage Temperature Range, *Outputs are peak current limited at approximately 1.0 A per driver. See Circuit Description and Application for further information. Data Sheet29317.14A 3 14 8 9 ENABLE GROUND GROUND OUT K GROUND GROUND OUT3 OUT4 K OUT1 V CC IN 1 Dwg. PP-017-1 IN4 IN3 IN 2 1 16 2559

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000 FUNCTIONAL BLOCK DIAGRAM (1 of 4 Channels) UDx2559EB GROUND GROUND GROUND GROUND Dwg. PP-019-1 K NO CONNECTION ENABLESUPPLY NC NC CCV OUT1 OUT2OUT3 OUT 4 IN4 IN3 IN2 IN1 NO CONNECTION K 50 75 100 125 150 ALLOWABLE PACKAGE POWER DISSIPATION IN WATTSTEMPERATURE IN °C R = 6°C/WθJT Dwg. GP-004-2A SUFFIX 'EB', R = 36°C/WθJA SUFFIX 'B', R = 43°C/WθJA SUFFIX 'LB', R = 63°C/WθJA PD = (VOUT1 x IOUT1 x dc) + … + (V OUTn x IOUTn x dc) + (VCC x ICC) = (TJ - TA)/RθJA VCC <<1 Ω OUT Dwg. FP-041 N IN N THERMAL LIMIT ENABLE K Copyright © 1995, 2000 Allegro MicroSystems, Inc.

www.allegromicro.com ELECTRICAL CHARACTERISTICS at TA = +25°C (prefix ‘UDN’) or over operating temperature range (prefix ‘UDK’ or ‘UDQ’), VCC = 4.75 V to 5.25 V Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Output Leakage Current I CEX VOUT = 50 V, VIN = 0.8 V, VEN = 2.0 V — <1.0 100 µA VOUT = 50 V, VIN = 2.0 V, VEN = 0.8 V — <1.0 100 µA Output Sustaining Voltage V OUT(SUS) IOUT = 100 mA, VIN = VEN = 0.8 V 40 —— V Output Saturation Voltage V OUT(SAT) All Devices, IOUT = 100 mA —— 300 mV All Devices, IOUT = 400 mA —— 500 mV ‘B’ & ‘EB’ Packages Only, IOUT = 600 mA —— 700 mV Over-Current Trip I TRIP — 1.0 — A Input Voltage Logic 1 V IN(1) or VEN(1) 2.0 —— V Logic 0 V IN(0) or VEN(0) —— 0.8 V Input Current Logic 1 V IN(1) or VEN(1) = 2.0 V —— 40 µA Logic 0 V IN(0) or VEN(0) = 0.8 V —— -10 µA Total Supply Current I CC All Outputs ON, VIN* = VEN = 2.0 V —— 80 mA All Outputs OFF —— 5.0 mA Clamp Diode Forward Voltage V F IF = 1.0 A —— 1.7 V Clamp Diode Leakage Current I R VR = 50 V, D1 + D2 or D3 + D4 —— 50 µA Turn-On Delay t PHL IOUT = 500 mA —— 20 µs tPLH IOUT = 500 mA —— 20 µs Thermal Limit T J — 165 — °C Typical Data is for design information only. Negative current is defined as coming out of (sourcing) the specified terminal. As used here, -100 is defined as greater than +10 (absolute magnitude convention) and the minimum is implicitly zero. * All inputs simultaneously, all other tests are performed with each input tested separately.

Worcester, Massachusetts 01615-0036 (508) 853-5000 TYPICAL OUTPUT CHARACTERISTIC CIRCUIT DESCRIPTION AND APPLICATION INCANDESCENT LAMP DRIVER High incandescent lamp turn-ON/in-rush currents can contribute to poor lamp reliability and destroy semiconductor lamp drivers. Warm- ing or current-limiting resistors protect both driver and lamp but use significant power either when the lamp is OFF or when the lamp is ON, respectively. Lamps with steady-state current ratings up to 700 mA can be driven by these devices without the need for warming (parallel) or current-limiting (series) resistors. When an incandescent lamp is initially turned ON, the cold fila- ment is at minimum resistance and would normally allow a 10x to 12x in-rush current. With these drivers, during turn-ON, the high in-rush current is sensed by the internal low-value sense resistor. Drive current to the output stage is then diverted by the shunting transistor, and the load current is momentarily limited to approximately 1.0 A. During this short transition period, the output current is reduced to a value dependent on supply voltage and filament resistance. During lamp warmup, the filament resistance increases to its maximum value, the output stage goes into saturation and applies maximum rated voltage to the lamp. INDUCTIVE LOAD DRIVER Bifilar (unipolar) stepper motors, relays, or solenoids can be driven directly. The internal flyback diodes prevent damage to the output transistors by suppressing the high-voltage spikes that occur when turning OFF an inductive load. For rapid current decay (fast turn-OFF speeds), the use of Zener diodes will raise the flyback voltage and inprove performance. However, the peak voltage must not exceed the specified minimum sustaining voltage (V SUPPLY + VZ + VF ≤ VOUT(SUS)). FAULT CONDITIONS In the event of a shorted load, the load current will attempt to increase. As described above, the drive current to the affected output stage is reduced, causing the output stage to go linear, limiting the peak output current to approximately 1 A. As the power dissipation of that output stage increases, a thermal gradient sensing circuit will become operational, further decreasing the drive current to the affected output stage and reducing the output current to a value dependent on supply voltage and load resistance. Continuous or multiple overload conditions causing the chip temperature to reach approximately 165°C will result in an additional reduction in output current to maintain a safe level. If the fault condition is corrected, the output stage will return to its normal saturated condition. TYPICAL OUTPUT BEHAVIOR VOUT(SAT) Dwg. GP-013 OUTPUT VOLTAGE, V OUT OUTPUT CURRENT, I OUT T < 150°C T = 165°CJ J JUNCTION TEMP. LIMIT NOT TO SCALE TRIP I THERMAL GRADIENT SENSING NORMAL LAMP IN-RUSH CURRENT TIME THERMAL GRADIENT SENSING CURRENT LIMIT Dwg. WP-008 NOT TO SCALE ITRIP LAMP CURRENT

www.allegromicro.com UDx2559B Dimensions in Inches (controlling dimensions) Dimensions in Millimeters (for reference only) 0.508 0.204 7.62 BSC Dwg. MA-001-17A mm 10.92 MAX 1 8 7.11 6.10 5.33 MAX 1.77 1.15 0.39 MIN 0.558 0.356 2.54 BSC 0.13 MIN 3.81 2.93 19.68 18.67 NOTE 4 NOTES: 1. Exact body and lead configuration at vendor ’s option within limits shown. 2. Lead spacing tolerance is non-cumulative 3. Lead thickness is measured at seating plane or below. 4. Webbed lead frame. Leads 4, 5, 12, and 13 are internally one piece. 0.020 0.008 0.300 BSC Dwg. MA-001-17A in 0.430 MAX 1 8 0.280 0.240 0.210 MAX 0.070 0.045 0.015 MIN 0.022 0.014 0.100 BSC 0.005 MIN 0.150 0.115 0.775 0.735 NOTE 4

Worcester, Massachusetts 01615-0036 (508) 853-5000 UDx2559EB Dimensions in Inches (controlling dimensions) Dimensions in Millimeters (for reference only) NOTES: 1. Exact body and lead configuration at vendor ’s option within limits shown. 2. Lead spacing tolerance is non-cumulative 3. Webbed lead frame. Leads 5 –11, and 19–25 are internally one piece. 18 12 0.020 MIN 0.050 BSC 128 INDEX AREA Dwg. MA-005-28A in 0.026 0.032 0.013 0.021 19 11 0.165 0.180 0.495 0.485 0.456 0.450 0.495 0.485 0.456 0.450 0.219 0.191 0.219 0.191 0.51 MIN 4.57 4.20 1.27 BSC 12.57 12.32 11.582 11.430 128 INDEX AREA Dwg. MA-005-28A mm 0.812 0.661 0.331 0.533 12.57 12.32 18 12 11.58 11.43 5.56 4.85 5.56 4.85

www.allegromicro.com NOTES: 1. Exact body and lead configuration at vendor ’s option within limits shown. 2. Lead spacing tolerance is non-cumulative 3. Webbed lead frame. Leads 4, 5, 12, and 13 are internally one piece. UDx2559LB Dimensions in Inches (for reference only) Dimensions in Millimeters (controlling dimensions) 0° TO 8° 1 2 3 0.2992 0.2914 0.4133 0.3977 0.419 0.394 0.020 0.013 0.0926 0.1043 0.0040 MIN. 0.0125 0.0091 0.050 0.016 Dwg. MA-008-17A in 0.050 BSC 16 9 0° TO 8° 2 3 7.60 7.40 10.50 10.10 10.65 10.00 0.51 0.33 2.65 2.35 0.10 MIN. 0.32 0.23 1.27 0.40 Dwg. MA-008-17A mm 1.27 BSC

Worcester, Massachusetts 01615-0036 (508) 853-5000 The products described here are manufactured under one or more Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi- bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.