TZ0381B

TZ0381B TAI-SAW | Alldatasheet

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TAI-SAW TECHNOLOGY CO., LTD. FR-71S03-02 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com Product Specifications Approval Sheet Product Description: Crystal Unit SMD 3.2x2.5 26.0MHz TST Part No.: TZ0381B C u s t o m e r P a r t N o . : C h e c k e d b y : A n n L i u Approved by: Robert Chang Date: 7/01/2009 1. Customer signed back is required before TST c an proceed with sample build and receive orders. 2. Orders received without customer signed back will be regarded as agreement on the specifications. 3. Any specifications changes must be approved upon by both parties and a new revision of specifications shall be released to reflect the changes. Customer signature required Company: D i v i s i o n : A p p r o v e d b y : D a t e :

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 3.2x2.5 26.0MHz MODEL NO.: TZ0381B REV. NO.: 2 Revise: Rev. Rev. Page Rev. Account Date Ref. No. Revised by N/A Initial release Changed T/R drawing 08/30/07’ 07/01/09 N/A ECN-200900240 Ann Liu Ann Liu

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 3.2x2.5 26.0MHz MODEL NO.: TZ0381B REV. NO.: 2 Features: z Surface Mount Hermetic Package z Excellent Reliability Performance z Good Frequency Perturbation and Stability over temperature z Ultra Miniature Package Description and Applications: Surface mount 3.2mmx2.5mm cr ystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility. Electrical Specifications: TZ0381B Specification Nominal Frequency 26.000000 MHz Mode of Oscillation Fundamental Storage Temperature Range -40°C to +85°C Operating Temperature Range -20°C to +70°C Frequency Stability over Operating Temperature +/-20 ppm (referred to the value at 25°C) Frequency Make Tolerance (FL) +/-20 ppm @ 25°C +/- 3°C Equivalent Series Resistance (ESR) 60 Ω max Nominal Drive Level 10 uW Shunt Capacitance (Co) 2.0 pF max Load Capacitance (CL) 9 pF Insulation Resistance 500 MΩ min./DC 100V Aging +/-1ppm/year Marking Laser Marking Unit Weight 0.017+/-0.005 g RoHS Compliant Lead free Lead-free soldering

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document Mechanical Dimensions (mm): Recommended Land Pattern: (unit: mm) Marking: Line 1: Frequency (26.00) Line 2: TST Logo + Crystal Product Code + Date Code Product Code Table Date Code Table Pin Connection #1 pin IN/OUT #2 pin GND #3 pin IN/OUT #4 pin GND WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 ABCDEFGH I JKLM WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 NOPQRSTUVWXYZ WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 abcdef gh i j k lm WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 nopqrs t uvwxyz

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document Reel Dimensions (mm): Tape Dimensions (mm): [NOTE] 1 UNIT : mm. 2 UNLESS OTHERWISE SPECIFIED TOLERANCEON DIM. +/-0.1mm. 3 MATERIAL : CONDUC TIVE POLYSTYRENE. 4 COLOR : BLACK. 5 10 PITCHES CUMULATIVETOLERANCE +/-0.2mm.

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document Packing Quantity/Packing: 3K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec

TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document Reliability Specifications Reference standard resistance to Temp./ Duration : 260°C /10sec ×2 times EIAJED-4701 Soldering heat Total time : 4min.(IR-reflow) (IR reflow) -300(301)M(II) Vibration Total peak amplitude : 1.5mm MIL-STD 202F Vibration frequency : 10 to 55 Hz method 201A Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. Mechanical directions : 3 impacts per axis MIL-STD 202F Shock Acceleration : 3000g's, +20/-0 % method 213C Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solderability Solder Temperature:265±5°C MIL-STD 883G Duration time: 5±0.5 seconds. method 2003 Thermal Shock Heat cycle conditions MIL-STD 883G -55 ℃ (30min) ←→ 125 ℃ (30min) method 1010.7 * cycle time : 10 times Humidity test Temperature : 70 ± 2 °C MIL-STD 202F Relative humidity : 90~95% method 103B Duration : 96 hours Dry heat Temperature : 125 ± 2 °C MIL-STD 883G ( Aging test ) Duration : 168 hours method 1008.2 condition C PCT test Pressure: 2.06kg/cm 2 (2.03*105 pa) EIAJED-4701-3 Temperature : 121 ± 2 °C B-123A Relative humidity : 100% Duration : 24 hours Environmental characteristics Mechanical characteristics Test name Test process / method