TXS0102DQMR

TXS0102_11 TI | Alldatasheet

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www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 2-BITBIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS Check forSamples: TXS0102 1FEATURES TYPICAL LEVEL-SHIFTER

APPLICATIONS

2• No Direction-ControlSignalNeeded

• I2C/SMBus• Max Data Rates
• UART– 24 Mbps (Push Pull)
• GPIO– 2 Mbps (Open Drain)
• AvailableintheTexas InstrumentsNanoStar™ DCT OR DCU PACKAGE (TOP VIEW)Package
• 1.65V to3.6V on A portand 2.3V to5.5V on B port(VCCA ≤ VCCB )
• VCC IsolationFeature– IfEitherVCC InputIsat GND, Both PortsAre intheHigh-Impedance State
• No Power-Supply Sequencing Required – EitherVCCA or VCCB Can Be Ramped First DQE OR DQM PACKAGE• IoffSupports Partial-Power-DownMode (TOP VIEW)Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78,Class II
• ESD ProtectionExceeds JESD 22 – A Port YZP PACKAGE– 2500-V Human-Body Model (A114-B) (BOTTOM VIEW) – 250-V Machine Model (A115-A) – 1500-V Charged-DeviceModel (C101) – B Port – 8-kV Human-Body Model (A114-B) – 250-V Machine Model (A115-A) – 1500-V Charged-DeviceModel (C101) DESCRIPTION/ORDERING INFORMATION Thistwo-bitnon-invertingtranslatorisa bidirectionalvoltage-leveltranslatorand can be used toestablishdigital switchingcompatibilitybetween mixed-voltagesystems.Ituses two separateconfigurablepower-supplyrails, withtheA portssupportingoperatingvoltagesfrom 1.65V to3.6V whileittrackstheVCCA supply,and theB portssupportingoperatingvoltagesfrom2.3V to5.5V whileittrackstheVCCB supply.Thisallowsthesupportof bothlowerand higherlogicsignallevelswhileprovidingbidirectionaltranslationcapabilitiesbetween any ofthe 1.8-V,2.5-V,3.3-V,and 5-V voltagenodes. When the output-enable(OE) inputislow,allI/Osare placedinthe high-impedancestate,which significantly reducesthepower-supplyquiescentcurrentconsumption. To ensure the high-impedancestateduringpower up or power down, OE shouldbe tiedto GND througha pulldownresistor;theminimum valueoftheresistorisdeterminedby thecurrent-sourcingcapabilityofthedriver. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2NanoStarisa trademarkofTexas Instruments. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2007–2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

1.8 V System Controller 3.3 V System 3.3 V1.8 V A2 B2 0.1 /C0109F0.1 /C0109F 1 /C0109F TXS0102 SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com ORDERING INFORMATION (1) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) NanoStar™ – WCSP (DSBGA) Reelof3000 TXS0102YZPR 2H_0.23-mm LargeBump – YZP SON – DQE Reelof5000 TXS0102DQER 2H SON – DQM Reelof3000 TXS0102DQMR 2HR–40°C to85°C Reelof3000 TXS0102DCTR NFE_ _ _ SSOP – DCT Tube of250 TXS0102DCTT NFE _ _ _ VSSOP – DCU Reelof3000 TXS0102DCUR NFE_ (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (3) DCT: The actualtop-sidemarkinghas threeadditionalcharactersthatdesignatetheyear,month,and waferfab/assemblysite. DCU: The actualtop-sidemarkinghas one additionalcharacterthatdesignatesthewaferfab/assemblysite. YZP: The actualtop-sidemarkinghas threeprecedingcharacterstodenoteyear,month,and sequence code,and one following charactertodesignatethewaferfab/assemblysite.Pin1 identifierindicatessolder-bumpcomposition(1= SnPb, • = Pb-free). PIN DESCRIPTION NO. NAME TYPE FUNCTIONDCT, DQE, YZPDCU DQM 1 6 A1 B2 I/O Input/outputB.ReferencedtoVCCB . 2 4 B1 GND GND Ground 3 1 C1 VCCA Power A-portsupplyvoltage.1.65V ≤ VCCA ≤ 3.6V and VCCA ≤ VCCB 4 3 D1 A2 I/O Input/outputA.ReferencedtoVCCA . 5 2 D2 A1 I/O Input/outputA.ReferencedtoVCCA . Outputenable(activeHigh).PullOE lowtoplacealloutputsin3-statemode.6 5 C2 OE Input ReferencedtoVCCA . 7 8 B2 VCCB Power B-portsupplyvoltage.2.3V ≤ VCCB ≤ 5.5V 8 7 A2 B1 I/O Input/outputB.ReferencedtoVCCB . TYPICAL OPERATING CIRCUIT

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www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 ABSOLUTE MAXIMUM RATINGS (1) overrecommended operatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCCA Supplyvoltagerange –0.5 4.6 V VCCB Supplyvoltagerange –0.5 6.5 V A port –0.5 4.6 VI Inputvoltagerange(2) V B port –0.5 6.5 A port –0.5 4.6Voltagerangeappliedtoany outputVO Vinthehigh-impedanceorpower-offstate(2) B port –0.5 6.5 A port –0.5 VCCA + 0.5 VO Voltagerangeappliedtoany outputinthehighorlowstate(2)(3) V B port –0.5 VCCB + 0.5 IIK Inputclamp current VI< 0 –50 mA IOK Outputclamp current VO < 0 –50 mA IO Continuousoutputcurrent ±50 mA ContinuouscurrentthroughVCCA ,VCCB ,orGND ±100 mA DCT package 220 DCU package 227 θJA Package thermalimpedance(4) DQE package 261 °C/W DQM package TBD YZP package 102 Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings" may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions" isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) The inputand outputnegative-voltageratingsmay be exceeded iftheinputand outputcurrentratingsareobserved. (3) The valueofVCCA and VCCB areprovidedintherecommended operatingconditionstable. (4) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. RECOMMENDED OPERATING CONDITIONS (1)(2) VCCA VCCB MIN MAX UNIT VCCA Supplyvoltage(3) 1.65 3.6 V VCCB Supplyvoltage 2.3 5.5 V 1.65V to1.95V VCCI – 0.2 VCCI A-portI/Os 2.3V to5.5V 2.3V to3.6V VCCI – 0.4 VCCIHigh-levelVIH Vinputvoltage B-portI/Os VCCI – 0.4 VCCI 1.65V to3.6V 2.3V to5.5V OE input VCCA × 0.65 5.5 A-portI/Os 0 0.15 Low-levelVIL OE input 0 VCCA × 0.35 A-portI/Os,push-pulldriving 10 InputtransitionΔt/Δv B-portI/Os,push-pulldriving 1.65V to3.6V 2.3V to5.5V 10 ns/Vriseorfallrate Controlinput 10 TA Operatingfree-airtemperature –40 85 °C (1) VCCI isthesupplyvoltageassociatedwiththeinputport. (2) VCCO isthesupplyvoltageassociatedwiththeoutputport. (3) VCCA must be lessthanorequaltoVCCB ,and VCCA must notexceed 3.6V. (4) The maximum VILvalueisprovidedtoensurethata validVOL ismaintained.The VOL valueisVILplusthevoltagedropacrossthe pass-gatetransistor. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TXS0102

SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com ELECTRICAL CHARACTERISTICS (1)(2)(3) overrecommended operatingfree-airtemperaturerange(unlessotherwisenoted) TA = 25°C –40°C to85°CTESTPARAMETER VCCA VCCB UNITCONDITIONS MIN TYP MAX MIN MAX II OE 1.65V to3.6V 2.3V to5.5V ±1 ±2 μA A port 0 V 0 to5.5V ±1 ±2 μA Ioff B port 0 to3.6V 0 V ±1 ±2 μA IOZ A orB port 1.65V to3.6V 2.3V to5.5V ±1 ±2 μA 1.65V toVCCB 2.3V to5.5V 2.4 VI= VO = open,ICCA 3.6V 0 V 2.2 μAIO = 0 0 V 5.5V –1 1.65V toVCCB 2.3V to5.5V 12 VI= VO = open,ICCB 3.6V 0 V –1 μAIO = 0 0 V 5.5V 1 VI= VCCI orGND,ICCA + ICCB 1.65V toVCCB 2.3V to5.5V 14.4 μAIO = 0 C I OE 3.3V 3.3V 2.5 3.5 pF A orB port 3.3V 3.3V 10 C io A port 5 6 pF B port 6 7.5 (1) VCCI istheVCC associatedwiththeinputport. (2) VCCO istheVCC associatedwiththeoutputport. (3) VCCA must be lessthanorequaltoVCCB ,and VCCA must notexceed 3.6V.

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www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 TIMING REQUIREMENTS overrecommended operatingfree-airtemperaturerange,VCCA = 1.8V ± 0.15V (unlessotherwisenoted) VCCB = 2.5V VCC = 3.3V VCC = 5 V ± 0.2V ± 0.3V ± 0.5V UNIT MIN MAX MIN MAX MIN MAX Push-pulldriving 21 22 24 Data rate Mbps Open-draindriving 2 2 2 Push-pulldriving 47 45 41Pulsetw Data inputs nsduration Open-draindriving 500 500 500 TIMING REQUIREMENTS overrecommended operatingfree-airtemperaturerange,VCCA = 2.5V ± 0.2V (unlessotherwisenoted) VCCB = 2.5V VCC = 3.3V VCC = 5 V ± 0.2V ± 0.3V ± 0.5V UNIT MIN MAX MIN MAX MIN MAX Push-pulldriving 20 22 24 Data rate Mbps Open-draindriving 2 2 2 Push-pulldriving 50 45 41Pulsetw Data inputs nsduration Open-draindriving 500 500 500 TIMING REQUIREMENTS overrecommended operatingfree-airtemperaturerange,VCCA = 3.3V ± 0.3V (unlessotherwisenoted) VCC = 3.3V VCC = 5 V ± 0.3V ± 0.5V UNIT MIN MAX MIN MAX Push-pulldriving 23 24 Data rate Mbps Open-draindriving 2 2 Push-pulldriving 43 41 tw Pulseduration Data inputs ns Open-draindriving 500 500 Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TXS0102

SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com SWITCHING CHARACTERISTICS overrecommended operatingfree-airtemperaturerange,VCCA = 1.8V ± 0.15V (unlessotherwisenoted) VCCB = 2.5V VCCB = 3.3V VCCB = 5 V FROM TO ± 0.2V ± 0.3V ± 0.5VPARAMETER TEST CONDITIONS UNIT(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX Push-pulldriving 5.3 5.4 6.8 tPHL A B ns Push-pulldriving 6.8 7.1 7.5 tPLH Open-draindriving 45 260 36 208 27 198 Push-pulldriving 4.4 4.5 4.7 tPHL B A ns Push-pulldriving 5.3 4.5 0.5 tPLH Open-draindriving 45 175 36 140 27 102 ten OE A orB 200 200 200 ns tdis OE A orB 50 40 35 ns trA A-portrisetime ns Open-draindriving 38 165 30 132 22 95 trB B-portrisetime ns Open-draindriving 34 145 23 106 10 58 Push-pulldriving 2 5.9 1.9 6 1.7 13.3 tfA A-portfalltime ns tfB B-portfalltime tSK(O) Channel-to-channelskew 0.7 0.7 0.7 ns Push-pulldriving 21 22 24 Max datarate Mbps Open-draindriving 2 2 2

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www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 SWITCHING CHARACTERISTICS overrecommended operatingfree-airtemperaturerange,VCCA = 2.5V ± 0.2V (unlessotherwisenoted) VCCB = 2.5V VCCB = 3.3V VCCB = 5 V FROM TO ± 0.2V ± 0.3V ± 0.5VPARAMETER TEST CONDITIONS UNIT(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX Push-pulldriving 3.2 3.7 3.8 tPHL Open-draindriving 1.7 6.3 2 6 2.1 5.8 A B ns Push-pulldriving 3.5 4.1 4.4 tPLH Open-draindriving 43 250 36 206 27 190 Push-pulldriving 3 3.6 4.3 tPHL B A ns Push-pulldriving 2.5 1.6 1 tPLH Open-draindriving 44 170 37 140 27 103 ten OE A orB 200 200 200 ns tdis OE A orB 50 40 35 ns trA A-portrisetime ns Open-draindriving 34 149 28 121 24 89 trB B-portrisetime ns Open-draindriving 35 151 24 112 12 64 tfA A-portfalltime ns tfB B-portfalltime ns tSK(O) Channel-to-channelskew 0.7 0.7 0.7 ns Push-pulldriving 20 22 24 Max datarate Mbps Open-draindriving 2 2 2 Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TXS0102

SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com SWITCHING CHARACTERISTICS overrecommended operatingfree-airtemperaturerange,VCCA = 3.3V ± 0.3V (unlessotherwisenoted) VCCB = 3.3V VCCB = 5 V FROM TO ± 0.3V ± 0.5VPARAMETER TEST CONDITIONS UNIT(INPUT) (OUTPUT) MIN MAX MIN MAX Push-pulldriving 2.4 3.1 tPHL Open-draindriving 1.3 4.2 1.4 4.6 A B ns Push-pulldriving 4.2 4.4 tPLH Open-draindriving 36 204 28 165 Push-pulldriving 2.5 3.3 tPHL Open-draindriving 1 124 1 97 B A ns Push-pulldriving 2.5 2.6 tPLH Open-draindriving 3 139 3 105 ten OE A orB 200 200 ns tdis OE A orB 40 35 ns Push-pulldriving 2.3 5.6 1.9 4.8 trA A-portrisetime ns Open-draindriving 25 116 19 85 Push-pulldriving 2.5 6.4 2.1 7.4 trB B-portrisetime ns Open-draindriving 26 116 14 72 Push-pulldriving 2 5.4 1.9 5 tfA A-portfalltime ns Open-draindriving 4.3 6.1 4.2 5.7 Push-pulldriving 2.3 7.4 2.4 7.6 tfB B-portfalltime ns Open-draindriving 5 7.6 4.8 8.3 tSK(O) Channel-to-channelskew 0.7 0.7 ns Push-pulldriving 23 24 Max datarate Mbps Open-draindriving 2 2

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B Gate Bias One shot T2T1 VCCA VCCB A Gate Bias One- shot 10k 10k One shot One- shot TXS0102 www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 PRINCIPLES OF OPERATION The TXS0102 can be used to bridgethe digital-switchingcompatibilitygap between two voltagenodes to successfullyinterfacelogicthresholdlevelsfound inelectronicsystems.Itshouldbe used ina point-to-point topologyforinterfacingdevicesorsystemsoperatingatdifferentinterfacevoltageswithone another.Itsprimary targetapplicationuse isforinterfacingwithopen-draindriverson thedataI/Ossuch as I2C or1-wire,where the dataisbidirectionaland no controlsignalisavailable.The TXS0102 can alsobe used inapplicationswhere a push-pulldriverisconnectedto the data I/Os,but the TXB0102 mightbe a betteroptionforsuch push-pull applications. Architecture The TXS0102 architecture(seeFigure1) isan auto-direction-sensingbased translatorthatdoes notrequirea direction-controlsignaltocontrolthedirectionofdataflowfromA toB orfromB toA. Figure1. Architectureofa TXS01xx Cell These two bidirectionalchannelsindependentlydeterminethe directionof data flowwithouta direction-control signal.Each I/O pin can be automaticallyreconfiguredas eitheran inputor an output,which is how this auto-directionfeatureisrealized. The TXS0102 ispartofTI's"Switch"typevoltagetranslatorfamilyand employs two key circuitstoenablethis voltagetranslation: 1)An N-channelpass-gatetransistortopologythattiestheA-porttotheB-port and 2)Outputone-shot(O.S.)edge-rateacceleratorcircuitrytodetectand acceleraterisingedges on theA orB ports Forbidirectionalvoltagetranslation,pull-upresistorsareincludedon thedevicefordc currentsourcingcapability. The VGATE gatebiasoftheN-channelpass transistorissetatapproximatelyone thresholdvoltage(VT) above theVCC levelofthelow-voltageside.Data can flowineitherdirectionwithoutguidancefroma controlsignal. The O.S. rising-edgerateacceleratorcircuitryspeeds up theoutputslew rateby monitoringtheinputedge for transitions,helpingmaintainthedataratethroughthedevice.Duringa low-to-highsignalrisingedge,theO.S. circuitsturnon the PMOS transistors(T1, T2) to increasethe currentdrivecapabilityof the driverfor approximately30 ns or95% oftheinputedge,whicheveroccursfirst.Thisedge-rateaccelerationprovideshigh ac driveby bypassingtheinternal10-kΩ pull-upresistorsduringthelow-to-hightransitiontospeed up thesignal. The outputresistanceofthedriverisdecreasedtoapproximately50 Ω to70 Ω duringthisaccelerationphase.To minimizedynamic ICC and thepossibilityofsignalcontention,theusershouldwaitfortheO.S.circuittoturn-off beforeapplyinga signalintheoppositedirection.The worst-casedurationisequaltotheminimum pulse-width number providedintheTimingRequirementssectionofthisdatasheet. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TXS0102

SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com InputDriverRequirements The continuousdc-current"sinking"capabilityis determinedby the externalsystem-levelopen-drain(or push-pull)driversthatareinterfacedtotheTXS0102 I/Opins.SincethehighbandwidthofthesebidirectionalI/O circuitsisused tofacilitatethisfastchange from an inputtoan outputand an outputtoan input,theyhave a modest dc-current"sourcing"capabilityofhundredsofmicro-Amps,as determinedby theinternal10-kΩ pullup resistors. The falltime(tfA,tfB) ofa signaldepends on theedge-rateand outputimpedance oftheexternaldevicedriving TXS0102 dataI/Os,as wellas thecapacitiveloadingon thedatalines. Similarly,thetPHL and max dataratesalsodepend on theoutputimpedance oftheexternaldriver.The valuesfor tfA,tfB,tPHL ,and maximum dataratesinthedatasheetassume thattheoutputimpedance oftheexternaldriveris lessthan50 Ω. Output Load Considerations TIrecommends carefulPCB layoutpracticeswithshortPCB tracelengthstoavoidexcessivecapacitiveloading and to ensure thatproperO.S. triggeringtakesplace.PCB signaltrace-lengthsshouldbe keptshortenough such thattheround tripdelayofany reflectionislessthantheone-shotduration.Thisimprovessignalintegrity by ensuringthatany reflectionsees a low impedance atthedriver.The O.S.circuitshave been designedtostay on forapproximately30 ns.The maximum capacitanceof the lumped loadthatcan be drivenalsodepends directlyon theone-shotduration.Withveryheavy capacitiveloads,theone-shotcan time-outbeforethesignalis drivenfullytothepositiverail.The O.S.durationhas been settobestoptimizetrade-offsbetween dynamic ICC , loaddrivingcapability,and maximum bit-rateconsiderations.Both PCB tracelengthand connectorsadd tothe capacitancethatthe TXS0102 outputsees, so itis recommended thatthislumped-loadcapacitancebe consideredto avoidO.S. retriggering,bus contention,outputsignaloscillations,or otheradversesystem-level affects. Power Up Duringoperation,ensurethatVCCA ≤ VCCB atalltimes.The sequencingofeach power supplywillnotdamage thedeviceduringthepower up operation,so eitherpower supplycan be ramped up first. Enable and Disable The TXS0102 has an OE inputthatisused todisablethedeviceby settingOE low,whichplacesallI/Osinthe Hi-Zstate.The disabletime(tdis)indicatesthedelaybetween thetimewhen OE goes low and when theoutputs are disabled(Hi-Z).The enabletime(ten) indicatesthe amount of timethe user must allowforthe one-shot circuitrytobecome operationalafterOE istakenhigh. Pullupor Pulldown Resistorson I/OLines Each A-portI/Ohas an internal10-kΩ pullupresistortoVCCA ,and each B-portI/Ohas an internal10-kΩ pullup resistortoVCCB .Ifa smallervalueofpullupresistorisrequired,an externalresistormust be added fromtheI/O toVCCA orVCCB (inparallelwiththeinternal10-kΩ resistors).Addinglowervaluepull-upresistorswilleffectVOL levels,however.The internalpull-upsoftheTXS0102 aredisabledwhen theOE pinislow.

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/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT 2 × VCCO Open 50 k/C0087 tPLH tPHL Output Control (low-level enabling) Output W aveform 1 S1 at 2 × VCCO (see Note B) Output W aveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ VCCA /2VCCA /2 VCCI 0 V VCCO /2 VOH VOL 0 V 0.1 /C0121 VCCO VCCO /2 0.9 /C0121 VCCO VCCO /2 0 V VCCI 0 V VCCI/2 V CCI/2 tw Input VCCA VCCO VOLT AGE W AVEFORMS PROPAGA TION DELA Y TIMES VOLT AGE W AVEFORMS PULSE DURA TION VOLT AGE W AVEFORMS ENABLE AND DISABLE TIMES Output Input tPZL /tPLZ tPHZ /tPZH 2 × VCCO Open TEST S1 A. C L includes probe and jig capacitance. B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR/C011810 MHz, ZO = 50 W , dv/dt ≥/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. V CCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. 50 k/C0087

1 M/C008715 pF

DAT A RA TE, PULSE DURA TION, PROPAGA TION DELA Y, OUTPUT RISE AND F ALL TIME MEASUREMENT USING A PUSH-PULL DRIVER VCCOVCCI DUT IN OUT DAT A RA TE, PULSE DURA TION, PROPAGA TION DELA Y, OUTPUT RISE AND F ALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER VCCOVCCI DUT IN OUT VCCI/2 V CCI/2 0.9 /C0121 VCCO VCCO /2 tr 0.1 /C0121 VCCO tf TXS0102 www.ti.com SCES640D –JANUARY 2007–REVISED MARCH 2011 PARAMETER MEASUREMENT INFORMATION Figure2. Load Circuitand VoltageWaveforms Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TXS0102

SCES640D –JANUARY 2007–REVISED MARCH 2011 www.ti.com

REVISION HISTORY

Changes from RevisionC (May 2009)toRevisionD Page

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www.ti.com 21-Apr-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TXS0102DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCTT ACTIVE SM8 DCT 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCTTE4 ACTIVE SM8 DCT 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCTTG4 ACTIVE SM8 DCT 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102DQER ACTIVE X2SON DQE 8 5000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM TXS0102DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0102YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.

www.ti.com 21-Apr-2011 Addendum-Page 2 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2011 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS0102DCUR US8 DCU 8 3000 202.0 201.0 28.0 TXS0102DQER X2SON DQE 8 5000 202.0 201.0 28.0 TXS0102DQMR X2SON DQM 8 3000 202.0 201.0 28.0 TXS0102YZPR DSBGA YZP 8 3000 190.5 212.7 31.8 TXS0102YZPR DSBGA YZP 8 3000 220.0 220.0 34.0 TXS0102YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2011 Pack Materials-Page 2

MPDS049B – MAY 1999 – REVISED OCTOBER 2002 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 0,60 0,20 0,25 0° – 8° 0,15 NOM Gage Plane 4188781/C 09/02 4,25 0,30 0,15 2,90 3,752,70 3,15 2,75 0,10 0,00 1,30 MAX Seating Plane 0,10 M0,130,65 PIN 1 INDEX AREA NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion D. Falls within JEDEC MO-187 variation DA.

D: Max = E: Max = 1.918 mm, Min = 0.918 mm, Min = 1.858 mm 0.858 mm

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