TXS0101DCKTG4

TXS0101 TI | Alldatasheet

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FEATURES

DBV, DCK, OR DRL PACKAGE (TOP VIEW) VCCA GND A VCCB OE B YZP PACKAGE (BOTTOM VIEW) GND A B VCCA 5 OE V CCB abc DESCRIPTION/ORDERING INFORMATION TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN

APPLICATIONS

www.ti.com Available in the Texas Instruments NanoFree Package 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port CCA V CCB V CC Isolation Feature If Either V CC Input Is at GND, Both Ports Are in the High-Impedance State I off Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD A Port 2500-V Human-Body Model (A114-B) abc 200-V Machine Model (A115-A) abc 1500-V Charged-Device Model (C101) abc B Port abc 8-kV Human-Body Model (A114-B) 200-V Machine Model (A115-A) 1500-V Charged-Device Model (C101) This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA V CCA accepts any supply voltage from 1.65 V to 3.6 The B port is designed to track V CCB V CCA must be less than or equal to V CCB V CCB accepts any supply voltage from 2.3 V to 5.5 This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) NanoFree WCSP (DSBGA) 0.23-mm Large Bump YZP Reel of 3000 TXS0101YZPR _2G_ (Pb-free) Reel of 3000 TXS0101DBVR SOT (SOT-23) DBV 2G_ Reel of 250 TXS0101DBVT C to C Reel of 3000 TXS0101DCKR SOT (SC-70) DCK NFF_ Reel of 250 TXS0101DCKT Reel of 3000 TXS0101DRLR SOT (SOT-563) DRL 2G_ Reel of 250 TXS0101DRLT (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com (3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin identifier indicates solder-bump composition SnPb, Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com Data GNDGNDGND Data A B VCCA VCCB OE 1.8 V System Controller 3.3 V System 3.3 V1.8 V Absolute Maximum Ratings (1) TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN

DESCRIPTION

NO. NAME FUNCTION V CCA A-port supply voltage. 1.65 V V CCA 3.6 V and V CCA V CCB GND Ground A Input/output Referenced to V CCA B Input/output Referenced to V CCB OE Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to V CCA V CCB B-port supply voltage. 2.3 V V CCB 5.5 V TYPICAL OPERATING CIRCUIT over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CCA Supply voltage range 0.5 4.6 V V CCB Supply voltage range 0.5 6.5 V A port 0.5 4.6 V I Input voltage range (2) V B port, OE 0.5 6.5 A port 0.5 4.6 Voltage range applied to any output V O V in the high-impedance or power-off state (2) B port 0.5 6.5 A port 0.5 V CCA 0.5 V O Voltage range applied to any output in the high or low state (2) (3) V B port 0.5 V CCB 0.5 I IK Input clamp current V I mA I OK Output clamp current V O mA I O Continuous output current mA Continuous current through V CCA V CCB or GND 100 mA DBV package 165 DCK package 259 θ JA Package thermal impedance (4) C/W DRL package 142 YZP package 123 T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) The value of V CCA and V CCB are provided in the recommended operating conditions table. (4) The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright 2007, Texas Instruments Incorporated Product Folder Link(s): TXS0101

www.ti.com Thermal Impedance Ratings Recommended Operating Conditions (1) (2) TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN θ JA Package thermal impedance (1) C/W DRL package 142 YEP/YZP package 123 (1) The package thermal impedance is calculated in accordance with JESD 51-7. V CCA V CCB MIN MAX UNIT V CCA 1.65 3.6 Supply voltage (3) V V CCB 2.3 5.5 1.65 V to 1.95 V V CCI 0.2 V CCI A-port I/Os 2.3 V to 5.5 V 2.3 V to 3.6 V V CCI 0.4 V CCI V IH High-level input voltage V B-port I/Os V CCI 0.4 V CCI 1.65 V to 3.6 V 2.3 V to 5.5 V OE input V CCA 0.65 5.5 A-port I/Os 0.15 V IL Low-level input voltage B-port I/Os 1.65 V to 3.6 V 2.3 V to 5.5 V 0.15 V OE input V CCA 0.35 A-port I/Os, push-pull driving Input transition rise or fall Δ Δ v B-port I/Os, 1.65 V to 3.6 V 2.3 V to 5.5 V ns/V rate push-pull driving Control Input T A Operating free-air temperature C (1) V CCI is the supply associated with the input port. (2) V CCO is the supply associated with the output port. (3) V CCA must be less than or equal to V CCB and V CCA must not exceed 3.6 Copyright 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXS0101

www.ti.com Electrical Characteristics (1) (2) (3) Timing Requirements Timing Requirements TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN (unless otherwise noted) T A C C to C TEST PARAMETER V CCA V CCB UNIT CONDITIONS MIN TYP MAX MIN MAX I OH μ V OHA 1.65 V to 3.6 V 2.3 V to 5.5 V V CCA 0.67 V V IB V CCB 0.4 V I OL mA, V OLA 1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 V V IB 0.15 V I OH μ V OHB 1.65 V to 3.6 V 2.3 V to 5.5 V V CCB 0.67 V V IA V CCA 0.2 V I OL mA, V OLB 1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 V V IA 0.15 V I I OE 1.65 V to 3.6 V 1.65 V to 5.5 V μ A A port V to 5.5 V μ A I off B port to 3.6 V V μ A I OZ A or B port 1.65 V to 3.6 V 2.3 V to 5.5 V μ A 1.65 V to V CCB 2.3 V to 5.5 V 2.4 V I V O open, I CCA 3.6 V V 2.2 μ A I O V 5.5 V 1.65 V to V CCB 2.3 V to 5.5 V V I V O open, I CCB 3.6 V V μ A I O V 5.5 V V I V CCI I CCA I CCB 1.65 V to V CCB 2.3 V to 5.5 V 14.4 μ A I O C I OE 3.3 V 3.3 V 2.5 3.5 pF A-port C io 3.3 V 3.3 V pF B-port 7.5 (1) V CCI is the V CC associated with the input port. (2) V CCO is the V CC associated with the output port. (3) V CCA must be less than or equal to V CCB and V CCA must not exceed 3.6 over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX Push-pull driving Data rate Mbps Open-drain driving Push-pull driving t w Pulse duration Data inputs ns Open-drain driving 500 500 500 over recommended operating free-air temperature range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX Push-pull driving Data rate Mbps Open-drain driving Push-pull driving t w Pulse duration Data inputs ns Open-drain driving 500 500 500 Submit Documentation Feedback Copyright 2007, Texas Instruments Incorporated Product Folder Link(s): TXS0101

www.ti.com Timing Requirements Switching Characteristics TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V 0.3 V 0.5 V UNIT MIN MAX MIN MAX Push-pull driving Data rate Mbps Open-drain driving Push-pull driving t w Pulse duration Data inputs ns Open-drain driving 500 500 over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO TEST 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) CONDITIONS MIN MAX MIN MAX MIN MAX Push-pull driving 5.3 5.4 6.8 t PHL Open-drain driving 2.3 8.8 2.4 9.6 2.6 A B ns Push-pull driving 6.8 7.1 7.5 t PLH Open-drain driving 260 208 198 Push-pull driving 4.4 4.5 4.7 t PHL Open-drain driving 1.9 5.3 1.1 4.4 1.2 B A ns Push-pull driving 5.3 4.5 0.5 t PLH Open-drain driving 175 140 102 t en OE A or B 200 200 200 ns t dis OE A or B ns Push-pull driving 3.2 9.5 2.3 9.3 7.6 t rA A-port rise time ns Open-drain driving 165 132 Push-pull driving 1.1 10.8 9.1 7.6 t rB B-port rise time ns Open-drain driving 145 106 Push-pull driving 1.9 5.9 1.9 1.4 13.3 t fA A-port fall time Open-drain driving 4.4 6.9 4.3 6.4 4.2 6.1 ns Push-pull driving 2.2 13.8 2.2 16.2 2.6 16.2 t fB B-port fall time Open-drain driving 6.9 13.8 7.5 16.2 16.2 Push-pull driving Max data rate Mbps Open-drain driving Copyright 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXS0101

www.ti.com Switching Characteristics TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO TEST 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) CONDITIONS MIN MAX MIN MAX MIN MAX Push-pull driving 3.2 3.7 3.8 t PHL Open-drain driving 1.7 6.3 2.1 5.8 A B ns Push-pull driving 3.5 4.1 4.4 t PLH Open-drain driving 250 206 190 Push-pull driving 3.6 4.3 t PHL Open-drain driving 1.8 4.7 1.6 4.2 1.2 B A ns Push-pull driving 2.5 1.6 t PLH Open-drain driving 170 140 103 t en OE A or B 200 200 200 ns t dis OE A or B ns Push-pull driving 2.8 7.4 2.1 6.6 0.9 5.6 t rA A-port rise time ns Open-drain driving 149 121 Push-pull driving 1.3 8.3 0.9 7.2 0.4 6.1 t rB B-port rise time ns Open-drain driving 151 112 Push-pull driving 1.9 5.7 1.4 5.5 0.8 5.3 t fA A-port fall time ns Open-drain driving 4.4 6.9 4.3 6.2 4.2 5.8 Push-pull driving 2.2 7.8 2.4 6.7 2.6 6.6 t fB B-port fall time ns Open-drain driving 5.1 8.8 5.4 9.4 5.4 10.4 Push-pull driving Max data rate Mbps Open-drain driving Submit Documentation Feedback Copyright 2007, Texas Instruments Incorporated Product Folder Link(s): TXS0101

www.ti.com Switching Characteristics PRINCIPLES OF OPERATION range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V FROM TO TEST 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) CONDITIONS MIN MAX MIN MAX Push-pull driving 2.4 3.1 t PHL Open-drain driving 1.3 4.2 1.4 4.6 A B ns Push-pull driving 4.2 4.4 t PLH Open-drain driving 204 165 Push-pull driving 2.5 3.3 t PHL Open-drain driving 124 B A ns Push-pull driving 2.5 2.6 t PLH Open-drain driving 139 105 t en OE A or B 200 200 ns t dis OE A or B ns Push-pull driving 2.3 5.6 1.9 4.8 t rA A-port rise time ns Open-drain driving 116 Push-pull driving 1.6 6.4 0.6 7.4 t rB B-port rise time ns Open-drain driving 116 Push-pull driving 1.4 5.4 t fA A-port fall time ns Open-drain driving 4.3 6.1 4.2 5.7 Push-pull driving 2.3 7.4 2.4 7.6 t fB B-port fall time ns Open-drain driving 7.6 4.8 8.3 Push-pull driving Max data rate Mbps Open-drain driving The TXS0101 can be used in level-translation another. The TXS0101 is ideal for use in I/Os. The TXB0101 can also be used in a push-pull driver is connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications. The TXS0101 architecture (see Figure does not require a direction-control signal to control the direction of data flow from A to B or from B to Copyright 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXS0101

www.ti.com VCCB B VCCA VCCB Gate□Bias One- shot One- shot 10k 10k T1 T2 A Input Driver Requirements Power Up Enable and Disable Pullup or Pulldown Resistors on I/O Lines TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN a TXS01xx Cell Each A-port I/O has an internal 10-k Ω pullup resistor to V CCA and each B-port I/O has an internal 10-k Ω pullup resistor to V CCB The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition. The fall time fA t fB of a signal depends on the output impedance of the external device driving the data I/Os of the TXS0101. Similarly, the t PHL and max data rates also depend on the output impedance of the external driver. The values for t fA t fB t PHL and maximum data rates in the data sheet assume that the output impedance of the external driver is less than Ω During operation, ensure that V CCA V CCB at all times. During power-up sequencing, V CCA V CCB does not damage the device, so any power supply can be ramped up first. The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the Hi-Z state. The disable time dis indicates the delay between the time when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time en indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Each A-port I/O has an internal 10-k Ω pullup resistor to V CCA and each B-port I/O has an internal 10-k Ω pullup resistor to V CCB If a smaller value of pullup resistor is required, an external resistor must be added from the I/O to V CCA or V CCB (in parallel with the internal 10-k Ω resistors). Submit Documentation Feedback Copyright 2007, Texas Instruments Incorporated Product Folder Link(s): TXS0101

www.ti.com PARAMETER MEASUREMENT INFORMATION VOH VOL From Output /charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT 2 × VCCO Open 50 k/C0087 tPLH tPHL Output Control (low-level enabling) Output W aveform 1 S1 at 2 × VCCO (see Note B) Output W aveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ VCCA /2VCCA /2 VCCI 0 V VCCO /2 VOH VOL 0 V 0.1 /C0121 VCCO VCCO /2 0.9 /C0121 VCCO VCCO /2 0 V VCCI 0 V VCCI/2 V CCI/2 tw Input VCCA VCCO VOLT AGE W AVEFORMS PROPAGA TION DELA Y TIMES VOLT AGE W AVEFORMS PULSE DURA TION VOLT AGE W AVEFORMS ENABLE AND DISABLE TIMES Output Input tPZL /tPLZ tPHZ /tPZH 2 × VCCO Open TEST S1 A. C L includes probe and jig capacitance. B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR/C011810 MHz, ZO = 50 W , dv/dt ≥/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. V CCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. 50 k/C0087

1 M/C008715 pF

DAT A RA TE, PULSE DURA TION, PROPAGA TION DELA Y, OUTPUT RISE AND F ALL TIME MEASUREMENT USING A PUSH-PULL DRIVER VCCOVCCI LVC4T65 IN OUT DAT A RA TE, PULSE DURA TION, PROPAGA TION DELA Y, OUTPUT RISE AND F ALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER VCCOVCCI LVC4T65 IN OUT VCCO /2 V CCO /2 0.9 /C0121 VCCO VCCO /2 tr 0.1 /C0121 VCCO tf TXS0101 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXS0101

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TXS0101DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0101YZPR ACTIVE WCSP YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2008 Addendum-Page 1

to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2008 Addendum-Page 2

TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TXS0101DBVR DBV 6 SITE 35 180 9 3.23 3.17 1.37 4 8 Q3 TXS0101DBVT DBV 6 SITE 35 180 9 3.23 3.17 1.37 4 8 Q3 TXS0101DCKR DCK 6 SITE 48 179 8 2.2 2.5 1.2 4 8 Q3 TXS0101DCKT DCK 6 SITE 48 179 8 2.2 2.5 1.2 4 8 Q3 TXS0101DRLR DRL 6 SITE 35 180 9 1.78 1.78 0.69 4 8 Q3 TXS0101YZPR YZP 6 SITE 12 180 8 1.02 1.52 0.66 4 8 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 Pack Materials-Page 1

Device Package Pins Site Length (mm) Width (mm) Height (mm) TXS0101DBVR DBV 6 SITE 35 202.0 201.0 28.0 TXS0101DBVT DBV 6 SITE 35 202.0 201.0 28.0 TXS0101DCKR DCK 6 SITE 48 220.0 205.0 50.0 TXS0101DCKT DCK 6 SITE 48 220.0 205.0 50.0 TXS0101DRLR DRL 6 SITE 35 202.0 201.0 28.0 TXS0101YZPR YZP 6 SITE 12 220.0 220.0 0.0 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 Pack Materials-Page 2

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