TXM-FFF-KH3

TXM-FFF-KH3 LINX | Alldatasheet

Document overview

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• PDF pages: 19

Technical content

1 Description

1 Features

1 Applications

2 Ordering Information

2 Absolute Maximum Ratings

3 Electrical Specifications

4 Typical Performance Graphs

8 Pin Assignments

8 Pin Descriptions

9 Module Description

10 Theory of Operation

10 Compatibility with the KH2 Series

11 Encoder Operation

12 Setting the Transmitter Address

12 Data Inputs

12 Enabling Transmission

12 Input Type Selection

14 Using LADJ

14 Power Supply Requirements

15 Typical Applications

16 Antenna Considerations

17 Helpful Application Notes from Linx

18 Interference Considerations

19 Pad Layout

19 Board Layout Guidelines

21 Microstrip Details

22 Production Guidelines

22 Hand Assembly

22 Automated Assembly

Warning: Some customers may want Linx radio frequency (“RF”) products to control machinery or devices remotely, including machinery or devices that can cause death, bodily injuries, and/or property damage if improperly or inadvertently triggered, particularly in industrial settings or other applications implicating life-safety concerns (“Life and Property Safety Situations”). NO OEM LINX REMOTE CONTROL OR FUNCTION MODULE SHOULD EVER BE USED IN LIFE AND PROPERTY SAFETY SITUATIONS. No OEM Linx Remote Control or Function Module should be modified for Life and Property Safety Situations. Such modification cannot provide sufficient safety and will void the product’s regulatory certification and warranty. Customers may use our (non-Function) Modules, Antenna and Connectors as part of other systems in Life Safety Situations, but only with necessary and industry appropriate redundancies and in compliance with applicable safety standards, including without limitation, ANSI and NFPA standards. It is solely the responsibility of any Linx customer who uses one or more of these products to incorporate appropriate redundancies and safety standards for the Life and Property Safety Situation application. Do not use this or any Linx product to trigger an action directly from the data line or RSSI lines without a protocol or encoder/ decoder to validate the data. Without validation, any signal from another unrelated transmitter in the environment received by the module could inadvertently trigger the action. All RF products are susceptible to RF interference that can prevent communication. RF products without frequency agility or hopping implemented are more subject to interference. This module does not have a frequency hopping protocol built in. Do not use any Linx product over the limits in this data guide. Excessive voltage or extended operation at the maximum voltage could cause product failure. Exceeding the reflow temperature profile could cause product failure which is not immediately evident. Do not make any physical or electrical modifications to any Linx product. This will void the warranty and regulatory and UL certifications and may cause product failure which is not immediately evident.

– –1 KH3 Series Transmitter Module Data Guide Revised 3/18/2015

Description

The KH3 Series is ideally suited for volume use in OEM applications such as remote control and command, and keyless entry. Housed in a compact SMD package, it combines a highly optimized RF transmitter with an on-board encoder. When paired with a matching KH3 Series receiver / decoder module, a reliable wireless link is formed, capable of transferring the status of 8 parallel inputs over distances of up to 3,000 feet. Ten address lines provide transmitter uniqueness. No external RF components are required except an antenna, making integration straightforward.

Features

• Low cost
• On-board encoder
• 8 parallel binary inputs
• 10 addresses for security and uniqueness
• No external RF components required
• Ultra-low power consumption
• Compact SMD package
• Stable SAW-based architecture
• Adjustable output power
• Transmit enable line
• No production tuning

Applications

• Remote control / command
• Gate openers
• Lighting control
• Call systems
• Remote status monitoring
• Home / industrial automation
• Remote status / position sensing
• Wire elimination 0.106 in (2.69 mm) 0.63 in (16.00 mm) 1.21 in (30.73 mm) Figure 1: Package Dimensions

24 General Antenna Rules

26 Common Antenna Styles

28 Regulatory Considerations

30 Notes

– – – –8 9 Pin Assignments Pin Descriptions LADJ/GND D1 A9 GND VCC TE ANT GND 81 7 D6 A1 A0D7 12 13 25 26 27 D_CFG A_CFG0 A_CFG1 Figure 13: KH3 Series Transmitter Pin Assignments (Top View) Figure 14: KH3 Series Transmitter Pin Descriptions Pin Descriptions Pin Number Name I/O Description

1 GND /

LADJ — Level Adjust. This line adjusts the output power level of the transmitter. Connecting to GND gives the highest output, while placing a resistor to GND lowers the output level. 2, 3, 7, 8, 9, 10, 11,12 D0 to D1 I Data Input Lines. When TE goes high, the module encodes the state of these lines for transmission. Upon receipt of a valid transmission, the receiver / decoder replicates these lines on its output lines. These lines are pulled to GND internally. 4, 23 GND — Analog Ground

5 VCC — Supply Voltage

6 TE I/O

Transmit Enable Line. When this line goes high, the module encodes the states of the address and data lines into a packet and transmits the packet three times. 13, 14, 15, 16, 17, 18, 19, 20, 21, 22 A0 to A9 I Address Lines. The state of these lines must match the state of the receiver’s address lines in order for a transmission to be accepted. These lines are pulled to VCC internally.

24 ANT — 50-ohm RF Output

25 D_CFG I/O

Data Line Configuration. Determines whether a low on a data line is interpreted as a zero bit or an open bit. See the Input Type Selection section. This line is pulled to GND internally. 26, 27 A_CFG0 / A_CFG1 Address Configuration. These lines determine the address bit type interpretation. See the Input Type Selection section. A_CFG0 is pulled to GND and A_CFG1 is pulled to VCC internally. Module Description The KH3 Series transmitter / encoder module combines a high-performance Surface Acoustic Wave (SAW) based transmitter with an on-board remote control encoder. When combined with a Linx KH3 Series receiver / decoder, a highly reliable RF link capable of transferring control or command data over line-of-sight distances of up to 3,000 feet is formed. The module accepts up to 8 parallel inputs, such as switches or contact closures, and provides ten address lines for creating unique transmitter / receiver relationships. The KH3’s compact surface-mount package integrates easily into existing designs and is friendly to hand production or automated assembly. Output Isolation & Filter RF Amplifier TX Enable Keyed Output SAW Oscillator 50/uni03A9 RF OUT (ANT) Parallel Inputs D0-D7 Address Inputs A0-A9 RF STAGE ENCODER STAGE Data Out D_CFG D_CFG0 D_CFG1 Figure 15: KH3 Series Transmitter Block Diagram

– – – –10 11 Encoder Operation The KH3 Series transmitter internally utilizes the DS Series encoder. The encoder begins a three-word transmission cycle when the Transmission Enable line (TE) is pulled high. This cycle repeats itself for as long as the TE line is held high. Once TE falls low, the encoder completes its final cycle and then stops as shown in the Encoder / Decoder Timing diagram (Figure 16). When a transmission enable signal is applied, the encoder scans and transmits the status of the 10 bits of the address code and the 8 bits of the data serially in the order A0 to A9, D0 to D7. The state of address / data pins can be interpreted as ONE, ZERO or OPEN bits, following the logic of the D_CFG, A_CFG0 and A_CFG1 inputs. See the Input Type Selection section for more details. The open bit on the data input is interpreted as logic low by the decoders since the decoder output only has two states. The address pins are usually set to transmit particular security codes by DIP switches or PCB wiring, while the data is selected using push buttons or electronic switches. Theory of Operation The KH3 Series transmitter operation is straightforward. When the Transmit Enable (TE) line is taken high, the on-board encoder IC is activated. The encoder detects the logic states of the data and address lines. These states are formatted into a 3-word transmission, which continues until the TE line is taken low. The encoder creates a serial data packet that is used to modulate the transmitter. The transmitter section is based on a simple, but highly-optimized, architecture that achieves a high fundamental output power with low harmonic content. This ensures that most approval standards can be met without external filter components. The KH3 Series transmitter is exceptionally stable over variations in time, temperature, and physical shock as a result of the precision SAW device that is incorporated as the frequency reference. The transmitted signal may be received by a Linx KH3 Series receiver / decoder module or a Linx LR Series receiver combined with the appropriate decoder IC. Once data is received, it is decoded using a decoder IC or custom microcontroller. The transmitted address bits are checked against the address settings of the receiving device. If a match is confirmed, the decoder’s outputs are set to replicate the transmitter’s inputs. Compatibility with the KH2 Series The Legacy KH2 Series used encoders and decoders for Holtek® and the KH3 migrates to the Linx DS Series encoder and decoder. The protocol and functionality are compatible. There is some difference in the hardware set-up for the address lines and the data lines. The legacy Holtek® products used tri-state lines, so high, low and floating were each valid states. The DS Series has bi-state lines; high and low only. Three lines have been added to the KH3 module to allow for the selection of how the address and data line states are interpreted. Please see the Input Type Selection section for more details. The KH3 transmitter has been designed to be compatible with legacy systems. The module has been configured for the most common use of the KH2 so that it can be placed on existing boards without modification. This makes the KH3 a drop-in replacement for most applications. Check Check < 1 Word

3 WordsTransmitted Continuously3 Words

2 Words

Enabled? Yes No

3 Data Words

Still Enabled? Figure 16: Encoder Flowchart Figure 17: Encoder / Decoder Timing Diagram

– – – –12 13 Setting the Transmitter Address The module has ten address lines. This allows the formation of up to 1,022 (210 – 2) unique transmitter-receiver relationships. Because the address inputs have internal pull-up resistors these pins can be left floating or tied to GND. These pins may be hardwired or configured via a microprocessor, DIP switch or jumpers. The receiver’s address line states must match the transmitter’s exactly for a transmission to be recognized. If the transmitted address does not match the receiver’s local address, then the receiver will take no action. Data Inputs When the Transmit Enable (TE) line goes high, the states of the eight data input lines are recorded and encoded for transmission. Because the data inputs have internal pull-down resistors, these pins can be left floating or tied to VCC. The states of the data lines can be set by switches, jumpers, microcontrollers or hardwired on the PCB. The encoder sends the states of the address and data lines three times. If the TE line is still high, it begins the cycle again. This means that the states of the data lines are refreshed with each cycle, so the data lines can be changed without having to pull TE low. There can be up to a 150ms lag in response as the transmitter finishes one cycle then refreshes and starts over. Enabling Transmission The module’s Transmit Enable (TE) line controls transmission status. When taken high, the module initiates transmission, which continues until the line is pulled low or power to the module is removed. In some cases this line will be wired permanently to VCC and transmission controlled by switching VCC to the module. This is particularly useful in applications where the module powers up and sends a transmission only when a button is pressed on the remote. Input Type Selection The KH3 Series transmitter incorporates the DS Series remote control encoder, which is designed to be operable with previous generation products based on Holtek® encoders and decoders. The Holtek® encoders and decoders have tri-state input lines but the DS has bi-state lines. Tri-state inputs are connected to ground for zero bits, VCC for one bits, or left unconnected for open bits. Since the DS cannot match this operation the D_CFG, A_CFG0 and A_CFG1 lines are provided to select the desired interpretation. The settings must match on both ends. Pulling the D_CFG line high configures the data inputs as one and zero. A high on a data line is interpreted as a one bit and a low on the line is interpreted as a zero bit. Pulling D_CFG low configures the data inputs as one and open. A high on a data line is interpreted as a one bit and a low on the line is interpreted as an open bit. The decoder outputs open data bits as logic low. This is shown in Figure 18. A_CFG0 and A_CFG1 are used to select the bit type for the address lines. These are shown in Figure 19. D_CFG is pulled low internally so that a high on a data line is transmitted as a one bit and a low on the line is transmitted as an open bit. A_CFG0 is pulled low and A_CFG1 is pulled high internally so that a high on an address line is interpreted as an open bit and a low as a zero bit. This configuration matches the Linx OEM products and the most common implementation of the legacy KH2 Series. This enables customers using the KH2 Series to populate the KH3 Series without any PCB modifications since pins 25, 26 and 27 can be left unconnected. D_CFG Configuration Configuration Bit Interpretation D_CFG High Low

0 One Open

1 One Zero

A_CFGO and A_CFG1 Configuration Configuration Bit Interpretation A_CFG1 A_CFG0 High Low 0 0 One Zero 0 1 One Open 1 0 Open Zero 1 1 One Zero Figure 18: D_CFG Configuration Figure 19: A_CFG0 and A_CFG1 Configuration Note: All address lines high or all low is not allowed, so at least one line must be different from the others.

– – – –18 19 Interference Considerations The RF spectrum is crowded and the potential for conflict with unwanted sources of RF is very real. While all RF products are at risk from interference, its effects can be minimized by better understanding its characteristics. Interference may come from internal or external sources. The first step is to eliminate interference from noise sources on the board. This means paying careful attention to layout, grounding, filtering and bypassing in order to eliminate all radiated and conducted interference paths. For many products, this is straightforward; however, products containing components such as switching power supplies, motors, crystals and other potential sources of noise must be approached with care. Comparing your own design with a Linx evaluation board can help to determine if and at what level design-specific interference is present. External interference can manifest itself in a variety of ways. Low-level interference produces noise and hashing on the output and reduces the link’s overall range. High-level interference is caused by nearby products sharing the same frequency or from near-band high-power devices. It can even come from your own products if more than one transmitter is active in the same area. It is important to remember that only one transmitter at a time can occupy a frequency, regardless of the coding of the transmitted signal. This type of interference is less common than those mentioned previously, but in severe cases it can prevent all useful function of the affected device. Although technically not interference, multipath is also a factor to be understood. Multipath is a term used to refer to the signal cancellation effects that occur when RF waves arrive at the receiver in different phase relationships. This effect is a particularly significant factor in interior environments where objects provide many different signal reflection paths. Multipath cancellation results in lowered signal levels at the receiver and shorter useful distances for the link. Pad Layout The pad layout diagram in Figure 24 is designed to facilitate both hand and automated assembly. Board Layout Guidelines The module’s design makes integration straightforward; however, it is still critical to exercise care in PCB layout. Failure to observe good layout techniques can result in a significant degradation of the module’s performance. A primary layout goal is to maintain a characteristic 50-ohm impedance throughout the path from the antenna to the module. Grounding, filtering, decoupling, routing and PCB stack-up are also important considerations for any RF design. The following section provides some basic design guidelines. During prototyping, the module should be soldered to a properly laid-out circuit board. The use of prototyping or “perf” boards results in poor performance and is strongly discouraged. Likewise, the use of sockets can have a negative impact on the performance of the module and is discouraged. The module should, as much as reasonably possible, be isolated from other components on your PCB, especially high-frequency circuitry such as crystal oscillators, switching power supplies, and high-speed bus lines. When possible, separate RF and digital circuits into different PCB regions. 0.10 in (2.54 mm) 0.07 in (1.78 mm) 0.065 in (1.65 mm) 0.61 in (15.49 mm)0.10 in (2.54 mm) 0.14 in (3.56 mm) 0.096 in (2.44 mm) 0.274 in (6.96 mm) 0.046 in (1.17 mm) Figure 24: Recommended PCB Layout

– – – –22 23 Production Guidelines The module is housed in a hybrid SMD package that supports hand and automated assembly techniques. Since the modules contain discrete components internally, the assembly procedures are critical to ensuring the reliable function of the modules. The following procedures should be reviewed with and practiced by all assembly personnel. Hand Assembly Pads located on the bottom of the module are the primary mounting surface (Figure 27). Since these pads are inaccessible during mounting, castellations that run up the side of the module have been provided to facilitate solder wicking to the module’s underside. This allows for very quick hand soldering for prototyping and small volume production. If the recommended pad guidelines have been followed, the pads will protrude slightly past the edge of the module. Use a fine soldering tip to heat the board pad and the castellation, then introduce solder to the pad at the module’s edge. The solder will wick underneath the module, providing reliable attachment. Tack one module corner first and then work around the device, taking care not to exceed the times in Figure 28. Automated Assembly For high-volume assembly, the modules are generally auto-placed. The modules have been designed to maintain compatibility with reflow processing techniques; however, due to their hybrid nature, certain aspects of the assembly process are far more critical than for other component types. Following are brief discussions of the three primary areas where caution must be observed. CastellationsPCB Pads Soldering Iron Tip Solder Figure 27: Soldering Technique Warning: Pay attention to the absolute maximum solder times. Figure 28: Absolute Maximum Solder Times Absolute Maximum Solder Times Hand Solder Temperature: +225ºC for 10 seconds Reflow Oven: +225ºC max (see Figure 29) Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow stage. The reflow profile in Figure 29 should not be exceeded because excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel need to pay careful attention to the oven’s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by the modules. The figure below shows the recommended reflow oven profile for the modules. Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the modules not be subjected to shock or vibration during the time solder is liquid. Should a shock be applied, some internal components could be lifted from their pads, causing the module to not function properly. Washability The modules are wash-resistant, but are not hermetically sealed. Linx recommends wash-free manufacturing; however, the modules can be subjected to a wash cycle provided that a drying time is allowed prior to applying electrical power to the modules. The drying time should be sufficient to allow any moisture that may have migrated into the module to evaporate, thus eliminating the potential for shorting damage during power-up or testing. If the wash contains contaminants, the performance may be adversely affected, even after drying. 125°C 185°C 217°C 255°C 235°C 60 12030 1501 80 2102 40 2703 00 3303 6009 0 100 150 200 250

300 Recommended RoHS Profile

Recommended Non-RoHS Profile 180°C Temperature (oC) Time (Seconds) Figure 29: Maximum Reflow Temperature Profile

– – – –28 29 Regulatory Considerations When working with RF, a clear distinction must be made between what is technically possible and what is legally acceptable in the country where operation is intended. Many manufacturers have avoided incorporating RF into their products as a result of uncertainty and even fear of the approval and certification process. Here at Linx, our desire is not only to expedite the design process, but also to assist you in achieving a clear idea of what is involved in obtaining the necessary approvals to legally market a completed product. For information about regulatory approval, read AN-00142 on the Linx website or call Linx. Linx designs products with worldwide regulatory approval in mind. In the United States, the approval process is actually quite straightforward. The regulations governing RF devices and the enforcement of them are the responsibility of the Federal Communications Commission (FCC). The regulations are contained in Title 47 of the United States Code of Federal Regulations (CFR). Title 47 is made up of numerous volumes; however, all regulations applicable to this module are contained in Volume 0-19. It is strongly recommended that a copy be obtained from the FCC’s website, the Government Printing Office in Washington or from your local government bookstore. Excerpts of applicable sections are included with Linx evaluation kits or may be obtained from the Linx Technologies website, www.linxtechnologies.com. In brief, these rules require that any device that intentionally radiates RF energy be approved, that is, tested for compliance and issued a unique identification number. This is a relatively painless process. Final compliance testing is performed by one of the many independent testing laboratories across the country. Many labs can also provide other certifications that the product may require at the same time, such as UL, CLASS A / B, etc. Once the completed product has passed, an ID number is issued that is to be clearly placed on each product manufactured. Note: Linx RF modules are designed as component devices that require external components to function. The purchaser understands that additional approvals may be required prior to the sale or operation of the device, and agrees to utilize the component in keeping with all laws governing its use in the country of operation. Questions regarding interpretations of the Part 2 and Part 15 rules or the measurement procedures used to test intentional radiators such as Linx RF modules for compliance with the technical standards of Part 15 should be addressed to: Federal Communications Commission Equipment Authorization Division Customer Service Branch, MS 1300F2

7435 Oakland Mills Road

Columbia, MD, US 21046 Phone: + 1 301 725 585 | Fax: + 1 301 344 2050 Email: labinfo@fcc.gov ETSI Secretaria 650, Route des Lucioles

06921 Sophia-Antipolis Cedex

Phone: +33 (0)4 92 94 42 00 Fax: +33 (0)4 93 65 47 16 International approvals are slightly more complex, although Linx modules are designed to allow all international standards to be met. If the end product is to be exported to other countries, contact Linx to determine the specific suitability of the module to the application. All Linx modules are designed with the approval process in mind and thus much of the frustration that is typically experienced with a discrete design is eliminated. Approval is still dependent on many factors, such as the choice of antennas, correct use of the frequency selected and physical packaging. While some extra cost and design effort are required to address these issues, the additional usefulness and profitability added to a product by RF makes the effort more than worthwhile.

– – – –30 31 Notes

Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. The information contained in this Data Guide is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK. Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF CUSTOMER’S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’ liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability for injury to person or property, economic loss, or business interruption) for all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments, adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Devices described in this publication may contain proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall any user be conveyed any license or right to the use or ownership of such items. ©2015 Linx Technologies. All rights reserved. The stylized Linx logo, Wireless Made Simple, WiSE, CipherLinx and the stylized CL logo are trademarks of Linx Technologies. Linx Technologies

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