TXB0304 TI1 | Alldatasheet
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(TOP VIEW) TXB0304 TXBN0304 1 2 3 4 8765 12 11 10 9 13141516 OEGNDGNDNC V CCBNCNCV CCA 1 2 3 4 8765 12 11 10 9 13141516 OEGNDGNDNC V CCBNCNCV CCA 1 2 3 4 8765 12 11 10 9 13141516 /OEGNDGNDNC V CCBNCNCV CCA 1 2 3 4 8765 12 11 10 9 13141516 /OEGNDGNDNC V CCBNCNCV CCA RUT P ACKAGE (TOP VIEW) TXB0304 TXBN0304 TXB0304 www.ti.com SCES831C –SEPTEMBER 2011–REVISED MAY 2012 4-BITBIDIRECTIONALVOLTAGE-LEVELTRANSLATORWITHAUTOMATICDIRECTION SENSING Check forSamples: TXB0304 1FEATURES DESCRIPTION• FullySymmetric Supply Voltages.0.9V to3.6 This4-bitnon-invertingtranslatoruses two separateV on A Portand 0.9V to3.6V State trackVCCB .VCCB acceptsany supplyvoltagefrom0.9 V to 3.6 V. This allowsforlow-voltagebidirectional• OE InputCircuitReferenced toVCCA
- IoffSupports Partial-Power-DownMode in the high-impedancestate.To ensure the high- Operation impedance stateduringpower up orpower down, OE shouldbe tiedto GND througha pulldownresistor;• Latch-Up Performance Exceeds 100 mA Per the minimum valueof the resistorisdeterminedbyJESD 78,Class II the current-sourcingcapabilityof the driver.The• ESD ProtectionExceeds JESD 22 TXB0304 isdesignedso thatthe OE inputcircuitis – 8000-V Human-Body Model (A114-B) suppliedby VCCA . This deviceis fullyspecifiedfor partial-power-downapplicationsusing Ioff. The Ioff– 1000-V Charged-DeviceModel (C101) circuitrydisablesthe outputs,preventingdamaging currentbackflow through the device when it is powered down. A. Pullup resistorsarenotrequiredon bothsidesforLogicI/O. B. Ifpullup orpulldown resistorsareneeded,theresistorvaluemust be over20 kΩ. C. 20 kΩ isa saferecommended value,ifthecustomercan accepthigherVolorlowerVoh, smallerpullup orpulldown resistorisallowed,thedraftestimationisVol= Vccout× 1.5k/(1.5k+ Rpu) and Voh = Vccout× Rdw/(1.5k+ Rdw). D. Ifpullup resistorsareneeded,pleaserefertotheTXS0104 orcontactTI. E. Fordetailedinformation,pleaserefertoapplicationnoteSCEA043 . Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SCES831C –SEPTEMBER 2011–REVISED MAY 2012 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. ORDERING INFORMATION (1) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING RUT – MicroQFN TXB0304RUTR 73R RSV – QFN TXB0304RSVR ZTJ –40 to85°C RUT – MicroQFN TXBN0304RUTR 74R RSV – QFN TXBN0304RSVR ZTK (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com. DEVICE INFORMATION Table1.SIGNAL DESCRIPTIONS PIN NO. NAME FUNCTION RSV RUT TXB0304 TXBN0304 16 1 VCCA A-portsupplyvoltage0.9V≤ VCCA ≤ 3.6V 1 2 A1 Input/output1 2 3 A2 Input/output2 ReferencedtoVCCA 3 4 A3 Input/output3 4 5 A4 Input/output4 5 – NC No connection;notinternallyconnected 6,7 6 GND Ground 3-stateoutput-modeenable.PullOE (TXB0304)lowtoplacealloutputsin3-statemode. 3-stateoutput-modeenable.PullOE (TXBN0304) hightoplacealloutputsin3-state8 12 OE OE mode. ReferencedtoVCCA. 9 7 B4 Input/output1 10 8 B3 Input/output2 ReferencedtoVCCB 11 9 B2 Input/output3 12 10 B1 Input/output4 13 11 VCCB B-portsupplyvoltage0.9V≤ VCCB ≤ 3.6V 14 – NC No connection;notinternallyconnected 15 – NC No connection;notinternallyconnected
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www.ti.com SCES831C –SEPTEMBER 2011–REVISED MAY 2012 ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCCA –0.5 4.6 Supplyvoltagerange V VCCB –0.5 4.6 A port –0.5 4.6 VI Inputvoltagerange V B port –0.5 4.6 A port –0.5 4.6Voltagerangeappliedtoany outputintheVO Vhigh-impedanceorpower-offstate B port -0.5 4.6 A port –0.5 VCCA + 0.5Voltagerangeappliedtoany outputintheVO Vhighorlowstate(2) B port –0.5 VCCB + 0.5 IIK Inputclamp current VI< 0 –50 mA IOK Outputclamp current VO < 0 –50 mA IO Continuousoutputcurrent ±50 mA ContinuouscurrentthroughVCCA, VCCB, orGND ±100 mA Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) The valueofVCCA and VCCB areprovidedintherecommended operatingconditionstable. THERMAL IMPEDANCE RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted) UNIT θJA Package thermalimpedance RUT package(1) 87 °C/W RSV package(2) 184 (1) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7 (2) The package thermalimpedance iscalculatedinaccordancewithJESD 51-5. RECOMMENDED OPERATING CONDITIONS (1)(2) VCCA VCCB MIN MAX UNIT VCCA 0.9 3.6 Supplyvoltage V VCCB 0.9 3.6 VIH High-levelinputvoltage V VIL Low-levelinputvoltage V A-portinputs 0.9V to3.6V 0.9V to3.6V 40 Δt/Δv Inputtransitionriseorfallrate ns/V B-portinputs 0.9V to3.6V 0.9V to3.6V 40 TA Operatingfree-airtemperature –40 85 °C (1) The A and B sidesofan unused dataI/Opairmust be heldinthesame state,i.e.,bothatVCCI orbothatGND. (2) VCCI isthesupplyvoltageassociatedwiththeinputport. Copyright© 2011–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TXB0304
SCES831C –SEPTEMBER 2011–REVISED MAY 2012 www.ti.com
ELECTRICAL CHARACTERISTICS
TA = 25°C –40°C to85°C PARAMETER TEST CONDITIONS VCCA VCCB UNIT MIN TYP MAX MIN MAX 0.9xVOHA IOH = –20 μA 0.9V to3.6V VVCCA VOLA IOL = 20 μA 0.9V to3.6V 0.2 V 0.9xVOHB IOH = –20 μA 0.9V to3.6V VVCCB VOLB IOL = 20 μA 0.9V to3.6V 0.2 V II OE VI= VCCI orGND 0.9V to3.6V 0.9V to3.6V ±1 ±2 μA A port VIorVO = 0 to3.6V 0 V 0 V to3.6V ±1 ±2 Ioff μA B port VIorVO = 0 to3.6V 0.9V to3.6V 0 V ±1 ±2 IOZ A orB port OE = GND 0.9V to3.6V 0.9V to3.6V ±1 ±2 μA ICCA VI= VCCI orGND, IO = 0 0.9V to3.6V 0.9V to3.6V 5 μA ICCB VI= VCCI orGND, IO = 0 0.9V to3.6V 0.9V to3.6V 5 μA ICCA + ICCB VI= VCCI orGND, IO = 0 0.9V to3.6V 0.9V to3.6V 10 μA VI= VCCI orGND,ICCZA 0.9V to3.6V 0.9V to3.6V 5 μAIO = 0,OE = GND VI= VCCI orGND,ICCZB 0.9V to3.6V 0.9V to3.6V 5 μAIO = 0,OE = GND C i OE 0.9V to3.6V 0.9V to3.6V 3 pF A port 6.7 C io 0.9V to3.6V 0.9V to3.6V pF B port 6.7 TIMING REQUIREMENTS overrecommended operatingfree-airtemperaturerange(unlessotherwisenoted) VCCA VCCB MIN MAX UNIT C L = 15 pF 0.9to3.6V 0.9to3.6V 50 Mbps C L = 15 pF 1.2to3.6V 1.2to3.6V 100 Mbps C L = 15 pF 1.8to3.6V 1.8to3.6V 140 Mbps C L = 30 pF 0.9to3.6V 0.9to3.6V 40 Mbps C L = 30 pF 1.2to3.6V 1.2to3.6V 90 Mbps Data rate C L = 30 pF 1.8to3.6V 1.8to3.6V 130 Mbps C L = 50 pF 1.2to3.6V 1.2to3.6V 80 Mbps C L = 50 pF 1.8to3.6V 1.8to3.6V 120 Mbps C L = 100 pF 1.2to3.6V 1.2to3.6V 70 Mbps C L = 100 pF 1.8to3.6V 1.8to3.6V 100 Mbps
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www.ti.com SCES831C –SEPTEMBER 2011–REVISED MAY 2012 SWITCHING CHARACTERISTICS overoperatingfree-airtemperaturerange(unlessotherwisenoted) TYPFROM TOPARAMETER VCCA VCCB MIN MAX UNITTA =(INPUT) (OUTPUT) 25°C ns tpd ns A C L = 15 0.9-3.6 0.9-3.6 173 ten OE ns B C L = 15 0.9-3.6 0.9-3.6 213 A C L = 15 0.9-3.6 0.9-3.6 172 ns tdis OE B C L = 15 0.9-3.6 0.9-3.6 169 ns OPERATING CHARACTERISTICS TA = 25°C VCCA ,VCCB 0.9V to3.6VPARAMETER TEST CONDITIONS UNIT TYP A-portinput,B-portoutput 34 C pdA pF B-portinput,A-portoutput 34 C L = 0,f= 10 MHz, tr = tf= 1 ns,OE = VCCA (outputsenabled) A-portinput,B-portoutput 34 C pdB pF B-portinput,A-portoutput 34 A-portinput,B-portoutput 0.01 C pdA pF B-portinput,A-portoutput 0.01 C L = 0,f= 10 MHz, tr = tf= 1 ns,OE = GND (outputsdisabled) A-portinput,B-portoutput 0.01 C pdB pF B-portinput,A-portoutput 0.01 Copyright© 2011–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TXB0304
SCES831C –SEPTEMBER 2011–REVISED MAY 2012 www.ti.com
REVISION HISTORY
Changes from RevisionB (September 2011)toRevisionC Page
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www.ti.com 7-May-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TXB0304RSVR ACTIVE UQFN RSV 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0304RUTR ACTIVE UQFN RUT 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXBN0304RSVR ACTIVE UQFN RSV 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXBN0304RUTR ACTIVE UQFN RUT 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0304RSVR UQFN RSV 16 3000 202.0 201.0 28.0 TXB0304RUTR UQFN RUT 12 3000 180.0 180.0 30.0 TXBN0304RSVR UQFN RSV 16 3000 202.0 201.0 28.0 TXBN0304RSVR UQFN RSV 16 3000 180.0 180.0 30.0 TXBN0304RUTR UQFN RUT 12 3000 202.0 201.0 28.0 PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2012 Pack Materials-Page 2
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