TXB0104PWRG4

TXB0104_08 TI | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 25

Technical content

FEATURES

(TOP VIEW) A B C OE D OR PW PACKAGE (TOP VIEW) GND NC VCCA NC VCCB RGY PACKAGE Exposed Center Pad (TOP VIEW) 1 14 7 8 1 1 NC NC OE V GND CCBVCCA TXB0104 www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING AND 15-kV ESD PROTECTION 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on ESD Protection Exceeds JESD B Port CCA V CCB A Port V CC Isolation Feature If Either V CC Input Is at 2500-V Human-Body Model (A114-B) GND, All Outputs Are in the High-Impedance 200-V Machine Model (A115-A) State 1500-V Charged-Device Model (C101) OE Input Circuit Referenced to V CCA B Port Low Power Consumption, µ A Max I CC 15-kV Human-Body Model (A114-B) I off Supports Partial-Power-Down Mode 200-V Machine Model (A115-A) Operation 1500-V Charged-Device Model (C101) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II TERMINAL ASSIGNMENTS (GXU/ZXU Package) A B C GND OE V CCA V CCB N.C. No internal connection For RGY, if the exposed center pad is used it must only be connected to as a secondary ground or left electrically open. Please be aware that an important notice concerning availability, standard warranty, and use in critical

applications

sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2006 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

(TOP VIEW) D C B A 3 2 1 TXB0104 SCES650D APRIL 2006 REVISED MAY 2008 www.ti.com TERMINAL ASSIGNMENTS (YZT Package) D GND C OE B V CCA A V CCB DESCRIPTION/ORDERING INFORMATION This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA V CCA accepts any supply voltage from 1.2 V to 3.6 The B port is designed to track V CCB V CCB accepts any supply voltage from 1.65 V to 5.5 This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA should not exceed V CCB When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0104 is designed so that the OE input circuit is supplied by V CCA This device is fully specified for partial-power-down I off The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) NanoFree WCSP (DSBGA) 0.23-mm Large Bump YZT Reel of 3000 TXB0104YZTR 2K7 (Pb-free) 0.625-mm max height UFBGA GXU Reel of 2500 TXB0104GXUR YE04 UFBGA ZXU (Pb-Free) Reel of 2500 TXB0104ZXUR YE04 TXB0104RGYR QFN RGY Reel of 1000 YE04 TXB0104RGYRG4 C to C TXB0104D Tube of TXB0104DG4 SOIC D TXB0104 TXB0104DR Reel of 2500 TXB0104DRG4 TXB0104PWR TSSOP PW Reel of 2000 YE04 TXB0104PWRG4 (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com (3) YZT: The actual top-side marking has three preceding characters to denote year, month, amd sequence code, and one following character to designate the assembly/test site. Pin identifier indicates solder-bump composition SnPb, Pb-free). Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

(1) TXB0104 www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 PIN

DESCRIPTION

NO. BALL NO. NAME FUNCTION PW, OR RGY GXU/ZXU YZT V CCA A-port supply voltage 1.2 V V CCA 3.6 V and V CCA V CCB Input/output Referenced to V CCA Input/output Referenced to V CCA Input/output Referenced to V CCA Input/output Referenced to V CCA NC No connection. Not internally connected. GND Ground 3-state output-mode enable. Pull OE low to place all outputs in 3-state OE mode. Referenced to V CCA NC No connection. Not internally connected. Input/output Referenced to V CCB Input/output Referenced to V CCB Input/output Referenced to V CCB Input/output Referenced to V CCB V CCB B-port supply voltage 1.65 V V CCB 5.5 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CCA 0.5 4.6 Supply voltage range V V CCB 0.5 6.5 A port 0.5 4.6 V I Input voltage range V B port 0.5 6.5 A port 0.5 4.6 Voltage range applied to any output in the high-impedance or V O V power-off state B port -0.5 6.5 A port 0.5 V CCA 0.5 V O Voltage range applied to any output in the high or low state (2) V B port 0.5 V CCB 0.5 I IK Input clamp current V I mA I OK Output clamp current V O mA I O Continuous output current mA Continuous current through V CCA V CCB or GND 100 mA T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The value of V CCA and V CCB are provided in the recommended operating conditions table. Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0104

(1) (2) TXB0104 SCES650D APRIL 2006 REVISED MAY 2008 www.ti.com UNIT D package (1) GXU/ZXU package (1) 129 θ JA Package thermal impedance PW package (1) 113 C/W RGY package (2) YZT package (1) The package thermal impedance is calculated in accordance with JESD 51-7. (2) The package thermal impedance is calculated in accordance with JESD 51-5. V CCA V CCB MIN MAX UNIT V CCA 1.2 3.6 Supply voltage V V CCB 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V V CCI 0.65 (3) V CCI V IH High-level input voltage V OE 1.2 V to 3.6 V 1.65 V to 5.5 V V CCA 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V V CCI 0.35 (3) V IL Low-level input voltage V OE 1.2 V to 3.6 V 1.65 V to 5.5 V V CCA 0.35 Voltage range applied to any A-port 3.6 V O output in the high-impedance 1.2 V to 3.6 V 1.65 V to 5.5 V V B-port 5.5 or power-off state A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V Input transition Δ Δ v 1.65 V to 3.6 V ns/V rise or fall rate B-port inputs 1.2 V to 3.6 V 4.5 V to 5.5 V T A Operating free-air temperature C (1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at V CCI or both at GND. (2) V CCA must be less than or equal to V CCB and must not exceed 3.6 (3) V CCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

(1) (2) TXB0104 www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 over recommended operating free-air temperature range (unless otherwise noted) T A C C to C PARAMETER TEST CONDITIONS V CCA V CCB UNIT MIN TYP MAX MIN MAX 1.2 V 1.1 V OHA I OH µ A V 1.4 V to 3.6 V V CCA 0.4 1.2 V 0.9 V OLA I OL µ A V 1.4 V to 3.6 V 0.4 V OHB I OH µ A 1.65 V to 5.5 V V CCB 0.4 V V OLB I OL µ A 1.65 V to 5.5 V 0.4 V I I OE V I V CCI or GND 1.2 V to 3.6 V 1.65 V to 5.5 V µ A A port V I or V O to 3.6 V V V to 5.5 V I off µ A B port V I or V O to 5.5 V V to 3.6 V V I OZ A or B port OE GND 1.2 V to 3.6 V 1.65 V to 5.5 V µ A 1.2 V 1.65 V to 5.5 V 0.06 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, I CCA µ A I O 3.6 V V V 5.5 V 1.2 V 1.65 V to 5.5 V 3.4 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, I CCB µ A I O 3.6 V V V 5.5 V 1.2 V 1.65 V to 5.5 V 3.5 V I V CCI or GND, I CCA I CCB µ A I O 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, 1.2 V 1.65 V to 5.5 V 0.05 I CCZA I O µ A 1.4 V to 3.6 V 1.65 V to 5.5 V OE GND V I V CCI or GND, 1.2 V 1.65 V to 5.5 V 3.3 I CCZB I O µ A 1.4 V to 3.6 V 1.65 V to 5.5 V OE GND C i OE 1.2 V to 3.6 V 1.65 V to 5.5 V pF A port C io 1.2 V to 3.6 V 1.65 V to 5.5 V pF B port (1) V CCI is the supply voltage associated with the input port. (2) V CCO is the supply voltage associated with the output port. Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0104

www.ti.com T A V CCA 1.2 V V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V UNIT TYP TYP TYP TYP Data rate Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 1.5 V 0.1 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V 0.15 V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX Data rate Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V 0.15 V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX Data rate Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX Data rate 100 100 100 Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V 0.3 V 0.5 V UNIT MIN MAX MIN MAX Data rate 100 100 Mbps t w Pulse duration Data inputs ns Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 T A V CCA 1.2 V V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO PARAMETER UNIT (INPUT) (OUTPUT) TYP TYP TYP TYP A B 6.9 5.7 5.3 5.5 t pd ns B A 7.4 6.4 5.8 A t en OE µ s B A t dis OE ns B t rA t fA A-port rise and fall times 4.2 4.2 4.2 4.2 ns t rB t fB B-port rise and fall times 2.1 1.5 1.2 1.1 ns t SK(O) Channel-to-channel skew 0.4 0.5 0.5 1.4 ns Max data rate Mbps over recommended operating free-air temperature range, V CCA 1.5 V 0.1 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.15 V 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX A B 1.4 12.9 1.2 10.1 1.1 0.8 9.9 t pd ns B A 0.9 14.2 0.7 0.4 11.7 0.3 13.7 A t en OE µ s B A 5.9 5.7 25.9 5.6 5.7 22.4 t dis OE ns B 5.4 30.3 4.9 22.8 4.8 4.9 19.5 t rA t fA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns t rB t fB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns t SK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns Max data rate Mbps over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.15 V 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX A B 1.6 1.4 7.7 1.3 6.8 1.2 6.5 t pd ns B A 1.5 1.3 8.4 7.6 0.9 7.1 A t en OE µ s B A 5.9 5.1 21.3 19.3 17.4 t dis OE ns B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3 t rA t fA A-port rise and fall times 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns t rB t fB B-port rise and fall times 0.9 3.8 0.6 3.2 0.5 2.8 0.4 2.7 ns t SK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns Max data rate Mbps Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0104

www.ti.com over recommended operating free-air temperature range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX A B 1.1 6.3 5.2 0.9 4.7 t pd ns B A 1.2 6.6 1.1 5.1 0.9 4.4 A t en OE µ s B A 5.1 21.3 4.6 15.2 4.6 13.2 t dis OE ns B 4.4 20.8 3.8 3.9 13.9 t rA t fA A-port rise and fall times 0.8 0.8 0.8 ns t rB t fB B-port rise and fall times 0.7 2.6 0.5 2.8 0.4 2.7 ns t SK(O) Channel-to-channel skew 0.5 0.5 0.5 ns Max data rate 100 100 100 Mbps over recommended operating free-air temperature range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V FROM TO 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX A B 0.9 4.7 0.8 t pd ns B A 4.9 0.9 3.8 A t en OE µ s B A 4.6 15.2 4.3 12.1 t dis OE ns B 3.8 3.4 13.2 t rA t fA A-port rise and fall times 0.7 2.5 0.7 2.5 ns t rB t fB B-port rise and fall times 0.5 2.1 0.4 2.7 ns t SK(O) Channel-to-channel skew 0.5 0.5 ns Max data rate 100 100 Mbps Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 T A C V CCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V V CCB PARAMETER TEST CONDITIONS UNIT 3.3 V V 1.8 V 1.8 V 1.8 V 2.5 V V to V TYP TYP TYP TYP TYP TYP TYP A-port input, B-port output 7.8 C L f MHz, C pdA B-port input, A-port output t r t f ns, pF OE V CCA A-port input, B-port output 38.1 C pdB (outputs enabled) B-port input, A-port output 25.4 A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 C L f MHz, C pdA B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 t r t f ns, pF OE GND A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03 C pdB (outputs disabled) B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.04 Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0104

www.ti.com The TXB0104 can be used in level-translation another. The TXB0104 architecture (see Figure does not require a direction-control signal to control the direction of data flow from A to B or from B to In a dc state, the output drivers of the TXB0104 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is Ω at V CCO 1.2 V to 1.8 Ω at V CCO 1.8 V to 3.3 and Ω at V CCO 3.3 V to Figure Architecture of TXB0104 I/O Cell Typical I IN vs V IN characteristics of the TXB0104 are shown in Figure For proper operation, the device driving the data I/Os of the TXB0104 must have drive strength of at least mA. Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

±(VD ± VT)/4 k/C0087 A. V T is the input threshold voltage of the TXB0104 (typically VCCI/2). B. V D is the supply voltage of the external driver. Power Up Enable and Disable Pullup or Pulldown Resistors on I/O Lines TXB0104 www.ti.com SCES650D APRIL 2006 REVISED MAY 2008 Figure Typical I IN vs V IN Curve During operation, ensure that V CCA V CCB at all times. During power-up sequencing, V CCA V CCB does not damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all output ports when either V CC is switched off CCA/B V). The TXB0104 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time dis indicates the delay between when OE goes low and when the outputs acutally get disabled (Hi-Z). The enable time en indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. The TXB0104 is designed to drive capacitive loads of up to pF. The output drivers of the TXB0104 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than k Ω to ensure that they do not contend with the output drivers of the TXB0104. For the same reason, the TXB0104 should not be used in I C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0104

/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT 2 × VCCO Open 50 k/C0087 VCCI 0 V VCCI/2 V CCI/2 tw VOLT AGE W AVEFORMS PROPAGA TION DELA Y TIMES VOLT AGE W AVEFORMS PULSE DURA TION Input tPZL /tPLZ tPHZ /tPZH 2 × VCCO Open TEST S1 A. C L includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR/C011810 MHz, ZO = 50 W , dv/dt ≥/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr1 V/ns. C. The outputs are measured one at a time, with one transition per measurement. D. tPLH and tPHL are the same as tpd. E. V CCI is the VCC associated with the input port. F. VCCO is the VCC associated with the output port. G. All parameters and waveforms are not applicable to all devices. 50 k/C0087 From Output /charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test

1 M/C008715 pF 15 pF

LOAD CIRCUIT FOR MAX DA TA RA TE, PULSE DURA TION PROP AGATION DELA Y OUTPUT RISE AND F ALL TIME MEASUREMENT tPLH tPHL 0 V VCCO /2 VCCI/2 V CCI/2 0.9 /C0121 VCCO VCCO /2 tr 0.1 /C0121 VCCO tf VCCI Input Output VOH VOL TXB0104 SCES650D APRIL 2006 REVISED MAY 2008 www.ti.com Figure Load Circuits and Voltage Waveforms Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TXB0104D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104GXUR ACTIVE BGA MI CROSTA R JUNI OR GXU 12 2500 TBD SNPB Level-1-240C-UNLIM TXB0104PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0104RGYR ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TXB0104RGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TXB0104YZTR ACTIVE DSBGA YZT 12 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TXB0104ZXUR ACTIVE BGA MI CROSTA R JUNI OR ZXU 12 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Addendum-Page 1

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TXB0104 :

• Automotive:TXB0104-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TXB0104GXUR BGA MI CROSTA R JUNI OR TXB0104ZXUR BGA MI CROSTA R JUNI OR PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2008 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0104DR SOIC D 14 2500 346.0 346.0 33.0 TXB0104GXUR BGA MICROSTAR JUNIOR GXU 12 2500 340.5 338.1 20.6 TXB0104PWR TSSOP PW 14 2000 346.0 346.0 29.0 TXB0104RGYR QFN RGY 14 1000 190.5 212.7 31.8 TXB0104YZTR DSBGA YZT 12 3000 220.0 220.0 34.0 TXB0104ZXUR BGA MICROSTAR JUNIOR ZXU 12 2500 340.5 338.1 20.6 PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2008 Pack Materials-Page 2

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

(TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for design. Customers are responsible for their products and components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee Solutions www.ti.com/lprf Video Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2008, Texas Instruments Incorporated