TXB0101DRLTG4

TXB0101_08 TI | Alldatasheet

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FEATURES

See mechanical drawings for dimensions. DBV PACKAGE (TOP VIEW) 2GND OE5 3 4A B 61VCCA VCCB DCK PACKAGE (TOP VIEW) 3 4A 2GND B 1VCCA OE

6 VCCB

(TOP VIEW) 2GND OE5 1VCCA 3 4A B (BOTTOM VIEW) 2GND OE VCCA A 43 B www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND 15-kV ESD PROTECTION Available in the Texas Instruments NanoFree Latch-Up Performance Exceeds 100 mA Per Package JESD 78, Class II 1.2 V to 3.6 V on A Port and ESD Protection Exceeds JESD 1.65 V to 5.5 V on B Port CCA V CCB A Port V CC Isolation Feature If Either V CC Input Is at 2000-V Human-Body Model (A114-B) GND, All Outputs Are in the High-Impedance 250-V Machine Model (A115-A) State 1500-V Charged-Device Model (C101) OE Input Circuit Referenced to V CCA B Port Low Power Consumption, µ A Max I CC 15-kV Human-Body Model (A114-B) I off Supports Partial-Power-Down Mode 250-V Machine Model (A115-A) Operation 1500-V Charged-Device Model (C101) This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA V CCA accepts any supply voltage from 1.2 V to 3.6 The B port is designed to track V CCB V CCB accepts any supply voltage from 1.65 V to 5.5 This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA should not exceed V CCB When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down

applications

I off The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2007 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

1.8-V System Controller 3.3-V System 1.8 V 3.3 V TXB0101 TXB0101 SCES639A JANUARY 2007 REVISED NOVEMBER 2008 www.ti.com ORDERING INFORMATION (1) ORDERABLE TOP-SIDE T A PACKAGE (2) PART NUMBER MARKING (3) (4) NanoFree WCSP (DSBGA) Reel of 3000 TXB0101YZPR (5) 27_ 0.23-mm Large Bump YZP (Pb-free) SOP DRL Reel of 4000 TXB0101DRLR (5) 27R Reel of 3000 TXB0101DBVR NFC_ C to C SOT (SOT-23) DBV Reel of 250 TXB0101DBVT NFC_ Reel of 3000 TXB0101DCKR (5) 27_ SOT (SC-70) DCK Reel of 250 TXB0101DCKT (5) 27_ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin identifier indicates solder-bump composition SnPb, Pb-free). (4) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. (5) Package preview PIN

DESCRIPTION

NO. NAME FUNCTION V CCA A-port supply voltage. 1.2 V V CCA 3.6 V and V CCA V CCB GND Ground A Input/output Referenced to V CCA B Input/output Referenced to V CCB 3-state output enable. Pull OE low to place all outputs in 3-state mode. OE Referenced to V CCA V CCB B-port supply voltage. 1.65 V V CCB 5.5 V TYPICAL OPERATING CIRCUIT Submit Documentation Feedback Copyright 2007 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101

(1) Recommended Operating Conditions (1) (2) TXB0101 www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CCA Supply voltage range 0.5 4.6 V V CCB Supply voltage range 0.5 6.5 V I Input voltage range (2) 0.5 6.5 V V O Voltage range applied to any output in the high-impedance or power-off state (2) 0.5 6.5 V A port 0.5 V CCA 0.5 V O Voltage range applied to any output in the high or low state (2) (3) V B port 0.5 V CCB 0.5 I IK Input clamp current V I mA I OK Output clamp current V O mA I O Continuous output current mA Continuous current through V CCA V CCB or GND 100 mA DBV package 165 DCK package 259 θ JA Package thermal impedance (4) C/W DRL package 142 YZP package 123 T stg Storage temperature range 150 C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) The value of V CCA and V CCB are provided in the recommended operating conditions table. (4) The package thermal impedance is calculated in accordance with JESD 51-7. V CCA V CCB MIN MAX UNIT V CCA 1.2 3.6 Supply voltage V V CCB 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V V CCI 0.65 (3) V CCI V IH High-level input voltage V OE 1.2 V to 3.6 V 1.65 V to 5.5 V V CCA 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V V CCI 0.35 (3) V IL Low-level input voltage V OE 1.2 V to 3.6 V 1.65 V to 5.5 V V CCA 0.35 A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V Input transition Δ Δ v 1.65 V to 3.6 V ns/V rise or fall rate B-port inputs 1.2 V to 3.6 V 4.5 V to 5.5 V T A Operating free-air temperature C (1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at V CCI or both at GND. (2) V CCA must be less than or equal to V CCB and must not exceed 3.6 (3) V CCI is the supply voltage associated with the input port. Copyright 2007 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0101

(1) (2) Timing Requirements Timing Requirements TXB0101 SCES639A JANUARY 2007 REVISED NOVEMBER 2008 www.ti.com over recommended operating free-air temperature range (unless otherwise noted) T A C C to C TEST PARAMETER V CCA V CCB UNIT CONDITIONS MIN TYP MAX MIN MAX 1.2 V 1.1 V OHA I OH µ A V 1.4 V to 3.6 V V CCA 0.4 1.2 V 0.9 V OLA I OL µ A V 1.4 V to 3.6 V 0.4 V OHB I OH µ A 1.65 V to 5.5 V V CCB 0.4 V V OLB I OL µ A 1.65 V to 5.5 V 0.4 V I I OE 1.2 V to 3.6 V 1.65 V to 5.5 V µ A A port V V to 5.5 V I off µ A B port V to 3.6 V V I OZ A or B port OE GND 1.2 V to 3.6 V 1.65 V to 5.5 V µ A 1.2 V 1.65 V to 5.5 V 0.06 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, I CCA µ A I O 3.6 V V V 5.5 V 1.2 V 1.65 V to 5.5 V 3.4 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, I CCB µ A I O 3.6 V V V 5.5 V 1.2 V 1.65 V to 5.5 V 3.5 V I V CCI or GND, I CCA I CCB µ A I O 1.4 V to 3.6 V 1.65 V to 5.5 V V I V CCI or GND, 1.2 V 1.65 V to 5.5 V 0.05 I CCZA I O µ A 1.4 V to 3.6 V 1.65 V to 5.5 V OE GND V I V CCI or GND, 1.2 V 1.65 V to 5.5 V 3.3 I CCZB I O µ A 1.4 V to 3.6 V 1.65 V to 5.5 V OE GND C i OE 1.2 V to 3.6 V 1.65 V to 5.5 V 2.5 pF A port C io 1.2 V to 3.6 V 1.65 V to 5.5 V pF B port (1) V CCI is the supply voltage associated with the input port. (2) V CCO is the supply voltage associated with the output port. T A V CCA 1.2 V V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V UNIT TYP TYP TYP TYP Data rate Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 1.5 V 0.1 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V 0.15 V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX Data rate Mbps t w Pulse duration Data inputs ns Submit Documentation Feedback Copyright 2007 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101

www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V 0.15 V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX Data rate Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V 0.2 V 0.3 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX Data rate 100 100 100 Mbps t w Pulse duration Data inputs ns over recommended operating free-air temperature range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V 0.3 V 0.5 V UNIT MIN MAX MIN MAX Data rate 100 100 Mbps t w Pulse duration Data inputs ns T A V CCA 1.2 V V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO PARAMETER UNIT (INPUT) (OUTPUT) TYP TYP TYP TYP A B 6.9 5.7 5.3 5.5 t pd ns B A 7.4 6.4 5.8 A t en OE µ s B A t dis OE ns B t rA t fA A-port rise and fall times 4.2 4.2 4.2 4.2 ns t rB t fB B-port rise and fall times 2.1 1.5 1.2 1.1 ns Max data rate Mbps Copyright 2007 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0101

www.ti.com over recommended operating free-air temperature range, V CCA 1.5 V 0.1 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.15 V 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX A B 1.4 12.9 1.2 10.1 1.1 0.8 9.9 t pd ns B A 0.9 14.2 0.7 0.4 11.7 0.3 13.7 A t en OE µ s B A 5.9 5.7 25.9 5.6 5.7 22.4 t dis OE ns B 5.4 30.3 4.9 22.8 4.8 4.9 19.5 t rA t fA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns t rB t fB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns Max data rate Mbps over recommended operating free-air temperature range, V CCA 1.8 V 0.15 V (unless otherwise noted) V CCB 1.8 V V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.15 V 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX A B 1.6 1.4 7.7 1.3 6.8 1.2 6.5 t pd ns B A 1.5 1.3 8.4 7.6 0.9 7.1 A t en OE µ s B A 5.9 5.1 21.3 19.3 17.4 t dis OE ns B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3 t rA t fA A-port rise and fall times 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns t rB t fB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns Max data rate Mbps Submit Documentation Feedback Copyright 2007 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101

www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 over recommended operating free-air temperature range, V CCA 2.5 V 0.2 V (unless otherwise noted) V CCB 2.5 V V CCB 3.3 V V CCB V FROM TO 0.2 V 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX A B 1.1 6.3 5.2 0.9 4.7 t pd ns B A 1.2 6.6 1.1 5.1 0.9 4.4 A t en OE µ s B A 5.1 21.3 4.6 15.2 4.6 13.2 t dis OE ns B 4.4 20.8 3.8 3.9 13.9 t rA t fA A-port rise and fall times 0.8 0.8 0.8 ns t rB t fB B-port rise and fall times 0.7 0.5 2.8 0.4 2.7 ns Max data rate 100 100 100 Mbps over recommended operating free-air temperature range, V CCA 3.3 V 0.3 V (unless otherwise noted) V CCB 3.3 V V CCB V FROM TO 0.3 V 0.5 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX A B 0.9 4.7 0.8 t pd ns B A 4.9 0.9 4.5 A t en OE µ s B A 4.6 15.2 4.3 12.1 t dis OE ns B 3.8 3.4 13.2 t rA t fA A-port rise and fall times 0.7 2.5 0.7 2.5 ns t rB t fB B-port rise and fall times 0.5 2.3 0.4 2.7 ns Max data rate 100 100 Mbps Copyright 2007 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0101

www.ti.com T A C V CCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V V CCB PARAMETER TEST CONDITIONS UNIT 3.3 V V 1.8 V 1.8 V 1.8 V 2.5 V V to V TYP TYP TYP TYP TYP TYP TYP A-port input, B-port output 7.8 C L f MHz, C pdA B-port input, A-port output t r t f ns, pF OE V CCA A-port input, B-port output 38.1 C pdB (outputs enabled) B-port input, A-port output 25.4 A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 C L f MHz, C pdA B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01 t r t f ns, pF OE GND A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.02 C pdB (outputs disabled) B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03 Submit Documentation Feedback Copyright 2007 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101

www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 The TXB0101 can be used in level-translation another. The TXB0101 architecture (see Figure does not require a direction-control signal to control the direction of data flow from A to B or from B to In a dc state, the output drivers of the TXB0101 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is Ω at V CCO 1.2 V to 1.8 Ω at V CCO 1.8 V to 3.3 and Ω at V CCO 3.3 V to Figure Architecture of TXB0101 I/O Cell Copyright 2007 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0101

A. V is the input threshold voltage of the TXB0101 (typically /2. T V V is the supply voltage of the external driver. CCI D –(V – V )/4 kD T Ω V /4 kT Ω VIN IIN Power Up Enable and Disable Pullup or Pulldown Resistors on I/O Lines TXB0101 SCES639A JANUARY 2007 REVISED NOVEMBER 2008 www.ti.com Typical I IN vs V IN characteristics of the TXB0101 are shown in Figure For proper operation, the device driving the data I/Os of the TXB0101 must have drive strength of at least mA. Figure Typical I IN vs V IN Curve During operation, ensure that V CCA V CCB at all times. During power-up sequencing, V CCA V CCB does not damage the device, so any power supply can be ramped up first. The TXB0101 has circuitry that disables all output ports when either V CC is switched off CCA/B V). The TXB0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time dis indicates the delay between when OE goes low and when the outputs are actually disabled (Hi-Z). The enable time en indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. The TXB0101 is designed to drive capacitive loads of up to pF. The output drivers of the TXB0101 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than k Ω to ensure that they do not contend with the output drivers of the TXB0101. For the same reason, the TXB0101 should not be used in I C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. Submit Documentation Feedback Copyright 2007 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0101

/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT 2 × VCCO Open 50 k/C0087 VCCI 0 V VCCI/2 V CCI/2 tw VOLT AGE W AVEFORMS PROPAGA TION DELA Y TIMES VOLT AGE W AVEFORMS PULSE DURA TION Input tPZL /tPLZ tPHZ /tPZH 2 × VCCO Open TEST S1 A. C L includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR/C011810 MHz, ZO = 50 W , dv/dt ≥/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr1 V/ns. C. The outputs are measured one at a time, with one transition per measurement. D. tPLH and tPHL are the same as tpd. E. V CCI is the VCC associated with the input port. F. VCCO is the VCC associated with the output port. G. All parameters and waveforms are not applicable to all devices. 50 k/C0087 From Output /charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZrUnder Test

1 M/C008715 pF 15 pF

LOAD CIRCUIT FOR MAX DA TA RA TE, PULSE DURA TION PROP AGATION DELA Y OUTPUT RISE AND F ALL TIME MEASUREMENT tPLH tPHL 0 V VCCO /2 VCCI/2 V CCI/2 0.9 /C0121 VCCO VCCO /2 tr 0.1 /C0121 VCCO tf VCCI Input Output VOH VOL TXB0101 www.ti.com SCES639A JANUARY 2007 REVISED NOVEMBER 2008 Figure Load Circuits and Voltage Waveforms Copyright 2007 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TXB0101

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TXB0101DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101DRLTG4 ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0101YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2008 Addendum-Page 1

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2008 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0101DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0 TXB0101DBVT SOT-23 DBV 6 250 202.0 201.0 28.0 TXB0101DCKR SC70 DCK 6 3000 195.0 200.0 45.0 TXB0101DCKT SC70 DCK 6 250 195.0 200.0 45.0 TXB0101DRLR SOT DRL 6 4000 202.0 201.0 28.0 TXB0101DRLT SOT DRL 6 250 202.0 201.0 28.0 TXB0101YZPR DSBGA YZP 6 3000 220.0 220.0 34.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 Pack Materials-Page 2

D: Max = E: Max = 918 µm, Min = 1418 µm, Min = 858 µm 1358 µm

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