TX810 TI | Alldatasheet
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HV TX LV□RX
1 Channel
www.ti.com SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 8-Channel,ProgrammableT/RSwitchforUltrasound Check forSamples: TX810 1FEATURES DESCRIPTION 2• Compact T/R Switch forUltrasound The TX810 providesan integratedsolutionfora wide range of ultrasoundapplications.Itisan 8 channel,• FlexibleProgrammability currentprogrammable,transmit/receiveswitchin a– 8 Bias CurrentSettings small6mm × 6mm package.– 8 Power/Performance Combinations The internaldiodeslimittheoutputvoltagewhen high– Easy Power-Up/Down control voltagetransmittersignalsare appliedto the input.
- FastWake Up Time WhiletheinsertionlossofTX810 isminimizedduring receivemode.• Dual Supply Operation
- OptimizedInsertionLoss UnlikeconventionalT/R switches,theTX810 contains a 3-bitinterfaceused to program biascurrentfrom 7mA to 0mA fordifferentperformanceand powerAPPLICATIONS requirements.When theTX810 biascurrentissetas• MedicalUltrasound 0mA (i.e.,high-impedancemode), the device is• IndustrialUltrasound configured as power-down mode. In the high-impedance mode, TX810 does not add additionalload to high-voltagetransmitters.In addition,the devicecan wake up from power-down mode in less than 1µs. With these advanced programmabilityfeatures,significantpower saving can be achievedinsystems. Figure1. Block Diagram ofTX810 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2PowerPAD isa trademarkofTexas Instruments. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2009–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ORDERING INFORMATION (1) TRANSPORT MEDIA, OPERATING TEMPERATUREPACKAGED DEVICES PACKAGE TYPE QUANTITY RANGE TX810IRHHT Tape and Reel,250 S-PVQFN-N36 0~70°C TX810IRHHR Tape and Reel,2500 (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) VALUE UNIT SupplyVoltage,VD -0.3~ +6 V SupplyVoltage,VP -0.3~ +6 V SupplyVoltage,VN -6~ +0.3 V SupplyVoltage,VB -0.3~ +6 V InputAC voltage,INn ±100 V InputatVsub -6~ +0.3 V Outputcurrent,IO 15 mA Maximum junctiontemperature,continuousoperation,longtermreliability(2)TJ 125°C Storagetemperaturerange,Tstg -55°C to150°C HBM 500 V ESD ratings CDM 750 V MM 200 V (1) Stressesabove thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings onlyand functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder“recommended operating conditions”isnotimpliedExposuretoabsolutemaximum ratedconditionsforextendedperiodsmay degradedevicereliability. (2) The absolutemaximum junctiontemperatureforcontinuousoperationislimitedby thepackage constraints.Operationabove this temperaturemay resultinreducedreliabilityand/orlifetimeofthedevice. THERMAL INFORMATION TX810 THERMAL METRIC (1) RHH UNITS(OLFM AirflowAssumed)
36 PINS
qJA Junction-to-ambientthermalresistance(2) 29.7 qJC(top) Junction-to-case(top)thermalresistance(3) 27 qJB Junction-to-boardthermalresistance(4) 7.2 °C/W yJT Junction-to-topcharacterizationparameter(5) 0.1 yJB Junction-to-boardcharacterizationparameter(6) 7.2 (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) The junction-to-ambientthermalresistanceundernaturalconvectionisobtainedina simulationon a JEDEC-standard,High-Kboard,as specifiedinJESD51-7,inan environmentdescribedinJESD51-2a. (3) The junction-to-case(top)thermalresistanceisobtainedby simulatinga coldplateteston thepackage top.No specificJEDEC-standard testexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. (4) The junction-to-boardthermalresistanceisobtainedby simulatinginan environmentwitha ringcoldplatefixturetocontrolthePCB temperature,as describedinJESD51-8. (5) The junction-to-topcharacterizationparameter,yJT,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingqJA,usinga proceduredescribedinJESD51-2a (sections6 and 7). (6) The junction-to-boardcharacterizationparameter,yJB estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingqJA ,usinga proceduredescribedinJESD51-2a (sections6 and 7).
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PowerP AD™ TX810 www.ti.com SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 DEVICE INFORMATION PIN FUNCTIONS PIN
DESCRIPTION
1,3,7,9,10,12,34, INn InputsforChanneln36 16,18,19,21,25,27, OUTn OutputsforChanneln28,30 33 VD LogicSupplyVoltage;+2.5V to+5 V;bypasstogroundwith0.1µF and 10 µF capacitors 31 VP PositiveSupplyVoltage;+5 V;bypasstogroundwith0.1µF and 10 µF capacitors 15 VN NegativeSupplyVoltage;–5 V;bypasstogroundwith0.1µF and 10 µF capacitors
13 VB Biasvoltage;connectto0 V (GND) for±5 V operation
2,8,11,14,17,20,26, GND Ground29,32,35
24 B1 Bit1;Currentprogrambit
23 B2 Bit2;Currentprogrambit
22 B3 Bit3;Currentprogrambit
4,5,6 NC No internalconnection. PowerPAD ™ ofthepackage.–5 V to0 V for±5 V operation.The thermalpad isneeded forthermal0 Vsub dissipation. PQFN (RHH) Package 6 × 6mm, 0.5mm Pitch (Top View) Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TX810
SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com
ELECTRICAL CHARACTERISTICS
AllSpecificationsatTA = 25°C, VP = 5V,VN = -5V,VB = 0V,Vsub= -5V,R LOAD = 400Ω;f= 5MHz, B3B2B1 = 111,VIN = 0.25VPP ,unlessotherwisenoted.TestLevel:A:Finaltesterlimits;B:bench evaluation/simulation;C: Simulation PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Test Level DC POWER SPECIFICATIONS PositiveSupplyVP 5 V B NegativeSupplyVN -5 Quiescentcurrent,VP, VN No Signal 50 µA A SubstrateVoltage,VSUB PowerPAD ™ VN 0 V B DigitalSupply,VD 2.5 5 V B Quiescentcurrent,VD No Signal 50 µA A Biascurrent,VP, VN path B3B2B1 = 001 1.25 1 0.75 mA/CH A Biascurrent,VP, VN path B3B2B1 = 111 5.95 7 8.05 mA/CH A Any output;B3B2B1 = 000;NoLeakage Current 0.5 µA AInput LOGIC INPUTS LogicHighInputVoltage;VIH 2 VD V A LogicHighInputCurrent;IIH 20 µA A LogicLow InputVoltage;VIL 0 0.4 V A LogicLow InputCurrent;IILInput 20 µA A Capacitance,C IN 5 pF C POWER DISSIPATION Allchannels Power-Down Dissipation B3B2B1 = 000;no signal 200 µW A B3B2B1 = 001;no signal 80 92 mW A TotalPower Dissipation B3B2B1 = 111;no signal 560 644 mW A AC SPECIFICATIONS 1 µs positiveand negativepulse appliedseperatelyat -90 90 V A InputAmplitude,VIN PRF = 10 kHz CW mode (continuouswave) -10 10 V B B3B2B1 = 111 -0.9 -1.8 dB A B3B2B1 = 100 -1.1 -1.8 dB A Insertionloss,IL B3B2B1 = 001 -1.3 -2 dB A B3B2B1 = 111,R LOAD = 50Ω -4.1 dB B B3B2B1 = 001,R LOAD = 50Ω -7 dB B ChanneltochannelIL matching B3B2B1 = 111 0.06 dB B InsertionLoss,IL B3B2B1 = 111,at20MHz -0.9 dB B B3B2B1 = 111,R LOAD = 50 Ω 30 Ω B B3B2B1 = 001,R LOAD = 50 Ω 62 Ω B EquivalentResistance,R ON B3B2B1 = 111 44 Ω B B3B2B1 = 001 67 Ω B B3B2B1 = 111 140 MHz B -3dB Bandwidth,BW B3B2B1 = 100 115 MHz B B3B2B1 = 001 65 MHz B B3B2B1 = 111,VIN = 0.5VPP -74 dBc B 5MHz B3B2B1 = 100,VIN = 0.5VPP -74 dBc B2nd HarmonicDistortion,HD2, 5MHz 5MHz B3B2B1 = 001,VIN = 0.5VPP -73 dBc B 5MHz
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www.ti.com SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 ELECTRICAL CHARACTERISTICS (continued) AllSpecificationsatTA = 25°C, VP = 5V,VN = -5V,VB = 0V,Vsub= -5V,R LOAD = 400Ω;f= 5MHz, B3B2B1 = 111,VIN = 0.25VPP ,unlessotherwisenoted.TestLevel:A:Finaltesterlimits;B:bench evaluation/simulation;C: Simulation PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Test Level B3B2B1 = 111,VIN = 0.5VPP -78 dBc B 10MHz B3B2B1 = 100,VIN = 0.5VPP -77 dBc B2nd HarmonicDistortion,HD2, 10MHz 10MHz B3B2B1 = 001,VIN = 0.5VPP -74 dBc B 10MHz B3B2B1 = 111 at10MHz -70 dBc B Cross-talk,Xtalk B3B2B1 = 100 at10MHz -69 dBc B B3B2B1 = 001 at10MHz -61 dBc B B3B2B1 = 111 -68 dBc B 3rdorderIntermodulation,IMD3 (1) B3B2B1 = 100 -65 dBc B B3B2B1 = 001 -50 dBc B B3B2B1 = 111 -76 dBc B Power SupplyModulationRatio,PSMR (2) B3B2B1 = 100 -76 dBc B B3B2B1 = 001 -76 dBc B Power SupplyRejectionRatio,PSRR B3B2B1 = 111,1KHz and 1MHz -64 dBc B B3B2B1 = 111 0.91 nV/rtHz B InputReferredNoise,IRN B3B2B1 = 100 1.05 nV/rtHz B B3B2B1 = 001 1.12 nV/rtHz B B3B2B1 = 111 1 µs B RecoveryTime 140 VPP IN,VOUT < 20mV PP B3B2B1 = 100 0.5 µs B B3B2B1 = 001 0.3 µs B B3B2B1 = 000→111 0.6 µs B Turn-onDelayTime (3),tEN_ON B3B2B1 = 000→100 0.5 µs B B3B2B1 = 000→001 0.5 µs B B3B2B1 = 111→000 2.4 µs B Turn-offDelayTime (3),tEN_OFF B3B2B1 = 100→000 2.7 µs B B3B2B1 = 001→000 2.2 µs B BiasCurrentSwitchingTime B3B2B1 = 001→111 0.7 µs B B3B2B1 = 111 1.3 ns B PropagationDelayTime (3),tDELAY B3B2B1 = 100 1.6 ns B B3B2B1 = 001 1.7 ns B B3B2B1 = 111 1.9 VPP B Clamp Voltage,excludesovershoot B3B2B1 = 001 1.7 VPP B B3B2B1 = 000 1.4 VPP B (1) 5MHz 1VPP ,and 5.01MHz 0.5VPP input. (2) PSMR isdefinedas theratiobetween carrier5MHz and sideband signalswith1KHz and 1MHz 50mV PP Noiseappliedon supplypins. (3) See thetimingdiagramshow inFigure2. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TX810
tEN_ON tEN_OFF tDELAY INPUT B3/B2/B1 OUTPUT VN VP t − Time − s/c109 1.5 0.5 Output Amplitude − V -0.5 1 2.5 30.5-0.5 1.5 2 -1.5 Input Amplitude − V -20 -100 -60 -80 Bias = 7 mA -40 100 Output Input Insertion Loss − dB 400 350 Unit Amount 100 -0.94 200 300 150 250
1890 Units,
Bias = 7 mA, R = N/AIN TX810 SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com Figure2. Timing Diagram TYPICAL CHARACTERISTICS AllSpecificationsatTA = 25°C, VP = 5V,VN = -5V,VB = 0V,VSUB = -5V,R IN = 75Ω,R LOAD = 400Ω; f= 5MHz, B3B2B1=111, VIN = 0.25VPP ,unlessotherwisenoted. A typicalbench setupisshown inFigure3. Figure3.TypicalTestSetup AC couplingisused between Highvoltagepulserand TX810. The inputsignalisa combinationof0.25Vppsignalfollowedby a 1-cycle 140Vpp pulse Figure4.InsertionLoss Distribution Figure5.Recovery Time With Small InputSignal
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Bias□Current − mA -60 -62 Crosstalk − dBc -74 2 71 63 4 5 -70 -64 10MHz 5MHz -72 -68 -66 t − Time − s/c109 Output Amplitude − V 10 25 305-5 15 20 -0.04 0.04 Input Amplitude − V -20 -100 -60 -80 -40 100 Output Input -0.03 -0.05 -0.02 -0.01 0.03 0.02 0.01 0.05 Bias = 7 mA, R = 50LOAD /c87 Bias Current − mA -60 -62 2nd Harmonic Distortion − dBc -74 2 6 71 3 4 5 -80 -78 -70 -64 10MHz 5MHz V = 500 mVIN PP -76 -72 -68 -66 Bias Current − mA 1.4 1.2 Input Referred Noise − nV/ Hz 0.4 2 6 71 3 4 5 0.2 10MHz 5MHz 1MHz 0.6 0.8 t − Time − s/c109 0.3 0.1 Trigger Amplitude − V -0.1 1 7 830 62 4 5 -0.3 -0.2 Trigger TX810 Output 0.2 Amplitude − V t − Time − s/c109 0.3 0.1 Trigger Amplitude − V -0.1 0.5 3.5 41.50 31 2 2.5 -0.3 -0.2 Trigger TX810 Output 0.2 Output Amplitude − V TX810 www.ti.com SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 TYPICAL CHARACTERISTICS (continued) AllSpecificationsatTA = 25°C, VP = 5V,VN = -5V,VB = 0V,VSUB = -5V,R IN = 75Ω,R LOAD = 400Ω; f= 5MHz, B3B2B1=111, VIN = 0.25VPP ,unlessotherwisenoted. AC couplingisused between Highvoltagepulserand TX810. The inputsignalisa 1-cycle140Vpp pulse Figure6.Recovery Time WithoutSignal Figure7.Cross-talkvs.Bias Currentsvs.Frequency Figure10.Power On Response Time (0mA to7mA) Figure11.Power Down Response Time (7mA to0mA) Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TX810
t − Time − s/c109 0.2 0.1 -0.15 -0.5 Amplitude − V -0.1 0.5 3.5 41.50 31 2 2.5 -0.3 -0.25 -0.2 0.15 0.05 TX810□Output Trigger TX810 SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) AllSpecificationsatTA = 25°C, VP = 5V,VN = -5V,VB = 0V,VSUB = -5V,R IN = 75Ω,R LOAD = 400Ω; f= 5MHz, B3B2B1=111, VIN = 0.25VPP ,unlessotherwisenoted. Figure12.Bias CurrentAdjustment Response Time (1mA to7mA)
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www.ti.com SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 THEORY OF OPERATION A typicalultrasoundblockdiagramisshown inFigure13. Figure13. UltrasoundSystem Block Diagram A transducerisexcitedby highvoltagepulsers.Itconvertstheelectricalenergytomechanicalenergy.Aftereach excitation,the transducersends out ultrasonicwave to medium. Partialultrasonicwave gets reflectedby inhomogeneous medium and receivedby thetransduceragain,i.e.echo signal.Thus,thetransducerisa duplex deviceon which both high voltageand low voltagesignalsexist.The transducercan not be connectedto amplifierstagesdirectly;otherwise,thehighvoltagesignalcan permanentlydestroyamplifiers.The TX810, i.e. T/R switches,issittingbetween integratedHV pulserand low noiseamplifier(LNA).The main functionofTX810 isto isolatethe LNA from high-voltagetransmitter.TX810 limitsthe highvoltagepulseand letecho signals reachingamplifier.Therefore,an idealT/R switchshouldcompletelyblockhighvoltagesignalsand maintainall informationfromechoes. The detailarchitectureoftheTX810 islistedinFigure14. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TX810
D0~D6 is determined by B1~B3 pins L RLOAD TX810 SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com Figure14. TX810 Block Diagram TX810 includesfourparts:Diode Bridge,biasnetwork,clamp diodes,and logiccontroller.A decoderisused to convert3-bitlogic(B1 toB3) inputto7 controlsignals(D0 toD6) for7 MOSFET switches.+2.5V to+5V logic inputis levelshiftedinternallyto drivethe switches.The bias currentof the bridgediode is adjusted proportionallyby theseswitches.When allswitchesare on, the biascurrentis7mA. Each bitdifferencewill adjustthebiascurrentapproximately1mA. When allswitchesareoff,theTX810 entersthepower down mode. Comparing to discreteT/R switches,TX810 can be shutdown and turnedon quicklyas shown inthe typical characteristicsplots.Consideringthe low duty cycleof ultrasoundimaging,significantpower savingcan be achieved. All6 diodesare high-voltageSchottkydiodesto achievefastrecoverytime.Followingthe bridge,a pairof back-to-backdiodelimitstheoutputvoltageofTX810 toabout2Vpp. Differentpower/performancecombination can be selectedby users.The TX810 isspecifiedtooperateat±5V and VB isbiasedat0V. The characteristics of the T/R switchare mainlydeterminedby biascurrents.Lower power can be achievedwithlowersupply voltages.Also, Table 1 shows the relationshipamong bias current,insertionloss,inputnoise,power consumptionand equivalentresistance. Table1.Bias currentvs Performance TestConditions:VP = 5V,VN = -5V;VB = 0V; R LOAD = 50Ω B3 B2 B1 I(mA) IL (dB) IRN (nV/rtHz) R ON (Ω) Power (mW/CH) 0 0 0 0 N/A N/A HighImpedance 0 0 0 1 1 -7 1.12 62 10 0 1 0 2 -5.6 1.10 45 20 0 1 1 3 -5 1.09 39 30 1 0 0 4 -4.6 1.05 35 40 1 0 1 5 -4.4 0.99 33 50 1 1 0 6 -4.2 0.95 31 60 1 1 1 7 -4.1 0.91 30 70
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APPLICATION INFORMATION
Similarto discreteT/R switchsolutions,externalcomponents can be used to optimizesystem performance. InductorL and resistorR LOAD beforethe low voltagereceiveramplifier(LVRx) can improveoverloadrecovery timeand reducereflection.The L actsas a highpass filterthusovershootor recoveryresponsespikescan be suppressedto minimal.The L and R LOAD terminatethe entiresignalpath and can reduce reflection;therefore axialresolutioninultrasoundimage mightbe improved.However,thecombined impedance ofL and R LOAD may affectthesystem sensitivity.The insertionlossofT/R switchisdeterminedby theinputimpedance ofreceiver amplifierand R ON oftheTX810. L alsocreatesa DC pathforany offsetcaused by mismatching.Theinductorcan be as lowas 10s µH tosuppresslowfrequencysignalsfromtransmitter,transducer,multiplexer,and TX810. The optimizationofL and R LOAD isalwaysan importanttopicforsystem designers.AC couplingare typicallyused between transmitterand T/R switchor T/R switchand amplifier.Thus amplifierswithDC biasedinputswillnot interferencewithT/R switch. One challengeforintegratingmultiplechannel circuitson a smallpackage is how to reduce crosstalk.In ultrasoundsystems,acousticcrosstalkfromadjacenttransducerelementsisa dominantsource.The crosstalk fromtransducerelementsisina rangeof-30to-35dBc forarraytransducers.Circuitcrosstalkisusuallyatleast 20dB betterthanthetransducercrosstalk.The specialconsiderationswere implementedinbothTX810 design and layout.The crosstalkamong TX810 channelsisreduced to below -60 dBc as show inthe specification table. In ultrasoundDoppler applications,modulationeffectin system can influenceimage qualityand sensitivity. Ultrasoundsystem isa complex mixed-signalsystem withallkindsofdigitaland analogcircuits.Digitalsignals and clocksignalscan contaminateanalogsignalson system leveloron chiplevel.Nonlinearcomponents,such as transistorsand diodes,can modulatenoiseand contaminatesignals.In Dopplerapplications,the Doppler signalfrequencycouldrange from 20Hz to>50KHz. Meanwhile,multiplesystem clocksare alsointhisrange, such as frameclock,image lineclock,and etc.These noisesignalscouldenterchipthroughgroundand power supplypins.Itisimportanttostudythepower supplymodulationratio(PSMR) atchiplevel.Noise signalwith certainfrequencyand amplitudecan be appliedon supplypins.Sideband signalscouldbe foundifmodulation effectexists.The PSMR isexpressedas an amplituderatiobetween carrierand sideband signals.Beside PSMR, 3rd orderintermodulationratio(IMD3) isa standardspecificationformixed-signalICs.Users can use IMD3 toestimatethepotentialartifactDopplermirrorsignals.Bothspecscan be foundinthespecificationtable. The schematicofthebasicconnectionforTX810 isshown inFigure15.Optionalinductorsand resistorscan be used at TX810 outputsdepending on transducercharacteristicsas discussedabove. Standard decoupling capacitors0.1µF shouldbe placedclosetopower supplypins.The pinoutofTX810 isoptimizedforPCB layout. Allsignalsaregoingfromlefttorightstraightly. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TX810
3.3V Optional TX CH7 TX CH8 TX CH6 TX CH5 TX CH4 TX CH3 TX CH2 TX CH1 RX CH7 RX CH8 RX CH6 RX CH5 RX CH4 RX CH3 RX CH2 RX CH1 TX810 PowerPAD Vsub (-5V) 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 20K×3 Pull Down Optional Optional Optional Optional Optional Optional Optional TX810 SLLS996A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com Figure15. Schematic ofTX810 SPACER
REVISION HISTORY
Changes from Original(September 2009)toRevisionA Page
- Changed From:ProductPreviewTo:Production.The ProductPreviewwas a two page datasheetcontainingthe
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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TX810IRHHT Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 TX810 TX810IRHHT.A Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 TX810 TX810IRHHTG4 Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 TX810 TX810IRHHTG4.A Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR 0 to 70 TX810 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRHH 36 PLASTIC QUAD FLATPACK - NO LEAD6 x 6, 0.5 mm pitch 4225440/A
www.ti.com PACKAGE OUTLINE 6.1 5.9 6.1 5.9 1.0 0.80.05 0.00 2X 4 32X 0.5 2X 4 36X 0.65 0.45 36X 0.30 0.18 4.1 0.1 (0.2) TYP VQFN - 1 mm max heightRHH0036B PLASTIC QUAD FLATPACK - NO LEAD 4225414/A 10/2019 0.08 C
0.1 C A B
0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 10 18 2836 SCALE 2.300 AB C
www.ti.com EXAMPLE BOARD LAYOUT 32X (0.5) (R0.05) TYP
0.07 MAX
0.07 MIN
36X (0.75) 36X (0.24) (5.65) (5.65) ( 4.1) ( 0.2) TYP VIA (0.68) TYP (1.8) TYP (0.68) TYP (1.8) TYP VQFN - 1 mm max heightRHH0036B PLASTIC QUAD FLATPACK - NO LEAD 4225414/A 10/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SEE SOLDER MASK DETAIL 10 18 2836 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN 36X (0.75) 36X (0.24) 32X (0.5) (5.65) (5.65) 9X ( 1.16) (R0.05) TYP (1.36) TYP (1.36) TYP VQFN - 1 mm max heightRHH0036B PLASTIC QUAD FLATPACK - NO LEAD 4225414/A 10/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 15X EXPOSED PAD 37 72% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 10 18 2836
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