TX7516 TI | Alldatasheet
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Technical content
TX7516 Five-Level, 16-Channel Transmitter with T/R Switch, and On-Chip Beamformer
1 Features
- Transmitter supports: – 16-channel 5-level pulser and active transmit/ receive (T/R) switch
- 5-level pulser: – Maximum output voltage: ±100 V – Minimum output voltage: ±1 V – Maximum output current: 2 A – Support 4A output current mode. – True return to zero to discharge output to ground – Second harmonic of –45 dBc at 5 MHz – –3-dB Bandwidth with 1-kΩ || 240-pF load
- 20 MHz for a ±100-V supply
- 25 MHz for a ±70-V supply
- 35 MHz for a ±100-V supply in 4A mode – Integrated jitter: 100 fs measured from 100 Hz to 20 kHz – CW mode close-in phase noise: –154 dBc/Hz at 1 kHz offset for 5-MHz signal – Very low receive power: 1mW/ch
- Active transmit/receive (T/R) switch with: – Turnon resistance of 8 Ω – Turnon and Turnoff time: 100 ns – Transient glitch: 10 mVPP
- On-chip beam former with: – Channel based T/R switch on and off controls – Delay resolution: half beamformer clock period, minimum 2 ns – Maximum delay: 214 beamformer clock period – Maximum beamformer clock speed: 320 MHz – Per channel pattern control with 2K distinct level. – Global and local repeat pattern, enabling long duration patterns for Shear Wave imaging – Supports 120 delay profiles
- High-speed (400 MHz maximum), 2-lane LVDS serial programming interface. – Low programming time: < 500 ns for delay profile update – 32-bit Checksum feature to detect wrong SPI writes
- Supports CMOS serial programming interface (50 MHz maximum)
- Internal temperature sensor and automatic thermal shutdown
- No specific power sequencing requirement
- Error flag register to detect faulty conditions
- Integrated passives for the floating supplies and bias voltages
- Small package: FC-BGA-144 (10 mm × 10 mm) with 0.8-mm pitch
2 Applications
- Ultrasound imaging system
- Piezoelectric driver
- In-probe ultrasound imaging
3 Description
TX7516 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits, 16 transmit/ receive switches (referred as T/R or TR switches), and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. TX7516 has a pulser circuit that generates five-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 16 outputs. The maximum output current is 2 A. Device can be used as a transmitter solution for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) TX7516 FC-BGA (144) 10.0 mm × 10.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. OUT_1 RX_1 Thermal Shutdown High Speed SPI Interface with Error Detection Pattern Profile Delay Profile Floating Supply A Pulser A- and B-Group Pulser Temperature Sensor On-chip Transmit Beamforming B Pulser OUT_16 RX_16 A Pulser T/R Switch B Pulser T/R Switch Integrated Passives Error Flag Register Simplified Block Diagram TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
7 Mechanical, Packaging, and Orderable Information....4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (June 2021) to Revision A (March 2022) Page TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 www.ti.com
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5 Description (continued)
TX7516 (referred as device in this data sheet) is highly integrated transmitter solution targeted for exciting ultrasound transducers. Device integrates 16 pulsers and 16 T/R switches, on-chip beamformer, and pattern generator. Pulser circuit generates five-level high voltage pulses (up to ±100 V) with maximum output current of 2A. When pulser transmits the high voltage pulses, T/R switch turns OFF and protects the low voltage receiver circuit from damage. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is controlled by on-chip beamforming engine in the device. The T/R switch offers 8-Ω impedance in the ON state. Ultrasound transmission relies on excitation of multiple transducer elements, with different delay values defining the direction of the transmission. Such an operation is referred to as transmit beamforming. TX7516 supports staggered pulsing of the different channels, allowing for transmit beamforming. In the on-chip beamformer mode, delay profile for pulsing of different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 214 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Each channel has its own RAM, which is 960 words long. The patterns have global and local repeats feature. This capability can be used to generate long patterns and can be used in Shear-Wave imaging. These pattern profiles and delay profiles are written using a high speed (400 MHz) serial peripheral interface. The high-speed writes could be prone to errors. Hence, the device has a checksum feature to detect errors in SPI writes. To protect the device from getting damaged because of improper configuration, an internal error flag register can detect faulty condition and configure the device in shutdown mode automatically. The device integrates all the decoupling capacitors required for the floating supplies and internal bias voltages. This significantly reduces the required number of external capacitors. TX7516 is available in a 10-mm × 10-mm 144-pin FC-BGA package (ALH package) and is specified for operation from 0°C to 70°C. www.ti.com TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TX7516
6 Device and Documentation Support
6.1 Document Support
Table 6-1. Terms Commonly Used in the Data Sheet Abbreviation Comment PRT Pulse Repetition Time. Represent TR_BF_SYNC period PRF Pulse Repetition Frequency. Represent TR_BF_SYNC frequency Receive Mode Duration in which T/R switch of all the channels are in ON state High voltage supplies AVDDP_HV_A, AVDDP_HV_B, AVDDM_HV_A, and AVDDM_HV_B are collectively referred as high voltage supplies High voltage supplies AVDDP_5, AVDDM_5, and AVDDP_1P8 supplies are collectively referred as low voltage supplies A-side supplies AVDDP_HV_A and AVDDM_HV_A is referred as A-side supplies B-side supplies AVDDP_HV_A and AVDDM_HV_A is referred as B-side supplies SPI Serial program interface
6.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
6.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
6.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this datasheet, refer to the left-hand navigation. TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 www.ti.com
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7.1 Mechanical Data
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SLOSE40A – JUNE 2021 – REVISED MARCH 2022 www.ti.com
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Product Folder Links: TX7516
www.ti.com TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TX7516
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TX7516ALH Active Production FCCSP (ALH) | 144 240 | JEDEC TRAY (5+1) Yes Call TI | Snagcu Level-3-260C-168 HR 0 to 70 TX7516 TX7516ALH.B Active Production FCCSP (ALH) | 144 240 | JEDEC TRAY (5+1) Yes Call TI Level-3-260C-168 HR 0 to 70 TX7516 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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