TX0928DA6532 TAI-SAW | Alldatasheet
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TAI-SAW TECHNOLOGY CO., LTD. FR-71S03-01 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886 -3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com Product Specifications Approval Sheet Product Description: SMD 3.2x2.5 32.768KHz TCXO TST Part No.: TX0928DA6532 Customer Part No.: Checked by: Hao Yu Liao Approved by: Yifan Chen Date: 08/27/2024 1. Customer signed back is required before TST can proceed with sample build and receive orders. 2. Orders received without customer signed back will be regarded as agreement on the specifications. 3. Any specifications changes must be approved upon by both parties and a new revision of specifications shall be released to reflect the changes. Customer signature required Company: Division: Approved by : Date:
TAI-SAW TECHNOLOGY CO., LTD. 2 TAI-SAW TECHNOLOGY CO., LTD. SMD 3.2x2.5 32.768KHz TCXO MODEL NO.: TX0928DA6532 REV. NO.: 1 Revise: N/A Initial release 08/27/24’ N/A Hao Yu Liao
TAI-SAW TECHNOLOGY CO., LTD. 3 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886 -3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com SMD 3.2x2.5 32.768KHz TCXO MODEL NO.: TX0928DA6532 REV. NO.: 1 Features: Miniature SMD Package Moisture Sensitive Level (MSL): Level 2 Description and Applications: Surface mount 3.2mmx2.5mmm TCXO Electrical Specifications: TX0928DA6532 Specifications Nominal Frequency, Fo 32.768 KHz Storage Temperature Range -40C to +105C Operating Temperature Range -40C to +105C Power Supply Voltage, Vdd 2.5V +/- 5% Output Waveform CMOS Square Wave Output Load 15pF “0” Level “1” Level 0.4V max IOL=0.1mA Vdd-0.4V min IOH=-0.1mA Power Supply Current, Icc 1uA typical 2uA max without load Initial Frequency Tolerance +/- 3.0 ppm max @ 25C +/- 3C Duty Cycle 40% ~ 60% Typical Rise Time ( 20% -> 80% of final RF level in Vp-p ) Fall Time ( 80% -> 20% of final RF level in Vp-p ) 100 nsec max. 100 nsec max. Frequency Stability a. Vs. Temperature (-40~105C) b. Vs. Supply Voltage Delta Freq/V +/- 8.0 ppm reference to 25C +/- 1 ppm/V Start –Up Time 1 s max @ 25C, 3 s max over-40C to +105C Aging +/-3 ppm per years Tri-State Enable Voltage (High) Disable Voltage (Low) output Tri-state 80% Vdd min or open 20% Vdd max RoHS Compliant Lead free Lead-free soldering
TAI-SAW TECHNOLOGY CO., LTD. 4 Mechanical Dimensions (mm): Marking: Line 1: 32 + TST Logo + Product Code + Date Code + Traceability code (1 or 2 letters) Product Code Table Year 2021 2025 2029 2022 2026 2030 2023 2027 2031 2024 2028 2032 Product Code X x X x Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 A B C D E F G H I J K L M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v w x y z
TAI-SAW TECHNOLOGY CO., LTD. 5 Recommended Circuit Packing (mm): 1. Reel Dimension A B C D E F H G T2 T1 T3 2. Tape Dimension Unit: mm A0 B0 W F E P0 P1 P2 D1 D K0 t
TAI-SAW TECHNOLOGY CO., LTD. 6 Reflow Profile: 100 150 200 250 300 0 60 120 180 240 300 360 Time (seconds) Temperature (deg C) Rising Area Preheat Area Reflow Area Forced Cooling Area Max peak temperature: 260 deg C
TAI-SAW TECHNOLOGY CO., LTD. 7 Notes of the Usage: 1. Touch the solder iron at 260+/ -5 deg C onto the leads for 10+/ -2 sec max or touch the solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec. 2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering terminals, also make some cracks on the soldering termin ation. Some cracks will cause open or short circuit and cause of thermal increasing or smoking. Don’t make any excess mechanical stress to soldering points. 3. In case of giving a heavy shock to the products, it may make an open or short circuit and cause of thermal increasing and smoking. To avoid heavy shock impact applying to products is strictly required. 4. Ultrasonic cleaning should be avoided to prevent damage to the TCXO. 5. Do Not Use Ultrasonic -Wave Soldering or Wave Solder with Package Immersed in Solder. Notes of the Storage: 1. To keep products under the condition at the room temperature ( -5~35 deg C) with normal humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of characteristics and a short circuit. 2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas will make a cause of the open or short circuit. Keep it in the clean place where is not in dusty and no corrosive gas. 3. Use the anti-static material to the storage package. 4. Don’t put any excess weight to the TCXO in the storage process. 5. Don’t move the product from the cold place to the hot place in the short time, otherwise it may make some dew-drop, then a short circuit may happen in case. 6. Storage periods should be maximum 6 months unde r condition of above item 1 after delivery from TST factory. 7. Once open the bag, there is possibility of electrical characteristics deterioration due to absorption of moisture. So, please use parts within 7 days after opening the bag. 8. If you have to keep parts without using after opening the bag, please put the drying agent in the bag, fold the bag and keep it in the place where temperature and humidity are controlled (nitrogen atmosphere box etc.)
TAI-SAW TECHNOLOGY CO., LTD. 8 Reliability Specifications Reference standard resistance to Temp./ Duration : 260°C /10sec ×2 times EIAJED-4701 Soldering heat Total time : 4min.(IR-reflow) (IR reflow) -300(301)M(II) Vibration Total peak amplitude : 1.5mm MIL-STD 202F Vibration frequency : 10 to 55 Hz method 201A Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. Mechanical directions : 3 impacts per axis MIL-STD 202F Shock Acceleration : 3000g's, +20/-0 % method 213C Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solderability Solder Temperature:265±5°C MIL-STD 883G Duration time: 5±0.5 seconds. method 2003 Thermal Shock Heat cycle conditions MIL-STD 883G -55 ℃ (30min) ←→ 125 ℃ (30min) method 1010.7 * cycle time : 10 times Humidity test Temperature : 70 ± 2 °C MIL-STD 202F Relative humidity : 90~95% method 103B Duration : 96 hours Dry heat Temperature : 125 ± 2 °C MIL-STD 883G ( Aging test ) Duration : 168 hours method 1008.2 condition C PCT test Pressure: 2.06kg/cm2 (2.03*105 pa) EIAJED-4701-3 Temperature : 121 ± 2 °C B-123A Relative humidity : 100% Duration : 24 hours Environmental characteristics Mechanical characteristics Test name Test process / method